光蚀刻

It is characterized by that after the UV lamp is evacuated, its interior can be filled with inert gas, mercury vapour or metal halide vapour and mixture of the above-mentioned gases. Said light source can be used for implementing disinfection and sterilization of gas, liquid and solid, photochemical synthesis of chemical substance and UV etching and UV information erasion of electronic material and device.

该光源由微波激发灯体内的特定气体电离产生等离子体发出紫外线光，能够实施对气体、液体、固体的消毒、灭菌以及通过紫外线实施对化学物质的光化学合成和对电子材料和器件进行紫外刻蚀、紫外信息擦除等，该微波紫外光源具有无电极、无镇流器，功率大、启辉迅速、寿命长、能耗低、效率高等特点。

An array of permalloy core solenoids is micromachined as microactuators on (100) silicon wafer. Then anisotropic etching of silicon in KOH solution forms the U-grooves beside the microactuators. The micromachining difficulties from the coexistence of 3-D MEMS devices and deep grooves on chip are overcome successfully. Then two fibers and permalloy piece are assembled onto the wafer together with the microstructures finishing the prototype of the new type MEMS VOA. Third, the inductance, resistance and Q value of the microfabricated solenoids are measured in the frequency range of 1-40 MHz.

第二，新开发了使用SU-85的正胶、负胶复合微加工工艺，在（100）硅片上加工了新型可变光衰减器的铁芯MEMS螺线管型电磁微执行器阵列；用KOH水溶液对（100）硅片进行湿法刻蚀，在电磁微执行器旁边微加工了V形槽结构组合，开发了单片集成三维MEMS器件和深槽的微加工关键技术；然后经过微装配制作出了电磁驱动的光纤偏移型MEMS可变光衰减器的样机。

An exceptionally clear adhesive can be made from fish and was the first adhesive used for photographic emulsions for photo film and photo resist coatings for photoengraving processes.

从鱼身上可以提取制成极其透明的粘胶，在胶片的感光乳胶和光刻蚀工艺的光阻涂层中首先被用作粘合剂。

The invention discloses a method to integrate single CMOS with bulk silicon microelectromechanical system, its technical project: 1 forming isolating groove: adopting deep-groove etching, and SiO2 and polycrystal silicon filling to realize the insulation of MEMS structure and CMOS circuit; 2 making standard CMOS circuit; 3 using SiO2 and Si3N4 as mask, etching silicon on the back until exposing SiO2 at the bottom of the isolating groove, to complete the thickness control for MEMS silicon structure layer; 4 completing metalizing the CMOS circuit and masking the MEMS structure: MEMS structure region uses Al as mask and CMOS circuit region uses thick photoetching glue as mask, using DRIE to release silicon structure.

本发明公开了一种将单片CMOS与体硅微机械系统集成的方法，其技术方案为：1形成隔离槽：采用深槽刻蚀，SiO 2 和多晶硅填充，实现MEMS结构和CMOS电路的绝缘；2完成隔离槽后进行标准CMOS电路的加工；3用SiO 2 和Si 3 N 4 作掩膜，从背面腐蚀硅，直至暴露出隔离槽底部的SiO 2 ，完成MEMS硅结构层的厚度控制；4完成CMOS电路金属化和MEMS结构掩膜：MEMS结构区用铝作掩膜，CMOS电路区用厚光刻胶作掩膜，用DRIE释放硅结构。用本发明方法不仅获得了较大的质量块，而且用本发明较高的深宽比制作出的结构电容，同时实现了体硅微机械与CMOS电路的集成，显著提高MEMS传感器的精度和稳定性，具有前沿性和重要实用价值。

The QVBA key micro-machined technology are also developed in this paper, such as: single step double sides multilayer photolithographic process, quartz crystal anisotropic etching process.

在仿真分析基础上，完成了石英振梁加速度计的设计及关键微加工工艺研究，包括：单步双面多层光刻工艺、石英晶体各向异性刻蚀工艺等。

The most significant advance of the work described in this thesis is as follow.1 The silica microdisk optical resonator which exhibit whispering-gallery-type modes with quality factors 1×10~5 have been fabricated firstly with standard photolithographic techniques and dry etching in China.

论文主要工作和创新之处包括：1在国内首先通过光刻方法以及干法刻蚀方法得到高Q值微盘谐振腔，微盘腔的Q值达到约1×10~5。

In order to achieve a high inductance value and Q-factor,UV-LIGA,dry etching technique,fine polishing and electroplating technique are adopted.

为了获得高电感量和Q值，采用UV-LIGA、干法刻蚀、抛光和电镀技术，研制的电感大小为1500μm×900μm×70μm，线圈匝数为41匝，宽度为20μm，线圈之间的间隙为20μm，高深宽比为3.5∶1。

Concentration contours of flux distribution for several interesting cases are presented,the different working areas of high flux footage from 5,000 suns to 15,000 suns have been compiled and photos showing the "powerful etching" of a steel plate by the hot spot of the solar furnace are also included.

我们列出了在几种有趣的情况下聚光比的等高线分布，还列出了从5，000到15，000个太阳，不同聚光倍数的工作区域。照片显示了该太阳炉在钢板上强大的"刻蚀"效果。来源：Ab79797BC论文网www.abclunwen.com

A multi-layered mask includes a lithographically patterned photoresist and an un-patterned organic antireflective coating formed over a substrate layer to be etched.

多层掩模包括形成在待刻蚀的衬底层上平版印刷图形化的光致抗蚀剂和未图形化的有机抗反射涂层。

The main contents are: Status and prospects of micro/nano fabrication technology, semiconductor substrates, vacuum science and plasmas. Several unit processes of microfabrication like diffusion, thermal oxidation, ion implantation, optical and nonoptical lithography, etching, physical deposition, chemical vapor deposition and epitaxial growth. Process integration of these unit processes for example CMOS technique and silicon bipolar technique, microelectro mechanical systems and some nano fabrication technologies will be introduced.

主要内容有：微米/纳米制造技术的现状和展望、半导体衬底、真空科学和等离子体，各种单项微电子加工工艺，如扩散、热氧化、离子注入、光学和非光学光刻、刻蚀、物理淀积、化学气相淀积、外延生长等，以及各种单项工艺的集成技术，如CMOS技术和硅双极型工艺技术，并初步介绍微电子机械系统和纳米加工技术。

Neither the killing of Mr Zarqawi nor any breakthrough on the political front will stop the insurgency and the fratricidal murders in their tracks.

在对危险的南部地区访问时，他斥责什叶派民兵领导人对中央集权的挑衅行为。

In fact,I've got him on the satellite mobile right now.

实际上 我们已接通卫星可视电话了