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A mediator-less two-chambered microbial fuel cell was constructed with sodium acetate as substrate in the anode and carbon felt as cathode. The effects of different electron acceptors in the cathode, external resistances value, concentration of sodium acetate and different inoculation ways on electricity generation by the MFC were investigated.

以乙酸钠为阳极底物，碳毡材料为阴阳电极，构建了无介体双室微生物燃料电池(Microbial fuel cell， MFC)，研究不同阴极受体、外接电阻、乙酸钠浓度和不同接种方式等因素对电池产电性能的影响。

The method takes an ethanol suspension of monocrystal tungsten trioxide (WO3) nano-plates as a precursor, and utilizes the habit that the nano-plate with high diameter-thickness ratio tends to be parallel to a substrate and the principle that solvent volatilization causes the oriented self-assembly of the nano-plate to prepare the tungsten oxide (WO3) nano film which is formed by overlapping the tungsten trioxide (WO3) nano-plates and oriented along the [002] crystallographic direction.

本发明涉及一种取向氧化钨纳米薄膜的制备方法，该方法以单晶三氧化钨(WO 3 )纳米片的乙醇悬浮液为前驱物，利用高径厚比的纳米片趋向平趟于基底的习性，以及溶剂挥发诱发纳米片取向自组装的原理，制得由三氧化钨(WO 3 )纳米片叠加而成的沿[002]晶向取向的三氧化钨(WO 3 )纳米薄膜。

A top loaded antenna is provided that is composed of a triangular-shaped resonator and a dielectric substrate.

一种顶端负载之类梯形平面天线，其中，顶端负载之类梯形平面天线形成在一基板表面，并藕接至一射频电路。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

Purer tin oxide films were obtained at 900℃on CNTs substrates, and were obtained at around 1380℃on Si substrate.

在硅基材上，蒸发温度1380℃左右的温度范围内获得了二氧化锡薄膜。

In the light of the principle of electrochemistry , a series of experiments about the condition of GaAs films and AlGaAs films growth have been made by electrochemisuy deposition method .These experiments have been carried out with graphites as anode materials and conducting glass of tin dioxide ,stainless steel and aluminium foil of tin dioxide as cathode substrate materials in electrolyzers designed and made by ourselves and in the solution of compounded- simple sal.

根据电化学原理，采用电化学沉积方法，在自行设计及制作的电解装置中，以石墨作为阳极材料，SnO_2导电玻璃、不锈钢和SnO_2/Al 作为阴极衬底材料，在配制的简单盐溶液中，进行GaAs和AlGaAs 薄膜生长条件系列实验。

Structure analysis shows that the TiN films have the preferred crystal faces (111) and (200), and the depth of the films is about 20 nm with partial embedding in the substrate.

结构分析显示TiN主要沿(111)和(200)晶面生长，深度分析显示膜的厚度大约二十几纳米，膜质地均匀且在基底有一定的嵌入深度。

The results showed that stripping rates were strongly dependent on the concentration of H2O2 in alkaline solution and also affected by the crystal structure of TiN film. The aim of this study was to provide a formula solution for removing TiN film without damaging the substrate surface.

实验结果显示，碱性过氧化氢水溶液为蚀刻主要因子，并由此研究提供最佳之溶液组成配方，以达到去除氮化钛薄膜之应用，且在不损伤基材表面下完成。

In this study, alkanethiolate molecules with -CH3 terminated tail group chemically adsorb upon Au substrate and form Au-S bonds, which potentially act as ultra-thin resist films with excellent uniformity in molecular order and high resistivity to chemicals.

且因CH3 官能基表面具化学惰性，针对特定化学蚀刻液拥有抵抗化学腐蚀之能力，以此特性将可应用於制作微奈米等级图案的超薄蚀刻阻剂。

This paper presents conductive polymer molecular materials with insulating powder, mixed into the deployment of surge suppressors for low capacitance of paste, while the component design concept is based on the field of passive components, manufacturing process to make the basic theory to design the protective components, the main use of the existing ceramic substrate for the component body structure design, screen design in the body through the structure of the gap at the top of the printing layer of a different conductors, and then to learning to know the printing process technologies approach the low capacitance of the surge suppressor paste cover the gap in the two conductors, and by the resistance of plastic burning process technology, the temperature of sintering parts made of electrostatic protection element, and this protection through the external ESD components in bombardment tests, measurement of capacitance electrostatic discharge after bombardment, Trigger voltage and leakage current data, and the volume measured by the results of future discussion of the layout of this different style of work in the same area, different clearance, solid content and temperature than the next, for the attainment of performance components, a low capacitance ESD protection devices with low breakdown voltage requirements and to chip-based protection devices can be designed to integrate with the advanced Integrated Circuits or used independent of the electrostatic protection element in the system.

本文提出高分子导电分子材料搭配绝缘粉末，调配混合成适用於低电容突波抑制器之PASTE，而元件设计概念是以被动元件制程领域作基础理论去设计此防护元件，主体利用现有陶瓷基板为元件本体结构设计，在经由网版设计在本体结构上方印刷一层不同的间隙导体，再以习知印刷制程技术方式，将低电容突波抑制器之PASTE覆盖在两导体的间隙内，并经由电阻制程习知塑烧技术，将元件烧结适当温度制成静电防护元件；而此防护元件在经外加静电放电轰击测试后，量测静电放电轰击后的电容、Trigger voltage及漏电流相关数据，并藉由测结果讨此同的布局样式，在相同工作区面积、不同间隙、固含量与温度比下，对於元件效能是否达到静电防护元件低电容与低崩溃电压的需求，并藉此晶片型防护元件可设计整合於先进积体电或应用於独系统的静电防护元件中。

A carrier gas such as nitrogen is directed through line 20 and valve 22 to connect with line 26 and mix with the gas sample.

如氮气之类的载体通过管线20和阀22引入，与管线26相通，与气体样品混合。

But for the most part, knaves and parasites had the command of his fortune

然而支配他的家产的大多是恶棍和寄生虫。