查询词典 substrate

Most conventional methods for the extraction of substrate network were based on the use of frequency behavior of Y22 + Y21. However, we found that the feedback signal through the internal circuit elements makes the conductance of the substrate network underestimated while makes the susceptance of the substrate network overestimated. If conventional methods are directly performed on large area SiGe HBTs, a negative effective substrate resistance will be extracted. In the first part of the thesis, a new extraction method for the substrate network parameters of SiGe HBTs is proposed. When extracting the substrate network parameters, the feedback signal through internal circuit elements is considered. All the circuit elements of substrate network are extracted from Ysub instead of Y22 + Y21. The extracted substrate network parameters show a different bias dependence as compared to the conventional methods. By using a simple n+-p junction, we successfully explained the extracted bias dependent substrate network parameters. We developed a series linear regression equation to extracted the intrinsic circuit elements from the ABCD parameters. Compared with the conventional methods which extracted the circuit elements from Y-parameters or Z-parameters, the proposed method is much simple and easy to implement in the computer programs.

传统方法在萃取基板网路参数时，常常由所量得的Y22 + Y21来著手，但我们的研究发现，利用Y22 + Y21的频率关系来萃取基板参数时，基板网路的电导会被低估而基板网路的电纳则会被高估，另外传统基板网路参数萃取方法在萃取大尺寸元件基板网路参数时会得到负值基板等效电阻，以上的非理想效应皆因忽略部份信号会经由本质参数对基板网路做回授的影响，因此本论文中提出一个新的基板网路参数萃取方法，在萃取基板网路参数时考虑了由本质参数所回授的信号，并且由Ysub而非Y22 + Y21萃取基板等效电阻、基板等效电容及基板与集极空乏电容，成功的解决上述的一些非理想效应，所得到的基板网路参数与集极偏压的关系与传统方法所得的趋势相异，经由一个简单的模型成功的解释了所萃取得到的基板网路参数与偏压的关系，在萃取本质参数时，我们舍弃传统萃取方法中常用的Y参数或Z参数萃取方程式，而改用ABCD参数，并提出一系列的线性回归方程式，萃取所有的本质参数，与传统方法比较起来，比较简单而且容易建立在使用者的参数萃取软体中。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤：在硅衬底上形成可剥离树脂层；在所述可剥离树脂层上形成布线衬底；将半导体芯片安装在所述布线衬底上；通过用密封树脂密封所述多个半导体芯片来形成半导体器件；通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化；将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离；并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

The significant improvement might be caused by the Cu substrate which has higher thermal conductivity than conventional Sapphire substrate. However, Cu substrate is a ductile metal plate and easy to deform during the processing. The deformation of the Cu substrate will destroy the LEDs that were bonded on the Cu substrate. Finally, LEDs will be fabricated on the patterned Cu/Si substrate to make high-power LEDs and solve the deformation problem in processing.

主要是因为利用铜基材去取代蓝宝石基板使其具有较高的散热性，可以使元件在较高的饱和电流下驱动以达到高功率的目标，然而，铜金属是延展性佳的材料，因此，在整个元件的制做过程中，易造成发光二极体元件毁坏，利用本实验的方法可以提升制造高功率发光二极体之良率。

A computer of a system control device stores unique information inherent to the circuit substrate (52) such as a relative position of a child substrate position reference mark (266) of each child substrate (260) with respect to a substrate position reference mark (262) of the entire circuit substrate (52) while relating it to the identification code.

使与该识别编码对应付与的各子基板部(260)的子基板位置基准记号(266)对整个电路基板(52)的基板位置基准记号(262)的相对位置等作为电路基板(52)中特有的信息的特有信息存储在系统控制装置的计算机等中。

Through above numerical analysis of the TiN coating/substrate system, some typical rules about the fatigue failure are found:(1) the fatigue damage of a coating/substrate system appears first on the interface, then expands along the interface and to the substrate, and finally causes the coatings broken and spalled;(2) under the cyclic loadings of tangential sliding and radial extrusion, the equivalent plastic damage on the interface is mainly generated by the shear stress and the accumulated plastic contributed by the increments of shear stress. Thus the change of the shear stress is the main factor for the contact fatigue damages of coating/substrate system;(3) the frictional coefficient, external loading and coating thickness have some influence on the carrying capacity and contact fatigue life for a coating/substrate system.

