查询词典 substrate
- 与 substrate 相关的网络例句 [注:此内容来源于网络,仅供参考]
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Under contented the used intensity,the anorthite ceramic substrate which prepared with pyrophyllite at low-sintering temperature has small dielectric constant,good dielectric property which compared with common aluminum substrate,the anorthite ceramic substrate has light bulk density,which is advantage to reduc.
研究了用叶蜡石、碳酸钙与适量的氧化铝,在加入添加剂的条件下,用原位反应烧结法制备出低温烧结( 12 0 0℃)的新型钙长石质陶瓷基片材料。
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The results show that the optimal hydrolysis conditions of these three enzymes were:50℃,pH 8.5, substrate concentration 1:3,enzyme dosage 1200U/g,time 4h for Alcalase; 45℃,pH 8.1, substrate concentration 1:3, enzyme dosage 1200U/g, time 4h for Trypsin;50℃, pH5.5, substrate concentration 1:3, enzyme dosage 1400U/g, time 6h for Bromelin, respectively. The compound enzymes hydrolysis was investigated on the basis of the single enzyme hydrolysis.
利用单因素试验和正交试验分别对这三种酶单独水解牡蛎的条件进行了研究,得出三种酶水解牡蛎的最佳条件分别为Alcalase:温度50℃,pH8.5,料水比1:3,加酶量1200U/g,时间4h;胰蛋白酶:温度45℃,pH8.1,料水比1:3,加酶量1200U/g,时间4h;菠萝蛋白酶:温度50℃,pH5.5,料水比1:3,加酶量1400U/g,时间6h;为牡蛎生物活性肽的开发提供了基础参考数据。
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It is demonstrated that the chiral quaternary ammonium salts catalysts exhibit promising catalytic properties for the substrate. Part III: The synthesis and the characterizing of the macroporous aminomethyl resin-supported cinchona alkaloid complexes and the study on its catalytic properties The part consists of two subsections. the macroporous aminomethyl resin -supported cinchona alkaloid complexes were synthesized by the stuff (cinchonine, quinine and macroporous aminomethyl resin). Their structures were characterized by means of elemental analysis, XPS, TG/DTA; the chiral polymer-supported complexes were first used as catalysts for the reduction of ketones. Their catalytic properties for the reduction processes were investigated. The comparison of the products e.e., the conversion of the substrate among different reduction processes was employed with determined by HPLC. The effects of the time, the temperature, the ratio of catalyst to substrate, reaction solvent as well as the recycle times were also discussed.
第三章聚-4-氨甲基苯乙烯负载金鸡纳碱金属络合物的合成与表征及其不对称催化性能研究本章分为两节,以辛可宁和奎宁及聚-4-氨甲基苯乙烯为原料,合成了4种聚-4-氨甲基苯乙烯负载金鸡纳碱络合物催化剂,并对它们的结构用元素分析、X-射线光电子能谱、TG/DTA等几种测试手段进行了表征;首次将所合成的手性高分子负载的金属络合物用于催化芳香酮不对称还原反应,详细研究了所得的手性高分子负载的金属络合物对不同底物的催化性能,用HPLC等分析手段定量检测了还原过程的底物转化率及其产物对映异构体选择性,并考察了反应时间、反应温度、催化剂和底物投料比、反应溶剂和循环次数对催化性能的影响。
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The results show that the brush-plating coating is even and compact from section plane with good toughness and adhesion. The microhardness of the coating is 230.6HV0.5 which is 3 times of cast aluminium substrate. The wear resistance of the coating is 3 times of cast aluminium substrate. But the friction coefficient of the coating is 0.70 which is more high than that of the substrate, which is favorable for the fixed conjugate between the axis sheath and the axis seat of the gear-box.
结果表明,镀层厚度分布均匀、致密,镀层与基体界面清晰,未出现氧化物夹层,镀层的韧性和结合强度均较好;测得碱性铜及铸铝基体的显微硬度分别为230.6、74.2HV0.5;碱性铜的镀制使基体表面显微硬度及耐磨性均提高了2倍多,磨损状况明显改善。
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The solder removing device comprises the restoring chamber(37) used to store the liquid heating medium whose temperature is above the solder's melting point, the substrate conveying machine used to convey the defectively soldered substrate in and out the solder treating pond, and the brush(45) used to rub the surface of the defectively soldered substrate immerged in the heating medium in the solder treating pond and rub off the solders which are over heated by the heating medium.
