查询词典 solders

It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which cannot corrode carbon steel, stainless steel and solders like tin and lead.

仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、奥氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。

It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can't corrode carbon steel, stainless steel and solders like tin and lead.

仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。

The solder removing device comprises the restoring chamber(37) used to store the liquid heating medium whose temperature is above the solder's melting point, the substrate conveying machine used to convey the defectively soldered substrate in and out the solder treating pond, and the brush(45) used to rub the surface of the defectively soldered substrate immerged in the heating medium in the solder treating pond and rub off the solders which are over heated by the heating medium.

焊料移除设备(31)包括用于存储温度高于焊料的熔点的液体形式的加热介质的修复腔室(37)、用于输送有缺陷地焊接的基片进出焊料处理池的基片运输机、和用于摩擦浸入焊料处理池内的加热介质的有缺陷地焊接的基片的表面由此擦去通过加热介质过度加热的焊料的刷子(45)。

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；2002/691/EC

Lead in solders for the soldering to machined through hole discoidal and planar arrayceramic multilayer capacitors .

通孔盘状及平面陈列陶瓷多层电容器的焊料所含的铅。

EC 24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅

O 24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。

"Lead 铅",24,Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

EC 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅

The results indicated that the glass solders have good fluxion property around 600~640℃ and can seal with metal alloy and flat glass.

结果表明，玻璃焊料在600~640℃的流散性良好，能与金属合金、平板玻璃封接。

The intermetallic compounds are coarsened into nubbly Cu6 Sn5 phase by adding excessive Cu into Sn-Cu solder alloy. For Sn-9Zn-xCu solder alloys, the long needle-like Zn rich phase which is the mainly existing form of Zn in Sn-Zn solders is transformed into Cu5 Zn8 phase and fine Zn rich phase by the addition of 2% Cu, while CuZn phase and Cu6 Sn5 phase are formed in Sn-9Zn-10Cu bulk alloy. When soldering within short time under 260℃, the ripening and growth of IMC at Sn-xCu/Cu interface are accelerated with increasing Cu content in Sn-Cu solders.

结果表明，当Sn-Cu钎料中Cu的含量为2%时，基体中IMC粗化为块状的Cu6Sn8相；对于Sn-9Zn-xCu钎料合金，2%Cu元素的加入使得Sn-9Zn基体中长针状的富Zn相转化为Cu5Zn8相以及细小的富Zn相，而当Cu含量达到10％时，钎料基体中的IMC为CuZn相与Cu6Sn5相。

So that more consumers can enjoy more delicious quality, technology is even better than wine.

让更多的消费者可以品尝到品质更为鲜美，工艺更为精湛的葡萄酒。

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