通过对TiN涂层／基体系统的数值模拟分析，得到了涂层／基体系统疲劳失效的一些典型规律：(1)、涂层基体的初始损伤首先出现在交界面处，然后沿界面并向基体中扩展，最后导致涂层断裂而发生剥落失效；(2)、在切向滑动和径向挤压循环载荷作用下，交界面处的塑性损伤主要是由剪应力τ产生，塑性累积也是由于△τ的变化引起，说明循环过程中剪应力变化是影响涂层接触疲劳破坏的主要因素；(3)、材料摩擦系数、外界载荷大小以及涂层厚度都对涂层／基体系统的承载能力以及疲劳寿命都有一定影响。

Check the chromogen / substrate solution, the simplest test method is to mark a drop of antibody enzyme substrate added to the preparation of a good solution, if desired substrate color change occurs, you can rule out the substrate factors.

检查色原/底物溶液，最简单的检测方法是将一滴标记有酶的抗体加入到制备好的底物溶液中，如果底物发生预期的颜色变化，则可排除底物的因素。

A 2.8-inch (7.112 cm) homochromous flexible display was fabricated on a plastic substrate, which showed a luminance of 120 cd/m2 at a drive-voltage of 12 V. A top-emitting FOLED was fabricated on a metal substrate. The efficiency of FOLED is close to OLED on a glass substrate, and the CIE coordinates are about (x=0.69,y=0.31). The color purity of the top-emitting device on metal substrate is much improved.

在聚合物衬底上成功制备了2.8 inch（7.112 cm）的128×64单色FOLED显示屏，在驱动电压12 V时屏体亮度达到120 cd/m2；在金属衬底上，采用顶发光技术制备了FOLED元器件，顶发光器件与相对同发光层结构底发光器件有相近的电流效率，色坐标（x=0.69，y=0.31），色纯度优于相同发光层结构的底发光器件。

The results show that the composite coating is metallurgically bonded to the substrate and the microstructure is fine and uniform. The hardness of the composite coating is up to 400 HV, which is 2.5 times that of the substrate. Under room temperature and oil lubrication condition, the sliding wear tests indicate the friction coefficient and weight loss of the composite coating are smaller than those of substrate. The worn surface of the composite coatings is much smoother than that of the substrate, without grooves and crater.

结果表明，复合材料涂层与基体形成良好的冶金结合，微观组织细小、均匀；复合材料涂层硬度达400HV，约为基体的2.5倍；在室温油润滑条件下，滑动磨损试验表明复合材料涂层摩擦系数和失重均小于基体，磨损表面划痕较浅且平滑，无明显的犁沟、粘着、剥落现象；激光表面合金化显著提高了材料的耐磨性。

The apparatus has a substrate support, a gas directing shield circumscribing the substrate support and a shadow ring disposed vertically above the substrate support and gas directing shield for retaining the substrate.

该装置有一种衬底支架、一种包围所述衬底支架的气体引导护罩，和一种垂直布置在所述衬底支架和气体引导护罩上方的遮蔽环，用于挡住所述衬底。

Theoretical analysis reveals that the formation of flower-like splats results from the interaction of surface tension, inhomogeneity of thermal contact resistance between flattening drop and substrate and substrate crater. The formation of the craters on the substrate is mainly controlled by substrate melting.

理论分析表明，&花瓣状&层片的形成是熔体表面张力、熔体与基底接触热阻的不均匀性和基底凹坑相互作用的结果；基底凹坑的形成主要由基底熔化所控制。

A carrier gas such as nitrogen is directed through line 20 and valve 22 to connect with line 26 and mix with the gas sample.

如氮气之类的载体通过管线20和阀22引入，与管线26相通，与气体样品混合。

But for the most part, knaves and parasites had the command of his fortune

然而支配他的家产的大多是恶棍和寄生虫。