查询词典 solder

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

Narrow in chip bulk, and below the circumstance that solder mat span also narrows subsequently, bougie equipment and bougie check are quick and correct ground and solder mat contact, become chip to detect the key of future of science and technology and development direction.

在芯片体积缩小，以及焊垫间距亦随之缩小的情况下，探针行动措施与探针卡迅速且正确地与焊垫接触，便成为芯片检测科技未来的重点和成长标的目标。

When the soldering temperature and soldering heat-retaining period is identical, the diffusibility of Cu in the rapid-solidifying solder is remarkably higher than that of the ordinary solder.

同时，在相同的钎焊条件下，快冷钎料Cu元素的扩散能力均比普通钎料的扩散能力强。

in the paper, solder joint shape is predicted through inputting data files to surface evolver software. then the flip-chip solder joints shape can be formed by the software.

本文通过用于焊点形态预测软件surface evolver的输入数据文件，得到倒装焊焊点形态。

Practicability of Surface Evolver in evolving prediction of SMT solder joint is reviewed and validated. Chapter five: finite element analysis method based on minimal energy principle with application of Surface Evolver is firstly used in evolving prediction of the kind of BGA solder joint shape.

基于最小能量原理的有限元数值分析方法与边界值积分数学分析方法相比，能更有效地求解各类SMT焊点三维形态成形预测问题，并具有很好的热应力分析延续性和良好的分析精度。

The modal tests of PCB and PCB assembly (free boundary condition and fixed boundary condition) were carried out. The equivalent elastic modulus and damping parameters of PCB can be gained, and the fixed boundary condition of finite element model was also determined. These will help to the following work. Second, drop impact tests of three different heights were carried out. Strains and acceleration responses of PCB were measured. Failed BGA packages of different test conditions were dyeing, and cross section analysis of failed solder joints was conducted. It was found in our drop tests that the root cause of lead-free solder joints under drop impact was the combined effect of mechanical shock and PCB bending vibration.

针对JEDEC标准试件的局限性，提出了设计便于统计学研究焊点可靠性的试验试件的构想，利用有限元模态分析方法确定并验证了用圆形PCB组件替代JEDEC标准试件的可行性；通过一系列模态试验和有限元模态分析，确定了圆形PCB组件的相关试验参数，这不仅为跌落碰撞下PCB组件有限元模拟确定了较为合理准确的有限元模型，而且为正确地评价跌落碰撞下PCB组件的可靠性问题奠定了基础。

The melting point, wettability and corrosion resistance of solder were measured and analyzed; the microstructure of the solder were observed using photomicrography.

测试优选合金的熔点和耐腐蚀性能，并对接头微观组织进行观察。

This is for reflow solder, not for flow solder.

这对于回流焊接，而不是流焊锡。

""I have known Captain Savery, at York's buildings, to make steam eight or ten times stronger than common air; and then its heat was so great that it would melt common soft solder, and its strength so great as to blow open several joints of the machine; so that he was forced to be at the pains and charge to have all his joints soldered with hard solder.

""我知道（萨弗里队长，在纽约的建筑物，使蒸汽八名或10倍强，比常见的空气；然后，其热量是如此巨大，它将熔体常见的软钎料，其强度很大，吹开几个节点的机器；使他被迫要在痛苦和主管有他的所有接头焊接硬钎料。

According to the characteristics that SMT solder joint quality is related to its 3-D geometrical shape directly, theory of solder joint shape was put forward.

根据SMT焊点质量与焊点的三维几何形态直接相关的特点，提出了SMT 焊点形态理论。

In the United States, chronic alcoholism and hepatitis C are the most common ones.

在美国，慢性酒精中毒，肝炎是最常见的。

If you have any questions, you can contact me anytime.

如果有任何问题，你可以随时联系我。