查询词典 wafers

It was white like coriander seed and tasted like wafers made with honey.

样子像芫荽子、颜色是白的、滋味如同搀蜜的薄饼。

To enable wafers have a high lapping efficiency, there are cruciform grooves which deep are 3mm on the surface of the lapping plate.

为使晶片研磨有较高的研磨效率，研磨盘表面加工有深3 的十字形槽。

A great deal of wastewater was produced in the manufacturing of gallium arsenide wafers,and the main contamination was gallium arsenide particles in suspension.

砷化镓晶片生产过程中，产生大量废水，其中主要污染物是悬浮状态的砷化镓微粒。

Using the mechanism, we also fabricated large-area silicon nanowire p-n junction diode arrays by chemical etching of planar silicon p-n junction wafers in aqueous HF solution containing appropriate silver nitrate near room temperature.

进一步研究了硅衬底在HF-MoxMox=KAuCl4、K2PtCl6、Cu(NO32、Ni(NO3)2、Mg(NO3)2等氧化剂混合水溶液里的腐蚀行为，并提出了一种新的硅纳米线形成机制－金属枝晶辅助纳米电化学机制。

An example of a lagniappe is when you buy a book and the bookstore gives you a beautiful bookmark as a gift, or when you buy a cappuccino and the waiter adds a couple of gourmet wafers.

我们！ 。一个例子lagniappe是当你购买一本书和书店给你一个美丽的书签作为礼物，或当您购买咖啡和服务员说了几个美食晶圆。

Tungsten CMP is an important process to gain the global planarity of silicon wafers with tungsten plugs.

钨的化学机械抛光是用钨坯获得硅片球面平整度的重要工艺。

This is essentially a tiny pit etched in silicon and sealed between two Pyrex wafers.

这基本上是一个很小的坑硅蚀刻和两高硼硅晶片密封。

These edges profiles are also configured to inhibit redeposition of residue particulates on the top surfaces of the wafers during semiconductor processing steps.

还构造这些边缘轮廓以在半导体加工步骤期间抑制在晶片上表面上再淀积残存颗粒。

Different processes are used on the back surface of silicon wafers to form cells falling into three groups: textured, planar, and sawed-off pyramid back surface.

采用了三种不同的工艺对三组硅片进行背表面处理，得到绒面背表面，平背表面和截断金字塔背表面。

Semolina, sponge pudding, pastry, pies, wafers.

盛放在铝制容器，海绵布丁，糕点，馅饼，晶圆。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。