印刷电路

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

In this paper,a novel wire feeding system composed of special motor driver circuit with high frequency and print motor with low inertia was designed,and the performance test were carried out.

采用特制的高频可逆调速电机驱动电路配合低惯量的印刷电机，研制了一种适用于GMAW焊接电源的新型可逆调速送丝系统。

Used in the electric circuit of heater, power supplier and soft PC B.

更应用在电热器的电路、电源器及软性印刷电路板的电路上。

Used in the electric circuit of heater, power supplier and soft PCB.

更应用在电热器的电路、电源供应器及软性印刷电路板的电路上。

The linear position sensors use emitter and receiver coil systems, precisely arranged on a printed circuit board, that are activated with a high frequency AC field and produce an inductive RLC circuit with the positioning element.

该线型位置传感器使用发射器和接收器线圈系统，精确地排列在一个印刷电路板上，它被一个高频交流电领域所激活，产生一个感应的RLC电路和定位元素。

IS only 15 minutes driving distance to Guangzhou city center and has the very convenient traffic,which is a professional company mainly researching,developing and manufacturing digital mechatronics,various full-automatic special printing machines,and full-automatic industrial control panel machine ,all of which are applied to the operations:mechanical printing,gumming,laminating,die-cutting and other once moldings of PVC,PET,PC,OPP,Tetoron,reel paperboard,self-adhesive label paper,film,leatheroid,aluminum foil,flexible circuit film and other reelmaterials of home appliances,toys,clothing,footwear,leather,electronice,electrical appliances,gifts,stationery and sports,goods,nameplates,industrial labels,business label and other industries.

是一家主要研发制造数码机电一体化及各类型全自动特种印刷机械、全自动工控面板机械的专业公司；适用于家电、玩具、服装、鞋业、皮革、电子、电器、礼品、文体用品、铭牌、工业标签、商业标签等行业PVC、PET、PC、OPP、特多龙、卷筒卡纸、自粘商标纸、薄膜、人造革、铝箔、铜箔、软性电路胶片等各种卷筒材料的作业：机械印刷、背胶、复膜、模切等一次成型。

II. Application scope: The imprinting, back film, duplicate film and mould cutting for Polyester PVC, PET, PC,OPP,Tedolong, various roll paperboard, various brand name sticker, various brand paper of self-stick, cold and hot transfer film, film, cloth strip, ribbon, leatheroid, aluminum film, copper film, soft circuit film and various roll material.

二、 适用范围：聚脂PVC、PET、PC、OPP、特多龙、各种卷筒卡纸、各种自粘商标纸、冷/热转印纸、冷/热转印膜、薄膜、布带、丝带、人造革、铝膜、铜膜、软性电路胶片等各种卷筒材料的印刷、背胶、腹膜、模切等。

As flux used in light metal processing for metal surface treatment; as component in the production of aluminum-titanium-boron alloys and for the fabrication of grinding wheel and abrasive disc to reduce operating temperature; as flux used in welding; as fire retardent for cotton and artificial fibre; rodent for the removal of exposed lead in printed circuit board; chemical analytical reagent in electrochemistry; used to melt with silver, gold, stainless steel; as material to produce boron alloys.

作为熔剂用于轻金属加工对金属表面处理，制造铝钛硼合金和作砂轮研磨盘的成份，以降低操作温度；用于焊接上作助熔剂及制造其它氟盐的原料；用作棉花和人造纤维的阻燃剂，用来清除印刷电路中露出铅的侵蚀液；用于电化学合成的化学分析试剂，用于熔接和熔合银、金、不锈钢等金属，可做铝镁浇铸生产含硼合金的原料。

Refers to operations of electrical contacts to permit a stress-free spring action to develop contact pressure, i. e., used in sockets of printed-circuits and in many other types of connectors.

使一个无应力的弹簧作用电触点产生接触压力的操作，即印刷电路的插口和许多其它类型的接插件中所用的情形。

The purpose of this thesis is to design an inkjet system for microelectronic fabrication process using a commercial inkjet printer. The inkjet system is expected to be applied in microelectronic fabrication to achieve cost down, fast prototyping and less environmental pollution.

中文摘要本文重点在设计制作一套可喷印绘制电路图形的喷墨系统及其制程研究，期望能以喷墨技术制作印刷电路板及电子元件，提供有别於现有制造印刷电路板、电子元件中微影、蚀刻制程的制作方式，来达到降低成本、减少开发时程及环境污染，以符合未来趋势的需求。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。