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This paper presents conductive polymer molecular materials with insulating powder, mixed into the deployment of surge suppressors for low capacitance of paste, while the component design concept is based on the field of passive components, manufacturing process to make the basic theory to design the protective components, the main use of the existing ceramic substrate for the component body structure design, screen design in the body through the structure of the gap at the top of the printing layer of a different conductors, and then to learning to know the printing process technologies approach the low capacitance of the surge suppressor paste cover the gap in the two conductors, and by the resistance of plastic burning process technology, the temperature of sintering parts made of electrostatic protection element, and this protection through the external ESD components in bombardment tests, measurement of capacitance electrostatic discharge after bombardment, Trigger voltage and leakage current data, and the volume measured by the results of future discussion of the layout of this different style of work in the same area, different clearance, solid content and temperature than the next, for the attainment of performance components, a low capacitance ESD protection devices with low breakdown voltage requirements and to chip-based protection devices can be designed to integrate with the advanced Integrated Circuits or used independent of the electrostatic protection element in the system.

本文提出高分子导电分子材料搭配绝缘粉末,调配混合成适用於低电容突波抑制器之PASTE,而元件设计概念是以被动元件制程领域作基础理论去设计此防护元件,主体利用现有陶瓷基板为元件本体结构设计,在经由网版设计在本体结构上方印刷一层不同的间隙导体,再以习知印刷制程技术方式,将低电容突波抑制器之PASTE覆盖在两导体的间隙内,并经由电阻制程习知塑烧技术,将元件烧结适当温度制成静电防护元件;而此防护元件在经外加静电放电轰击测试后,量测静电放电轰击后的电容、Trigger voltage及漏电流相关数据,并藉由测结果讨此同的布局样式,在相同工作区面积、不同间隙、固含量与温度比下,对於元件效能是否达到静电防护元件低电容与低崩溃电压的需求,并藉此晶片型防护元件可设计整合於先进积体电或应用於独系统的静电防护元件中。

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