查询词典 wafer

The invention is directed a patterned contact sheet and to a method of bonding a cover wafer to an interposer wafer using the patterned contact sheet having a waffle-like pattern of a plurality of ridges and plurality of wells to form a cover/interposer combination or unit that can be bonded to a substrate having a MEMs device thereon, the cover wafer, interposer wafer and substrate together forming a protective packaging for the MEMS.

本发明涉及在制造过程中保护临界表面的形成有图案的接触片材以及一种使用形成有图案的接触片材将盖子片粘合到插入物片上以形成盖子/插入物组合或单元的方法，所述接触片材具有华夫饼干状图案的许多脊和许多井，所述盖子/插入物组合或单元可粘合到具有MEM设备的基材上，所述盖子片、插入物片和基材一起形成MEM用的保护性封装。

The device call execute the inputting and taking actions of wafer box, outer rings and inner rings. It can realize the tension controlling during wafer expanding, wafer separating with the metal plate, empty wafer box and waste metal plate discharging.

该装置可完成片盒、内圈和外圈的输入和取片动作，实现扩晶过程张紧力的调节控制、分离晶圆和衬架、排出空片盒和废弃的衬架等。

Then, based on the configuration and design principle of the wafer handing robot, the model of the wafer handing robot arm is established. The radial linear concertina motion of the wafer handing robot is analyzed, a type of mechanism that can implement the function is proposed, furthermore, the kinematics of the mechanism is analyzed.

其次，根据硅片传输机器人的构型与设计原则，建立了机器人手臂的模型，对硅片传输机器人的径向直线伸缩运动展开分析，提出了实现该运动的机构，并对机构进行了运动学分析。

Our company relates to optics wafer treating right away starting from the 80's, In the field of wafer treating have accumulated large amount of the special field experience developing、giving birth to a child and managing. Grasp the various optics wafer Flat surface、Spherical surface、Cylindrical surface complete set processing technology.

本公司自八十年代初就开始涉及光学晶片加工，在晶片加工方面积累了大量开发、生产及管理的专业经验，掌握各种光学晶片平面、球面、柱面的全套加工技术。

Now people attach importance to the cleaning of silicon grinded wafer. There are a lot of carborundums and silicon powders on the wafer surface because grinded wafer are grinded by carborundum and corresponding depth are remove in the sequence of grinding. After grinding there are plenty of carborundums and silicon powders enchase in the damaged layers. So there are many difficulties in later processes.

半导体硅单晶衬底加工工业中最受重视是硅磨片的清洗，由于硅磨片是用金刚砂研磨的，研磨过程中又要去除相应的厚度，所以刚加工的磨片表面附着着大量的金刚砂和研磨下来的硅粉，而且还有相当一部分金刚砂和硅粉镶嵌到破损层里面，这给后续的清洗工作带来了困难。

The reactor includes a reaction chamber sized and shaped for receiving the semiconductor wafer and a susceptor having an outer edge and a generally planar wafer receiving surface positioned in the reaction chamber for supporting the semiconductor wafer.

该反应器包括一个反应室，其大小和形状可用来接纳半导体晶片；和一个衬托器，它有一个外边和一个位在反应室内一般为平面的晶片接纳表面可用来支承半导体晶片。

In order to obtain better characteristics of photonic crystal lasers, the wafer bonding technology is introduced to integrate MQWs wafer with different uncompatible wafers. We utilize the direct bonding method and glue bonding method to integrate the 1550nm long-wavelength MQWs with DBR wafer or sapphire. The effect factors of bonding process and choice of bonding materials are discussed. At last, we measure the photoluminescence spectra of our membrane devices and bonding samples.

为了得到更好的光谱特性，我们介绍了各种晶圆接合技术去整合含有多层量子井结构的晶圆与其不相容的材料，我们利用直接接合和溶胶接合的方法去接合1550nm长波长的多层量子井晶圆与含有DBR结构的晶圆或sapphire，并对於各种接合影响因素与材料的选择加以讨论，最后再对我们的层状光子晶体雷射和晶圆接合后的样本做量测。

With the requirement of JiYuan Irish diamond factory, the automatic sorting machine of quartz crystal wafer is studied on by using the international advanced technique of full automatic sorting machine of quartz crystal wafer, which is based on the semi-automatic sorting machine of quartz crystal wafer.

