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soldered相关的网络例句

查询词典 soldered

与 soldered 相关的网络例句 [注:此内容来源于网络,仅供参考]

It is simply a clevis soldered to the end of the rod itself.

这只不过是一clevis焊接到年底杆本身。

The bottom rudder (part 2) is connected to a soldered clevis ...

底部舵(第2部分)是连接到一个焊接

The servo rod was constructed from 1/8 brass rod with clevis soldered to each end.

伺服杆建造从1 / 8 黄铜棒与clevis '焊接到每个月底。

After drilling a hole for the brass tubing and another hole for the clevis, I mounted and soldered both horns in place.

后钻孔为黄铜油管和另一孔为clevis ,我安装和焊接都犀角,在地方。

The invention discloses the method and device for removing solder from the defectively soldered substrate.

披露了用于从有缺陷地焊接的基片移除焊料的方法和设备。

The solder removing device comprises the restoring chamber(37) used to store the liquid heating medium whose temperature is above the solder's melting point, the substrate conveying machine used to convey the defectively soldered substrate in and out the solder treating pond, and the brush(45) used to rub the surface of the defectively soldered substrate immerged in the heating medium in the solder treating pond and rub off the solders which are over heated by the heating medium.

焊料移除设备(31)包括用于存储温度高于焊料的熔点的液体形式的加热介质的修复腔室(37)、用于输送有缺陷地焊接的基片进出焊料处理池的基片运输机、和用于摩擦浸入焊料处理池内的加热介质的有缺陷地焊接的基片的表面由此擦去通过加热介质过度加热的焊料的刷子(45)。

If one square inch of copper is used as a heat dissipator for the TO-252, the J-A drops to approximately 50C/W. The SOT-223 package has a J-A of approximately 125C/W when soldered down to a minimum sized pattern (less than 0.1 square inch) and approximately 70C/W when soldered to a copper area of one square inch.

如果一平方英寸的铜是作为的TO - 252热消使用时,司法机构政务长下降到大约50 / W的的SOT - 223封装具有的司法机构政务长大约125C / W的焊接时下跌不到0.1平方英寸的最小尺寸为1型和大约70 / W型焊接时,一铜一平方英寸面积。

This paper discussed the mathematical model of speed control for keeping linear velocity of the welding torch with soldered dot on ellipse circumference constant.

主要讨论为保证焊枪相对于椭圆圆周上的焊点线速度恒定而进行的速度控制,以及保持焊枪始终在工件的焊接轨迹上而进行的位置控制的数学模型。

Devices should be soldered to boards rather than socketed, and of course, minimal air flow over the surface can greatly help reduce the package temperature.

焊接设备应以议会而不是嵌,当然,在表面最小空气流量可大大降低包装温度。

Results from dimension optimizing of soldered joints show that the stress will decrease monotonously with the height of the soldered joint.

焊点优化结果显示,焊点高度对应的应力值曲线具有明显的单调递减特性。

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