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We use emulational software of Ansoft to emulate the Lange coupler and achieve good result.

此外,我们选择金丝互连的结构来完成MMIC芯片和电路之间的连接。

In a hub and spoke topology the location of the hub is chosen to give the lowest leased line cost.

不像专线的互连,网状可以不经任何硬体设备达到讯框中继的功能。

We derive the statistical characteristics, such as average queue length of any priority packet in independent and dependent packet arrival cases.

分别在独立和相关到达两种情况下导出了任意优先级业务的平均排队长度等特征参数,发现当N×N规模互连网络的端口数N足够大时,两种业务到达模型的排队性能趋于一致。

In the number of those selected as know-how burn immersion lithograph and interconnections with the ultra-low value dielectric constant.

在这些数字选为诀窍烧浸泡版画、互连与超低介电常数值。

The grain size distribution for a thin film that has undergone normal grain growth is close to lognormal distribution.

II用PVD金属淀积方法在小尺寸接触孔中填充铝互连薄膜。

This paper based on the author's practical development experiences, details some important elements desiring consideration in the dual-processors mobile terminal system integration in physical layer such as how to choose the system architecture,how to inter-connect so many chips with perfect power group organization and interface power level deployment and also some basic low-level communication protocols between master processor and co-processor or other blocks.

本论文基于作者在移动终端研发领域的实际开发经验,详细的阐述和探讨了双处理器架构移动终端系统物理层集成时要考虑的很多因素,如系统架构的选择,芯片互联时的一系列物理层通信协议,芯片互联时电气特性的匹配要求和系统电源系统的配置等问题,其中互连协议是很关键的因素。

Matal films such as aluminum and silicides are used to form low-resistance interconnections, ohmic contacts to n+,p+,and polysilicon layers,and rectifying metal-semiconductor barriers.

金属片如铝和硅化合物被用来形成低电阻互连, n+,p+的欧姆接,触多晶硅层,并整顿金属-半导体的势垒。

Boundary-scan test technology is a standard measurability design technology, and it provides method to carry out the measurement of device function, interconnection and influence to each other, and is more convenient for the measurement of complex circuits.

边界扫描技术是标准化的可测试性设计技术,它提供了对电路板上器件的功能、互连及相互间影响进行测试的一类方法,极大地方便了对于复杂电路的测试。

One is the conventional diffusion path approach, which has explained many important phenomena in traditional Al on-chip metallization.

一种是常用的扩散路径法,该方法能够解释传统的铝片上金属互连的许多重要电迁移现象。

Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.

金属化是淀积一层薄薄的金属膜的工艺,将其制成模版用于形成所需的内部互连排列。

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It has been put forward that there exists single Ball point and double Ball points on the symmetrical connecting-rod curves of equilateral mechanisms.

从鲍尔点的形成原理出发,分析对称连杆曲线上鲍尔点的产生条件,提出等边机构的对称连杆曲线上有单鲍尔点和双鲍尔点。

The factory affiliated to the Group primarily manufactures multiple-purpose pincers, baking kits, knives, scissors, kitchenware, gardening tools and beauty care kits as well as other hardware tools, the annual production value of which reaches US$ 30 million dollars.

集团所属工厂主要生产多用钳、烤具、刀具、剪刀、厨具、花园工具、美容套等五金产品,年生产总值3000万美元,产品价廉物美、选料上乘、质量保证,深受国内外客户的青睐

The eˉtiology of hemospermia is complicate,but almost of hemospermia are benign.

血精的原因很,以良性病变为主。