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Chapter two 4-Hydroxybenzoic acid is connected with PEG6000 through defoliant DCC at rooom temperature, then the product is refluxed with chloroacetic acid in acetone to afford PEG-bound phenyloxyacetic acid, which is reacted with thionyl chloride, ammonium thiocyanate and arylamines in turn to give PEG-bound disubstituded thioureas. After the cleavage with sodium methoxide in methanol, the eleven disubstituted thioureas are obtained.

第二章 利用PEG6000作载体,通过脱水剂DCC在室温下将对羟基苯甲酸以酯键连接在PEG6000上,再与氯乙酸在较温和的条件下生成PEG6000支载的芳氧乙酸,然后,依次与亚硫酰氯、硫氰酸铵、芳胺反应,生成PEG6000支载的硫脲,最后用甲醇钠的甲醇溶液切割PEG,得到了十一种1,3-二取代硫脲。

A digital video cassette recorder 4-1 connected to the IEEE1394 high-speed serial bus 11-1 extracts digital video data through the processes opposite to those carried out in the transmitter side.

与IEEE1394高速串行总线(11―1)连接的数字录像机(4―1),进行与发送侧相反的处理,并提取数字视频数据。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

A direct memory access controller may be configured to facilitate transfers of data between a first and a second DSP processor core coupled to the DMA controller.

直接存储器存取控制器可以配置成促进与该DMA控制器连接的第一与第二DSP处理器核心之间的数据传送。

The system achieves a sampling rate of 800Msps, and converts the high speed LVDS signals to low speed LVTTL signals using FPGA. And the FPGA implements the amplitude discrimination and obtains time information. Then FPGA sends the data to the TELL1 readout board.

该系统最高可达800M的采样率,通过FPGA进行电路控制,实现数据的串并转换、数据缓存、幅度甄别与时间信息的获取等功能,最后数据通过TELL1接口电路连接至以太网,用计算机进行读取与分析。

The model connects piston and displacer by the damping factors due to interactive motion.

该模型引入了排出器与压缩活塞运动对另一方运动产生的阻尼,从而将排出器与压缩活塞的运动连接起来。

But now there is a quick and effective way to connect through a USB to DVI display adapter with the introduction of new USB to DVI adapter by Sewell.

但现在有一个快速和有效的方式来连接通过USB至DVI显示适配器与引进新的USB接口与DVI接口适配器,由维尔。

The invention relates to distributivity phoneme communication system and network connecting method applied in residential district. It includes management layer, middle layer, and user layer. The management layer includes center monitoring controlling main engine and supervisor used to monitor, control, and supervise the whole system.

可应用于住宅小区的分布式语音通讯系统及网络连接方法,包括管理层、中间层和用户层;管理层,包含中央监控主机和管理机,负责整个系统的监控与管理;中间层,包含门口机,作为管理区域的辅助划分管理单位;用户层,包含用户机,负责与住户的交互。

The invention discloses a MicroTCA system, which comprises an MCH, and a clock card and a plurality of AMC cards connected with the MCH, wherein the clock card includes a clock selection unit for selecting a clock source and outputting, and a phase locking unit for generating a system synchronous clock from the clock source selected by the clock selection unit of the clock card; and the MCH includes a clock drive unit for driving the system synchronous clock generated by the clock card to the plurality of AMC cards connected with the MCH.

本发明公开了一种MicroTCA系统,包括:MCH、与所述MCH连接的时钟卡及多个AMC卡,其中,所述时钟卡包括:时钟选择单元,用于选择时钟源并输出;锁相单元,用于将所述时钟卡的时钟选择单元所选择的时钟源生成系统同步时钟;所述MCH包括:时钟驱动单元,用于将时钟卡所产生的系统同步时钟驱动到与所述MCH相连的多个AMC卡。

Curtain plate stainless steel plate, spray nozzle for the spray nozzle to capture, exhaust fan with explosion-proof fan.3, chamber body assembly plate connection between the use of bolts, installation, removal, fast and convenient.4, configuration, special explosion-proof spray room lighting, interior lighting sufficient light.5 mist treatment with water curtain, shower folding capture plus maze can efficiently remove the paint mist.6, circulation pump with an area of small, simple installation and pipeline pumps.7, Room δ1.5mm steel and steel body is made of.8, dust chamber body is made of EPS board, has entered out.9, water curtain spray booth technical parametersNo Item ParametersA flow rate (m3 / h) 90002 Power 43 pump power 34 open wind speed 0.6-0.75 Compressed air consumption (m3/min) 0.36 lamp illumination 400Z-7 nozzle8 Painting Room: Dimensions 2500 × 2400 × 26009 Dust Room: Dimensions 2500 × 1800 × 3400Note: Manual spray system uses 你好gh-quality brand-name products in Taiwan.6, leveling RoomLeveling effect of room to spray paint surface after the paint on the share level, and to a number of solvent evaporation in order to prevent baking too quickly appeared in the film pinhole.1, Room body is made of welded steel and steel plate.2, chamber body wall windows with transparent glass observation and maintenance of the door.3, chamber body with the top emission device, keeping indoor air fresh.4, room spray processing site in vivo, uniform color, elegant appearance.3, the consolidated statementa, baking oven is designed to bridge Road.

没有碰到水帘的漆雾由水帘下部进入喷漆室的后部,由喷嘴喷出的水雾冲洗、迷宫折板过滤及折板上的喷淋系统三次过滤后,废气经风机排至大气中,布局特点如次:一、设置双工位水帘喷漆室。二、槽体采用型钢及Q235钢板制作,板厚4mm。水帘板为不锈钢板,喷淋捕捉喷嘴为雾化喷嘴,抽风机采用防爆型风机。3、室体拼装板之间采用螺栓连接、安装、拆卸、迅速,便捷。四、配置喷漆室专用防爆照明,内部采光充足、明亮。5、漆雾处理采用水帘、喷淋捕捉加迷宫折板,可高效去除漆雾。6、轮回泵采用占地少、安装简略的管道泵。7、室体采用δ1.5mm钢板与型钢制作而成。八、防尘室体采用EPS板制成,设有出进门。9、水帘喷漆室技术参数序号项目参数1 处理风量(m3/h) 90002 功率 43 水泵功率 34 开口风速 0.6-0.75 压缩空气耗量(m3/min) 0.36 照明灯照度 4007 喷嘴 Z型8 喷漆室:外形尺寸 2500×2400×26009 防尘室:外形尺寸 2500×1800×3400注:手动喷漆系统采用台湾优质名牌产品。六、流平室流平室的作用是使喷漆后喷在工件表面上的漆铺平,并使溶剂挥发一些,以防止烘烤过快而在漆膜上浮现针孔。一、室体采用型钢与钢板焊制而成。

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