本项目应济源市水晶厂的要求，在原有半自动石英晶片分选机的基础上，借鉴国外全自动石英晶片分选机的先进技术对石英晶片自动分选机进行了研制。

In the process, the wafer is subjected to a heat-treatment to form crystal lattice vacancies in the wafer.

在本工艺中，对晶片进行热处理以形成晶格空位，该空位在硅主体中形成。

Five novel torsion-mirror optical actuators including double-beam thickness differential structure with single torsional axis, double flexible folded-beam structure with single torsional axis, double-beam vertical torsion comb structure with single torsion axis, four-beam differential compound-micromirror structure with double torsional axis and the combined structure of the four basis forms above, are brought forward. All of these devices could be fabricated by the same silicon micromachining process we have developed. The deformation compensation design with local enhancement for the thin torsional beam which is the key structure of these devices is also put forward to improve the reliability. The three-dimension solid model and two-dimension reduced order model of the torsion-mirror optical actuator are established and then the numerical simulations for evaluating the device characteristics of the statics, dynamics, electrostatic field, mechanical and electrostatic coupling, fluid and solid coupling are carried out to optimize the structure design. Furthermore, three optical fibre clamping structures which could be integrated monolithicly are designed and analyzed to improve the optical coupling capability. 4. Three flexible process flows combined with bulk silicon micromachining and surface silicon micromachining are brought forward to fabricate these novel single-crystal silicon or polysilicon torsion-mirror optical actuators by using the same lithography masks for both SOI wafer and regular silicon wafer. A series of important process experiments are carried out to optimize the process parameters and the process flows. Some novel and typical process phenomena which occurred during the microfabrication are analyzed and then the corresponding solutions are put forward. 5. A MEMS dynamic testing system which exploit blur image synthetic technique, stroboscopic image matching technique, stroboscopic mirau microscopic interferometry technique and microscopic laser dopper vibrometer technique is set up to measure three-dimension and six-freedom micro motions of any MEMS devices with nanometer resolution.

在对硅微机械扭转镜光致动器的光机电特性系统地理论研究的基础上提出了硅微机械扭转镜光致动器的结构设计准则。3、提出了单轴双梁厚度差分结构、单轴双柔性折叠梁结构、单轴双梁垂直扭转梳齿结构、双轴四梁差动复合微镜结构以及以上四种基本结构组合后的衍生结构等五种工艺加工技术兼容的新型的硅微机械扭转镜光致动器，对器件关键结构薄厚度、高耐疲劳扭转梁进行了局部加强的变形补偿设计，建立了器件的三维实体模型以及两维降阶模型，对提出的新结构硅微机械扭转镜光致动器进行了系统的静力学、动力学、静电场、力电耦合和流体固体耦合的建模仿真与优化设计，同时设计并分析了三种可实现单芯片集成的弹性光纤定位夹紧结构。4、提出了组合体硅微加工技术与表面硅微加工技术、兼容同一套光刻版图、可分别基于SOI 晶片和普通Si 晶片、适应于制造提出的各种新结构单晶硅和多晶硅硅微机械扭转镜光致动器的三套柔性加工工艺流程，开展了一系列重要工艺步骤的单项工艺试验，对工艺流程与工艺参数进行了优化，针对加工过程中出现的具有普遍意义的典型工艺问题进行了讨论和分析，并提出了解决方法。5、创新性地将模糊图像合成技术、频闪图像匹配技术、频闪Mirau 显微干涉技术与显微激光多普勒测振技术有机结合，建立起了一套周期运动测量与瞬态运动测量相结合、单点运动测量与全视场运动测量相结合、满足不同MEMS 器件各种动态测试要求的集成的MEMS 三维六自由度微运动精密测量系统。

And that's the VOA special English economics report, all kind of tran and audio files are at voaspecialenglish.com.

这就是今天的美国之音特别英语经济报道节目。所有的文稿和音频文件都在VOASPECIALENGLISH。

I think everybody will intertest at the latest conditattion, that's is import to our future development.

我想大家有兴趣了解一下最新情况，因为这对我们未来的发展是非常重要的。