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The content of this course includes: fundamentals of logic algebra analysis and design of the combinational logic circuit and sequence circuit common applications of the combinational logic circuit and sequence circuit programmable logic devices Hardware Design Description Language A/D (Analog/Digital) and D/A conversion.

课程的主要内容有:逻辑代数基础、组合逻辑电路及时序电路分析与设计、常用中规模组合逻辑及时序逻辑电路应用、可编程逻辑器件、硬件设计描述语言VHDL、数模、模数转换等。

After some people have designed the hardware circuit, then I understand the function, structure and operating principle of circuit, and finally I program using assemble language to come true the function of circuit.

我在设计中做的主要是软件编程,即在别人已经把硬件电路设计出来的基础上,了解电路的功能、结构及工作原理,用汇编语言编制程序来实现电路的功能,同时也解决硬件电路难以实现或实现起来电路会复杂、成本高的问题。

First introduction whole wave commutate electric circuit of work principle, immediately after introduction the electric capacity filter the function characteristics of an electric circuit, and in the electric circuit adoption exaltation stability, exaltation temperature stability and limit flow a type over flow protection electric circuit of concrete measure with insure an electric circuit safety stability of work.

首先介绍了全波整流电路的工作原理,接着介绍了电容滤波电路的性能特点,然后引入了具有放大环节和辅助电源的串联可调式稳压电源,并在电路中采用了提高稳定度,提高温度稳定性及限流型过流保护电路的具体措施,以确保电路安全稳定的工作。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Mainly by the counter circuit, decoding circuit, trigger circuit, display circuit and judder switch circuit and other components.

电路主要由计数器、译码电路、触发电路、显示电路及防抖动开关电路等组成。

This course will cover: fundamental electrical circuit quantities, and circuit elements; circuits laws (Ohm law and Kirchhoff voltage and current laws); series and parallel connections of circuit elements; operational amplifiers; network theorems; nodal and mesh analysis methods; analysis of natural, step response, and response to sinusoidal input of first and second order circuits; phasor analysis; introduction to computer emulation to electrical circuit.

中文简介:本课程将覆盖以下内容:电子电路的基本原理,电路元件,基本电路定律(欧姆定律,基尔霍夫电压定律和基尔霍夫电流定律);电子元器件的的串连和并联;运算放大器;网络理论;节点分析法和网孔分析法;一阶电路和二阶电路的普通信号,阶跃信号及单音信号的响应特性的分析;矢量分析法;并介绍计算机电路仿真的相关知识。

On the design of algorithms, a novel exact hierarchical delay analysis method for general circuits is proposed; based on the sensitization theorem for sequential circuits, an exact minimizing clocking method is proposed; based on Boolean process, a waveform simulation method considering interconnecting delay for logic circuit and a parallel waveform simulation method are proposed; a new method that transforms bit-level waveform polynomial to word-level polynomial model is proposed; a multiple valued synthesis algorithm based on multiple valued Boolean process and a wire-centered delay synthesis policy are proposed, in which timing planning, floorplanning, wire planning and optimal clock skew in early design are considered; a two-layers channel routing method for minimizing crosstalk under grid mode is proposed; based on the transition numbers theorems for waveform polynomial, a new method for generation of test with noise effects is proposed.

算法设计方面,提出了一种精确的通用电路层次化延时分析方法;基于时序电路的敏化定理提出时序电路最小时钟周期精确确定方法;提出基于Boolean过程论的考虑互连延迟的逻辑电路波形模拟方法,在分析了波形模拟适合并行化基础上,进一步提出一种并行波形模拟算法;提出一种将位级电路波形多项式描述转化成字级多项式描述的新方法;提出一种基于多值Boolean过程的多值电路综合算法以及一种将前期设计定时规划、前期设计的布局规划和线网结构化方法及低偏移的时钟分配等技术相结合的面向互连延时的综合策略;提出一种串绕最小化的网格模式下的双层通道布线方法;从波形多项式描述跳变数的定理出发提出了一种考虑噪声效应的测试生成新方法。

It's helpful in SPAD device optimized design and its subsequent electronic circuits and applications.

该电路模型可以直接应用于后续信号读出电路及前置放大电路系统的仿真设计,调节电路参数,优化电路性能,从而节省后续电路设计与制作的时间。

The control system includes the 8031 single chip microprocessor and Circuits of restituting position,circuits of exportation and importation, Circuits of translation code, transmission and induction system of temperature, the interface of coefficient, circuits of showing, stashing equipment and circuits of interface. The temperature is the controlled variable and a closed loop system is constructed.

该系统由8031单片机及其复位电路,晶振电路,总线收发电路,译码电路,温度传感器与系数接口,显示电路,存储器及接口电路组成控制器,以温度为被控制量的闭环控制系统,适用于大功率的电阻锅炉。

The hardware design project and principle are presented in detail, including the sensor and the single-chip microcomputer select, the signal processing circuit, the real-time clock circuit, the alarm circuit, the wireless receiving and transmitting circuit, the extension of FLASH memorizer, the key-board circuit and USB interface circuit, etc. As the counterpart, the software function modules are presented as well, including the main program of transmitter and receiver, the data acquisition and processing module, the display function module, the key function module, the three-level alarm on fault parameters module, the fault parameters memorizing and inquiring module and the wireless transmitting and receiving module, etc.

论文详细介绍了系统的硬件设计方案及其工作原理,包括传感器的选择、单片机的选择、信号调理电路、实时时钟电路、报警电路、FLASH存储器、无线发射与接收电路、键盘电路和USB接口电路等;同时详细介绍了软件设计方案及具体实现方法,包括发射机主程序、接收机主程序、数据采集与处理模块、键盘处理模块、故障数据存储与查询模块、显示功能模块、报警模块、无线发射与接收模块等。

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