凸点

The metatarsal dome provides constant massage to reduce pain and promote blood circulation.

趾骨处的圆凸点能提供连续的按摩以舒缓疼痛及促进血液循环。

"Anything that's real pointy is going to put more pressure on that bump," she explains.

"任何真正的尖将施加更大的压力是凸点"，她说。

Salient point fixation mode:structural strength is worse in comparison to first type,but there is low requirements on space.

凸轮内圆部两凸点固定式：此固定方式结构强度相对第一种较差，但对空间要求较低。

DO NOT attempt to squeeze a stye or any other type of eyelid bump.

不要试图压缩麦粒肿或任何其他类型的眼睑凸点。

Every little bump in the road I tried to swerve.

每一个小凸点在路上我想背离。

Sometimes a whitehead forms while other times you just get a red bump.

有时一个白石的形式，而其他时候你找一个红色凸点。

In conclusion, ML force is more important in correcting the C-type scoliotic spine, and the level below apex is the most appropriate loading position for correcting scoliosis.

因此本研究归纳侧向力在胸椎C形脊柱侧弯矫正上扮演较重要的角色，而凸点椎体之下一节肋骨高度为最适当施力处。

Our results showed that the most appropriate rib's level for applying force was below the apex of scoliotic spine. From this appropriate level, the stress delivered to its conjunctive vertebra was the highest, as 1.3~1.8 times compared with others. Furthermore, the correction of Cobb's angle was also the highest, achieved 15%. The ML force was dominant in alteration of Cobb's angle, whereas the AP force was dominant in alteration of axial vertebral rotation. In addition, initial vertebral rotation influenced neither correction nor stress.

研究结果显示由凸点椎体的下一节对应之肋骨施力能使传入椎体具最高平均应力，较其他施力位置高出1.3到1.8倍之间，对柯卜氏角度可达15%的最佳矫正率；其中侧向施力主导冠状面上的矫正，而前后向施力主导扭转角度的矫正；另外椎体初始旋转角度对侧弯矫正和应力分布均无明显影响。

By polarization curves and SEM study of the combination of bath additives mechanism. hg22 stannous ions can inhibit the reduction in the bump, reducing the matrix near the area the thickness of the lack of metal ions to enhance the capacity and bath scattered the role of grain refinement in order to be bright plating.

通过极化曲线与SEM相结合的方式研究了镀液中添加剂的作用机理。hg22能够在抑制亚锡离子在凸点的还原，减小基体附近的金属离子匮乏区的厚度，提高镀液分散能力和细化晶粒的作用，从而得到光亮镀层。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。