查询词典 solder

I plant the radiator using current advanced welding technology, in the process do not change the steel structure, the connection point of the solder joints using ultrasonic non-automatic laser welding, weld contact surface so that greater and more uniform, and no welding slag, to ensure welding safety, strengthened the combination of the Department of Welded Joints of alkali and acid mist erosion of professional skills, enhanced anti-corrosion products, while research and development of new technologies, new materials for new product development.

我厂散热器采用当前先进的焊接工艺，在加工过程中不改变钢的结构，连接点采用超声波无焊点的自动激光焊接，使焊缝接触面更大，更均匀，且无焊渣，确保了焊接的安全性，加强了焊口结合部的耐碱和酸薄雾侵蚀等专业技术，增强了产品的防腐蚀性能，同时不断的研发新技术，新材料用于新产品的开发。

After years of development, our company now owns several production plants, product categories include: metal die stamping products CNC automatic lathe parts lathe slingshot clockwork shrapnel Adiantum processing and touch solder South Korean chain dog chain buckle alloy products such as lobster clasps.

经过多年的发展，我公司现已拥有数个生产分厂，产品类别包括：五金模具冲压制品自动车床件数控车床加工弹弓发条弹片铁线加工及碰焊链条韩国链狗扣龙虾扣等合金制品。

The results show that heating at1500oC for 10 minutes in vacuum is the best brazing process. In the ceramic side none defects was observed at the interface of ceramic and solder, which leads to uniform brazing seam and excellent airtightness.

本文对单晶Al2O3/Pd/Nb焊接工艺、界面组织结构等进行了研究分析，结果表明在真空状态下，温度为1500℃，保温10分钟得到的焊缝均匀一致，没有任何的孔洞缺陷，气密性检测说明焊接情况良好。

My company is a company specializing in electronic assembly equipment and service providers, the overwhelming majority of the electronics industry to provide customers screen printing machine, SMT machine, reflow oven, wave soldering, solder paste mixer, solder paste printer, connected to Detect Units, on board machines, under the board machine, a plate feeder Electronics Units SMT production lines, such as the preparation, installation, debugging and so on.

我公司是一家专业电子组装设备及服务提供商，为电子行业的广大客户提供丝印机、贴片机、回流焊炉、波峰焊、锡膏搅拌机、锡膏印刷机、检测接驳台、上板机、下板机、出板接驳台等SMT电子生产线的筹建、安装、调试等。

The printed circuit assembly is IR or convection reflowed at a temperature between approximately 280 and 290 degrees C, and maintains solder connection integrity when the printed circuit assembly (36) is later incorporated into a second printed circuit assembly using a standard tin-lead solder system.

该印刷电路组件在约280―290℃的温度下通过IR或对流加热而发生回流，并且当该印刷电路组件（36）随后通过标准的锡―铅焊料系被安装至第二印刷电路板时维持焊料连接整体性。

In the microstructure of solder matrix, Ce-dope results in the formation of precipitated CeSn3 clusters in the reflowed solder matrix and the oxidation of CeSn3 clusters makes the tin whisker grow.

在添加稀土元素后，锡球内部可观察到CeSn3介金属，CeSn3氧化后可观察到锡须形成，导致此种无铅焊锡在使用上将因可靠度而受到限制。

Today the solder joint is widely adopted, as evidenced by the majority of cities and states that have written codes to include copper tube and solder joints as desirable for general plumbing, water lines, vent, stack, waste and drain lines, as well as other uses in industry.

如今，焊料连接已经被广泛采用，证据就是美国大多数城市和州的正式规程中都将铜管道和焊料连接作为一般管件、水管线、通风、烟道、废水和排水管道以及其他工业用途的理想连接方式。

There are remedies: brass powder with glue; soldering iron solder to fill the spot welding or Tin solder mercury generation; 5-15 v of rectifier to brush plating in their simplest form to fix it.

功后的挽回办法有：用胶水增铜金粉加添；烙铁焊锡点焊或锡汞代锡焊；用5～15V的整流电源以刷镀工艺的最单一的步地息补缀。

In this paper, the electrical control system for SMT solder-reflow machines is designed, based on the SMT solder temperature curve.

本文围绕SMT回流焊温度曲线的控制要求，对SMT回流焊电控制系统进行了设计和开发。

But the use of Sn/Pb alloy solder is one of the important sources of pollution in manufacture and use of Sn/Pb solder process, because of the melting temperature is higher, there are lots of lead steam escaping, will directly affected operation personnel's physical health.

大量使用的Sn/Pb合金焊料正是造成污染的重要来源之一，在制造和使用Sn/Pb焊料的过程中，由于熔化温度较高，有大量的铅蒸气逸出，将严重影响操作人员的身体健康。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。