制造方法

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

This essay discuss prospect of furniture virtual design and manufacturing and method of design and manufacturing as well as examples of design and manufacturing enucleate course of virtual furniture design and manufacturing in detail .

本文对虚拟家具设计与制造的前景，设计与制造方法进行全面的论述；并以家具设计与制造的实例对虚拟家具设计与制造的过程进行系统的说明。

The present invention provides a manufacturing method for case, a case jogged method and apparatus, and a manufacturing system of the packing case.

本发明提供一种箱制造方法、箱嵌合方法与装置以及包装箱的制造系统。

METHOD OF MANUFACTURE 制造方法 Details on the method of manufacture are available from Perlite Institute, Inc.

细节的方法制造，可珍珠岩研究所，公司和它的成员。

A method of production of a reduction resistant dielectric ceramic composition having a superior low frequency dielectric characteristic and further improved in accelerated lifetime of insulation resistance, specifically a method of production of a dielectric ceramic composition containing a main component including a dielectric oxide of a specific composition, a first subcomponent including a V oxide, a second subcomponent containing an Al oxide, a third subcomponent containing an Mn oxide, and a fourth subcomponent containing a specific sintering aid in a specific ratio, including a step of mixing at least part of the materials of the subcomponents excluding one or both of at least the material of the third subcomponent and material of the fourth subcomponent with the starting materials prepared for obtaining the material of the main component to prepare the pre-reaction material, a step of causing the prepared pre-reaction material to react to obtain a reacted material, and a step of mixing the materials of the subcomponents excluded when preparing the pre-reaction material with the obtained reacted material to obtain a dielectric ceramic composition.

本发明提供一种介电陶瓷组合物的制造方法，其中介电陶瓷组合物以特定的比例含有如下成分：含有特定组成的介电体氧化物的主成分，该主成分可以提供具有优异的低频率介电特性的、绝缘电阻的加速寿命进一步提高的耐还原性介电陶瓷组合物的制造方法，含有V氧化物的第1副成分，含有Al氧化物的第2副成分，含有Mn氧化物的第3副成分，以及含有特定的烧结助剂的第4副成分；该方法包含如下工序：将至少除去第3副成分的原料和第4副成分的原料的一种或两种的其它副成分原料的至少一部分，与为了得到主成分原料而准备的起始原料混合，准备反应前原料的工序；使准备的反应前原料反应而得到反应后原料的工序；以及在所得的反应后原料中，混合在准备反应前原料时除去的副成分原料，得到介电陶瓷组合物原料的工序。

By comparison with conventional method,new style one on the basis of RPM and precision casting process es is of unexampled superiority.

与传统方法相比，以快速原型制造和精密铸造技术为核心的新型模具制造方法具有无可比拟的优越性，很有发展和应用前景。

The invention provides open-cell microcellular polystyrene foams and method for making the same.

本发明提供一种聚苯乙烯开孔发泡体之制造方法以及以该方法制造之聚苯乙烯开孔发泡体。

And based on simulation model of COMOSWORKS,finite element analysis approach to prestress is build up.

结合目前的制造方法，提出了预应力换热器制造新方法，并基于COMOS WORKS有限元分析模块，给出了预应力仿真分析方法。

Cage shaped rotor includes following parts: columnar rotor core made from soft magnetic material, multiple bar conductors made from copper inserted into rotor core along up and down direction, short circuit rings made from copper installed on upper and lower ends of rotor core in order to realize electrical connection among each bar conductor. Preparation method includes steps: in step for preparing short circuit ring assemblies, bar conductors are installed between short circuit rings in upper part and lower part to keep electrical connection between short circuit rings in upper part and lower part; in step for forming columnar rotor core, pressurization molding soft magnetic material is carried out when short circuit rings module is in die so as to form rotor core, where bar conductors are inside and short circuit rings are in upper and lower ends.

一种电动机的笼子状的转子及其制造方法，电动机的笼子状的转子包括转子铁芯，用软质磁性材料制成，呈圆筒状；多个导体棒沿上下方向插在转子铁芯的外圈，用铜制成；短路环为能够与各导体棒实现电连接，分别安装在转子铁芯的上、下端，并用铜制成；其制造方法，即制作短路环组件的阶段，在这个阶段中在用铜制成的上部短路环与下部短路环之间安装铜质的导体棒，从而形成短路环组件，这些导体棒相距一定间隔，与上、下短路环保持电连接；形成圆筒形转子铁芯的阶段，在这个阶段中把短路环组件放在模具内，并用软质磁性材料进行加压成型加工，从而形成导体棒位于其内部、短路环位于其上、下两端的转子铁芯。

A multiclad layer optical fiber prefabricated rod includes core rod and outer clad layer; the core rod consists of core layer, inner clad layer and low-hydroxyl high-purity clad layer in sequence, and the outer clad layer includes a high-purity outer clad layer and a subhigh-purity outer clad layer.

本发明涉及光纤制造领域中一种多包层光纤预制棒及制造方法，它包括芯棒和外包层，芯棒由芯层、内包层、低羟基高纯包层依次组成，外包层分为高纯度外包层和次高纯度外包层，它解决了现有的光纤制造技术中，光纤预制棒的外包层所使用的高纯原材料比重过大，从而导致高纯原材料利用率低、制造成本高的问题。

For a big chunk of credit-card losses; the number of filings (and thus charge-off rates) would be rising again, whether

年美国个人破产法的一个改动使得破产登记急速下降，而后引起了信用卡大规模的亏损。

Eph. 4:23 And that you be renewed in the spirit of your mind

弗四23 而在你们心思的灵里得以更新