查询词典 solder

Narrow in chip bulk, and below the circumstance that solder mat span also narrows subsequently, bougie equipment and bougie check are quick and correct ground and solder mat contact, become chip to detect the key of future of science and technology and development direction.

在芯片体积缩小，以及焊垫间距亦随之缩小的情况下，探针行动措施与探针卡迅速且正确地与焊垫接触，便成为芯片检测科技未来的重点和成长标的目标。

When the soldering temperature and soldering heat-retaining period is identical, the diffusibility of Cu in the rapid-solidifying solder is remarkably higher than that of the ordinary solder.

同时，在相同的钎焊条件下，快冷钎料Cu元素的扩散能力均比普通钎料的扩散能力强。

in the paper, solder joint shape is predicted through inputting data files to surface evolver software. then the flip-chip solder joints shape can be formed by the software.

本文通过用于焊点形态预测软件surface evolver的输入数据文件，得到倒装焊焊点形态。

Practicability of Surface Evolver in evolving prediction of SMT solder joint is reviewed and validated. Chapter five: finite element analysis method based on minimal energy principle with application of Surface Evolver is firstly used in evolving prediction of the kind of BGA solder joint shape.

基于最小能量原理的有限元数值分析方法与边界值积分数学分析方法相比，能更有效地求解各类SMT焊点三维形态成形预测问题，并具有很好的热应力分析延续性和良好的分析精度。

The modal tests of PCB and PCB assembly (free boundary condition and fixed boundary condition) were carried out. The equivalent elastic modulus and damping parameters of PCB can be gained, and the fixed boundary condition of finite element model was also determined. These will help to the following work. Second, drop impact tests of three different heights were carried out. Strains and acceleration responses of PCB were measured. Failed BGA packages of different test conditions were dyeing, and cross section analysis of failed solder joints was conducted. It was found in our drop tests that the root cause of lead-free solder joints under drop impact was the combined effect of mechanical shock and PCB bending vibration.

针对JEDEC标准试件的局限性，提出了设计便于统计学研究焊点可靠性的试验试件的构想，利用有限元模态分析方法确定并验证了用圆形PCB组件替代JEDEC标准试件的可行性；通过一系列模态试验和有限元模态分析，确定了圆形PCB组件的相关试验参数，这不仅为跌落碰撞下PCB组件有限元模拟确定了较为合理准确的有限元模型，而且为正确地评价跌落碰撞下PCB组件的可靠性问题奠定了基础。

The melting point, wettability and corrosion resistance of solder were measured and analyzed; the microstructure of the solder were observed using photomicrography.

测试优选合金的熔点和耐腐蚀性能，并对接头微观组织进行观察。

This is for reflow solder, not for flow solder.

这对于回流焊接，而不是流焊锡。

""I have known Captain Savery, at York's buildings, to make steam eight or ten times stronger than common air; and then its heat was so great that it would melt common soft solder, and its strength so great as to blow open several joints of the machine; so that he was forced to be at the pains and charge to have all his joints soldered with hard solder.

""我知道（萨弗里队长，在纽约的建筑物，使蒸汽八名或10倍强，比常见的空气；然后，其热量是如此巨大，它将熔体常见的软钎料，其强度很大，吹开几个节点的机器；使他被迫要在痛苦和主管有他的所有接头焊接硬钎料。

According to the characteristics that SMT solder joint quality is related to its 3-D geometrical shape directly, theory of solder joint shape was put forward.

根据SMT焊点质量与焊点的三维几何形态直接相关的特点，提出了SMT 焊点形态理论。

And the different section shape of the solder joint is given with the variation of solder volume.

给出了不同的钎料量对应的焊点剖面形态的变化。

The circulation, consumption and reproduction of the trilogy have not only testified to its historical significance and literariness, but also invested it with new meanings.

该三部曲的流通、消费与再生产不仅验证了其历史意义及文学性，而切还赋予它以新的意义。

If he thought that he could buy me off, he would be wrong.

如果他认为他可以收买我，那他就大错特错了。