查询词典 solder

And the different section shape of the solder joint is given with the variation of solder volume.

给出了不同的钎料量对应的焊点剖面形态的变化。

The experimental results show that the melting point of Sn-3Ag-1.5Sb-xCu solder decreases with Cu addition and the solder with 1.0 wt-%Cu is a narrower mushy range between solidus and liquidus.

本研究在探讨对Sn-3Ag-1.5Sb无铅焊料中添加0~1.5wt_%Cu对其焊点於焊接后与高温热储存后的微观组织及拉伸强度的影响。

Under strict quality control of CQC, kaina lead-free solder is used in high-purity refined tin and advanced smelting technology, a unique anti-oxidant formula alloy, its taphole amount is very small, bright solder joints, reliable, good wetting, it is suitable in lead-free wave soldering and hot dip soldering

在CQC严密的质量监控下，凯纳无铅焊锡条采用高纯度精锡及先进的熔炼工艺，独特的抗氧化合金配方，其出渣量极少，焊点光亮、可靠，湿润性好，适用于无铅波峰焊和热浸焊。本企业供应58℃～145℃不同熔点温度的无铅低温焊锡条。

Tackle key problem through the technology and the application of new and high technology, enrage on the west east be defeated by a project to be reached from tubal material make a valve, solder, inside system of pressure boost of Tu Fu, compressor is optimized, the nondestructive that automation control goes to to flowmeter is measured and solder detects the respect such as the technology gained revolutionary headway.

通过技术攻关和高新技术的应用，西气东输工程从管材及制管、焊接、内涂敷、压缩机增压系统优化、自动化控制到流量计量和焊接的无损检测技术等方面都取得了突破性进展。

A computer-aided system is developed to predict solder joint shape in microelectronics interconnection, and visuality of predicting and analyzing solder joint shape is realized.

提出并设计了焊点形态的剖视分析方法，以RCChip焊点为例，考察了焊点结构参数对焊点三维形态的影响规律，并进行了试验验证。

At the same time the wettability of solder and the strength and hardness of solder joint were measured.

同时测量了钎料的润湿性能、接头强度与硬度。

The above results are of general importance and can be used to improve the solder joint reliability of surface mount components with castellated solder fillet, the design level and the manufacturing process in SMT.

本文研究从提高SMT焊点可靠性、提高组装密度和避免焊点缺陷的角度出发，对高可靠性SMT焊点形态的设计和评价建立了四点规则，对提高有边堡钎料圆角形态表面组装元件的焊点可靠性、提高SMT工艺设计水平具有普遍意义。

The intermetallic compounds are coarsened into nubbly Cu6 Sn5 phase by adding excessive Cu into Sn-Cu solder alloy. For Sn-9Zn-xCu solder alloys, the long needle-like Zn rich phase which is the mainly existing form of Zn in Sn-Zn solders is transformed into Cu5 Zn8 phase and fine Zn rich phase by the addition of 2% Cu, while CuZn phase and Cu6 Sn5 phase are formed in Sn-9Zn-10Cu bulk alloy. When soldering within short time under 260℃, the ripening and growth of IMC at Sn-xCu/Cu interface are accelerated with increasing Cu content in Sn-Cu solders.

结果表明，当Sn-Cu钎料中Cu的含量为2%时，基体中IMC粗化为块状的Cu6Sn8相；对于Sn-9Zn-xCu钎料合金，2%Cu元素的加入使得Sn-9Zn基体中长针状的富Zn相转化为Cu5Zn8相以及细小的富Zn相，而当Cu含量达到10％时，钎料基体中的IMC为CuZn相与Cu6Sn5相。

It has been found that although electrical failure was caused by solder joint crack, it was the underfill related failures that cause the solder joint crack.

在此基础上，揭示了倒装芯片封装的失效机理：焊点断裂是导致封装电失效的原因，而下部填充料中的损伤是引起焊点断裂的主要原因。

The cause for open is the epoxy underfill between the solder bumps expanded and made the solder bumps ruptured , In the end, some precautions for reducing such failures are presented.

提出了针对这种形式封装的器件在使用过程中的注意事项及预防措施，以减少该类失效情况的发生。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。