光刻的

Five novel torsion-mirror optical actuators including double-beam thickness differential structure with single torsional axis, double flexible folded-beam structure with single torsional axis, double-beam vertical torsion comb structure with single torsion axis, four-beam differential compound-micromirror structure with double torsional axis and the combined structure of the four basis forms above, are brought forward. All of these devices could be fabricated by the same silicon micromachining process we have developed. The deformation compensation design with local enhancement for the thin torsional beam which is the key structure of these devices is also put forward to improve the reliability. The three-dimension solid model and two-dimension reduced order model of the torsion-mirror optical actuator are established and then the numerical simulations for evaluating the device characteristics of the statics, dynamics, electrostatic field, mechanical and electrostatic coupling, fluid and solid coupling are carried out to optimize the structure design. Furthermore, three optical fibre clamping structures which could be integrated monolithicly are designed and analyzed to improve the optical coupling capability. 4. Three flexible process flows combined with bulk silicon micromachining and surface silicon micromachining are brought forward to fabricate these novel single-crystal silicon or polysilicon torsion-mirror optical actuators by using the same lithography masks for both SOI wafer and regular silicon wafer. A series of important process experiments are carried out to optimize the process parameters and the process flows. Some novel and typical process phenomena which occurred during the microfabrication are analyzed and then the corresponding solutions are put forward. 5. A MEMS dynamic testing system which exploit blur image synthetic technique, stroboscopic image matching technique, stroboscopic mirau microscopic interferometry technique and microscopic laser dopper vibrometer technique is set up to measure three-dimension and six-freedom micro motions of any MEMS devices with nanometer resolution.

在对硅微机械扭转镜光致动器的光机电特性系统地理论研究的基础上提出了硅微机械扭转镜光致动器的结构设计准则。3、提出了单轴双梁厚度差分结构、单轴双柔性折叠梁结构、单轴双梁垂直扭转梳齿结构、双轴四梁差动复合微镜结构以及以上四种基本结构组合后的衍生结构等五种工艺加工技术兼容的新型的硅微机械扭转镜光致动器，对器件关键结构薄厚度、高耐疲劳扭转梁进行了局部加强的变形补偿设计，建立了器件的三维实体模型以及两维降阶模型，对提出的新结构硅微机械扭转镜光致动器进行了系统的静力学、动力学、静电场、力电耦合和流体固体耦合的建模仿真与优化设计，同时设计并分析了三种可实现单芯片集成的弹性光纤定位夹紧结构。4、提出了组合体硅微加工技术与表面硅微加工技术、兼容同一套光刻版图、可分别基于SOI 晶片和普通Si 晶片、适应于制造提出的各种新结构单晶硅和多晶硅硅微机械扭转镜光致动器的三套柔性加工工艺流程，开展了一系列重要工艺步骤的单项工艺试验，对工艺流程与工艺参数进行了优化，针对加工过程中出现的具有普遍意义的典型工艺问题进行了讨论和分析，并提出了解决方法。5、创新性地将模糊图像合成技术、频闪图像匹配技术、频闪Mirau 显微干涉技术与显微激光多普勒测振技术有机结合，建立起了一套周期运动测量与瞬态运动测量相结合、单点运动测量与全视场运动测量相结合、满足不同MEMS 器件各种动态测试要求的集成的MEMS 三维六自由度微运动精密测量系统。

The film's optical thickness exhibits an exponential change with the increasing irradiation time.

利用光刻直写，这种材料将被用来制作更为复杂的阵列式滤光片和切趾滤光片。

This paper introduced principle, process, characteristics and controlling deep slot of spiral groove movable ring of photoetching in the liquid hydrodynamic seal.

主要介绍了流体动力密封螺旋槽动环光刻工艺的特点、原理、工艺过程、工艺流程、槽深控制方法以及应用情况，提出了采用高能束流刻蚀螺旋槽动环的新途径。

The QVBA key micro-machined technology are also developed in this paper, such as: single step double sides multilayer photolithographic process, quartz crystal anisotropic etching process.

在仿真分析基础上，完成了石英振梁加速度计的设计及关键微加工工艺研究，包括：单步双面多层光刻工艺、石英晶体各向异性刻蚀工艺等。

The most significant advance of the work described in this thesis is as follow.1 The silica microdisk optical resonator which exhibit whispering-gallery-type modes with quality factors 1×10~5 have been fabricated firstly with standard photolithographic techniques and dry etching in China.

论文主要工作和创新之处包括：1在国内首先通过光刻方法以及干法刻蚀方法得到高Q值微盘谐振腔，微盘腔的Q值达到约1×10~5。

To build the complex CPU of a computer on a single silicon chip using photolithography and chemical etching

由于采用光刻法和化学蚀刻法可以将一台计算机中的complex CPU建造在单个的硅片上如今。。。

When a film is formed,device features generally are defined by lithographic and etching processes.

当一个膜形成后，设备的特性，一般是通过光刻和蚀刻过程决定。

The main contents are: Status and prospects of micro/nano fabrication technology, semiconductor substrates, vacuum science and plasmas. Several unit processes of microfabrication like diffusion, thermal oxidation, ion implantation, optical and nonoptical lithography, etching, physical deposition, chemical vapor deposition and epitaxial growth. Process integration of these unit processes for example CMOS technique and silicon bipolar technique, microelectro mechanical systems and some nano fabrication technologies will be introduced.

主要内容有：微米/纳米制造技术的现状和展望、半导体衬底、真空科学和等离子体，各种单项微电子加工工艺，如扩散、热氧化、离子注入、光学和非光学光刻、刻蚀、物理淀积、化学气相淀积、外延生长等，以及各种单项工艺的集成技术，如CMOS技术和硅双极型工艺技术，并初步介绍微电子机械系统和纳米加工技术。

To improve the fabrication technology of photoelectrical encoder,the laser lithography method was introduced.

为了改进光电码盘的制作工艺，提高效率，降低成本，提出了一种光电码盘的光刻方法。

These technologies can enhance the resolution of lithography by changing the distribution of the object's spectrum in and out of the pupil, and then decreasing the object's lower frequency parts and increasing higher frequency parts.Modeling of the lithography is essential to the RETs.

空间滤波技术主要是指离轴照明技术和光瞳滤波技术，它们都是通过改变入瞳体或出瞳体的物体的频谱的分布，达到降低低频分量，相对提高高频分量，最终提高光强对比度，从而提高光刻分辨率。

Plunder melds and run with this jewel!

掠夺melds和运行与此宝石！

My dream is to be a crazy growing tree and extend at the edge between the city and the forest.

此刻，也许正是在通往天国的路上，我体验着这白色的晕旋。