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thick film相关的网络例句

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与 thick film 相关的网络例句 [注:此内容来源于网络,仅供参考]

The UV-LIGA of LIGA-Like process is used to fabricate dot type light guide plate stamper features and it uses SU-8 thick film photoresist liquid.

1利用类LIGA制程中的UV-LIGA来制作Dot型导光板的模仁特徵,所使用的光阻液为SU-8厚膜光阻液。

Thick film resistance was printed in the back of the diaphragm to form a Wheatstone bridge.

厚膜电阻印刷在陶瓷膜片的背面,连接成一个惠斯通电桥。

The adding of ZrO_2 could suppress the appearance of the Celsian during the sintering process and then improve the insulation properties of the dielectric, result in stainless-steel satisfy the thick film circuit's needs.

加入ZrO_2能够有效抑制烧结过程中单斜相的析出,大大改善介质层的绝缘性能,使基板满足厚膜电路对绝缘性能的要求。

Our company's metal thick-film electronic plasm and application item have high content of technology, its main capability achieve the international advanced level than congeneric products.

我公司生产的金属/厚膜电子浆料主要性能达到国际同类产品先进水平。

Thick film silver paste, which sintering after printed on the glass substrate, then forming high conductivity and fine line pattern is especially important for typical applications include automobile shield defog heating line and plasma panel display bus electrode.

玻璃基板印烧的特种高导及细线印刷银浆近五年来需求量成倍增长,特别在汽车挡风玻璃及平板显示器方面的应用。

In the end, the dispersity and stability in sol of PZT powders were discussed. The thick film with 15 micron was prepared by 0-3 composite method.

分析了PZT粉体的分散及其在溶胶中的稳定,用0-3型复合法制备了厚度达15μm的PZT厚膜。

Among whole technique exploitation process, this paper will emphasize in UV-LIGA process discussion , thick film photoresist SU-8 reflows generable fluid situation for dot shape influence and fixed Ni stamper manner whether it suits below thickness 0.5mm insert influence of electroforming Ni stamper.

在整个技术开发过程中,本文将著重在UV-LIGA制程上的探讨、厚膜光阻SU-8热回流时,所产生的流动情形对Dot形状的影响以及固定镍模仁之方式是否适用於厚度0.5mm以下电铸镍模仁的嵌入情形。

The new developed products such as module power supplies imitating Vicor power supply, thick film power supplies imitating Interpoint and HT 16 model high accuracy operational amplifier have met the needs of some markets. Therefore, the market competitiveness has greatly been promoted.

最新研制成功的仿Vicor模块电源、仿Interpoint厚膜化电源和HT16高精度运算放大器满足了一定的市场需求也大大提升了企业市场竞争能力。

This paper also make research on the influence of heat treatment technology on the resistance and TCR of different thick film elements including Ag-Pd, bismuth ruthenate and copper ruthenate, and influence of heat deposition technology on the consistency of resistance of the elements.

此外,论文研究了热处理对Ag-Pd、钌酸铋、钌酸铜三种不同材料体系厚膜电阻元件的阻值、电阻温度系数的影响和热存放对电阻元件阻值一致性的影响。

The above performance could meet the requirement of braking. The result showed that heat treatment technology could preferably improve the electric characteristics of the thick-film elements. The best heat treatment technology of Ag-Pd resistance elements kept at 210℃for 130h, bismuth ruthenate resistance elements kept at 150℃ for 50h and copper ruthenate resistance elements kept at 180℃ for 50h.

热处理实验结果表明:热处理可改善厚膜电阻元件电性能,Ag-Pd电阻元件最佳热处理工艺为210℃保温130h,钌酸铋电阻元件最佳热处理工艺为150℃保温50h,钌酸铜电阻元件最佳热处理工艺为180℃保温50h。

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