焊料移除设备(31)包括用于存储温度高于焊料的熔点的液体形式的加热介质的修复腔室(37)、用于输送有缺陷地焊接的基片进出焊料处理池的基片运输机、和用于摩擦浸入焊料处理池内的加热介质的有缺陷地焊接的基片的表面由此擦去通过加热介质过度加热的焊料的刷子(45)。
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With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices
非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件
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On the basis of the kinetic equation of substrate reaction in the presence of urea or guanidine hydrochloride, all microscopic kinetic constants for the free enzyme and enzyme-substrate binary and ternary complexes have been determined. The results of the present studies indicate that:①In the presence of urea or guanidine hydrochloride, enzyme-substrate complexes lose their activity less rapidly than the free enzyme. Therefore, both substrates, NADPH and 7, 8-dihydrofolate, protect dihydrofolate reductase against inactivation.②The denaturation of dihydrofolate reductase by urea follows single-phase kinetics, and changes in enzyme activity and tertiary structure proceed simultaneously in the unfolding process, so it may be an"all or none"process.③The GdnHCl-induced unfolding of the dihydrofolate shows a biphasic transition, while the change in the enzyme activity is a single exponential process. The rate constant of inactivation is consistent with that of the fast conformational change. Therefore, the kinetic intermediate of protein unfolding should be a partially folded and inactive form.
我们根据在脲或盐酸胍存在下的底物反应动力学方程求得游离酶和酶底物二元、三元复合物的微观动力学常数,结果表明:①酶-底物二元、三元复合物的失活速度明显慢于游离酶,说明两个底物二氢叶酸和NADPH对酶的失活都具有一定程度的保护作用;②在脲作用下,酶的失活和构象变化均为单指数项过程,而且酶的活力丧失和三级结构变化是同时发生的,说明二氢叶酸还原酶的脲变性可能是一个"全或无"的两态过程;③在盐酸胍作用下,酶的构象变化为两相过程,而失活则是单指数项过程,酶分子构象变化的快相速度常数与失活速度常数基本一致,因此我们认为二氢叶酸还原酶的盐酸胍变性过程中存在一个没有活力、但仍具备一定空间结构的变性中间体。
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The influence of indentor radius on the plastic deformation has been discussed and some important results are as follows:(1) The influence of the ratio of ceramic coating thickness to indentor radius on the failure of coating, plastic deformation of substrate and crack propagation are obvious.(2)The propagation of crack in ceramic coating is assumes to be of semi-elliptical shape under normal contact with a rigid sphere.(3)Fatigue life of ceramic coating is mainly decided by substrate and load, the lower substrate elastic moduli and load, the more cycles of fatigue.
分析了压头半径对塑性变形的影响,模拟结果表明;(1)陶瓷涂层厚度和压头半径之比对涂层失效、基体塑性变形及裂纹的形成有显著影响;(2)在刚性球压头静态挤压条件下,陶瓷涂层中的预制裂纹按照椭圆形裂纹规律扩展;(3)陶瓷涂层的疲劳寿命与基体和载荷有很大关系,基体弹性模量越小,疲劳寿命延长。
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The apparatus has a substrate support, a gas directing shield circumscribing the substrate support and a shadow ring disposed vertically above the substrate support and gas directing shield for retaining the substrate.
该装置有一种衬底支架、一种包围所述衬底支架的气体引导护罩,和一种垂直布置在所述衬底支架和气体引导护罩上方的遮蔽环,用于挡住所述衬底。
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Theoretical analysis reveals that the formation of flower-like splats results from the interaction of surface tension, inhomogeneity of thermal contact resistance between flattening drop and substrate and substrate crater. The formation of the craters on the substrate is mainly controlled by substrate melting.
理论分析表明,&花瓣状&层片的形成是熔体表面张力、熔体与基底接触热阻的不均匀性和基底凹坑相互作用的结果;基底凹坑的形成主要由基底熔化所控制。
- 推荐网络例句
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However, as the name(read-only memory)implies, CD disks cannot be written onorchanged in any way.
然而,正如其名字所指出的那样,CD盘不能写,也不能用任何方式改变其内容。
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Galvanizes steel pallet is mainly export which suits standard packing of European Union, the North America. galvanizes steel pallet is suitable to heavy rack. Pallet surface can design plate type, corrugated and the gap form, satisfies the different requirements.
镀锌钢托盘多用于出口,替代木托盘,免薰蒸,符合欧盟、北美各国对出口货物包装材料的法令要求;喷涂钢托盘适用于重载上货架之用,托盘表面根据需要制作成平板状、波纹状及间隔形式,满足不同的使用要求。
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A single payment file can be uploaded from an ERP system to effect all pan-China RMB payments and overseas payments in all currencies.
付款指令文件可从您的 ERP 系统上传到我们的电子银行系统来只是国内及对海外各种币种付款。