查询词典 solder

Several factors that affect the stability of solder bridging spanning two identical circular pads are considered herein, including the pad size, the total volume of solder bumps, the pitch between adjacent pads, the contact angle between the molten solder alloy and the pad, the contact angle between the molten solder alloy and the solder mask and the surface tension of the molten solder alloy, respectively.

锡桥稳定性之影响因子，如垫片尺寸、焊锡凸块总体积、相邻垫片脚距、熔融焊锡与垫片间之接触角、熔融焊锡与防焊层间之接触角以及熔融焊锡之表面张力等均分别予以有系统之探讨。

The solder removing device comprises the restoring chamber(37) used to store the liquid heating medium whose temperature is above the solder's melting point, the substrate conveying machine used to convey the defectively soldered substrate in and out the solder treating pond, and the brush(45) used to rub the surface of the defectively soldered substrate immerged in the heating medium in the solder treating pond and rub off the solders which are over heated by the heating medium.

焊料移除设备(31)包括用于存储温度高于焊料的熔点的液体形式的加热介质的修复腔室(37)、用于输送有缺陷地焊接的基片进出焊料处理池的基片运输机、和用于摩擦浸入焊料处理池内的加热介质的有缺陷地焊接的基片的表面由此擦去通过加热介质过度加热的焊料的刷子(45)。

The influence of the size of pad and solder bump, the volume of eutectic solder and reflow temperature on the geometry of duplex SnPb solder joint with high Pb solder bump and eutectic SnPb fillet was simulated by finite element method with the software of SURFACE EVOLVER.

应用SurfaceEvolver软件，对含高铅焊料芯片凸点和共晶SnPb焊料形成的复合焊点的形态进行了有限元模拟，考察了焊盘大小、芯片凸点尺寸、焊料体积、焊接温度等焊点的设计及工艺参数对焊点形态的影响。

To solder a connector: Remove insulating tape of Red wire and solder to positive terminal of a connector, then remove insulating tape of Black wire and solder to the negative terminal of connector.

施以焊接一个联编者：距离使红色电线和一个联编者的积极终端机方面的焊接剂的音带绝缘，当时距离使黑色电线和联编者的否定终端机方面的焊接剂的音带绝缘。

SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.

进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验，并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。

This system is manufactured by Wainwright Instruments and is known as "Minimount" in Europe and "Solder Mounts" in the USA.

这个装置是由 Wainwright Instruments 公司制作的，在欧洲名为" Minimount "，在美国则称为" Solder Mounts "。

This company is a scitech enterprise mainly involved in researching, developing, and producing tin solder thread,tin solder bar,tin solder paste, solder, environment-oriented detergent, and industrial soft solder materials.

本公司是一家主营焊锡丝、焊锡条、无铅焊料、焊锡膏、助焊剂、环保型清洗剂等电子、电工业用软钎焊用材料研发与生产的科技型企业。

The dual solder pot capability provides some interesting opportunities, such as, 1 the ability to populate the solder pots with different solder alloys, 2 operate the solder pots at different solder temperatures, or 3 use one as a gold scavenge solder pot and the other as a clean solder pot.

锡炉的双重功能提供了一些有趣的机会，例如，1）的能力来填充合金，焊料罐2不同焊料）经营，或三盆不同焊锡焊接温度）的使用和清除之一金锡炉作为一种清洁的其他锡炉。

Ordinary solder materials, lead-free solder, the lead-free solder wire, solder paste, solder, the solder wire , high temperature tin, the low-temperature tin-line, lead-free tin-silver, the lead-free tin-silver line, low-temperature lead-free tin line, welding aluminum tin, the tin-aluminum welding wire, welding wire stainless steel tin, aluminum welding flux not stainless steel flux, environmental flux, welding of stainless steel, nickel, special aluminum solder, aluminum flux, aluminum brazing soft agent, paint remover, paint stripping powder (high-temperature paint stripping enameled wire a few seconds), copper aluminum welding, aluminum and aluminum welding, wire flux of new environmental protection (smoke-free and tasteless, non-volatile non-flammable) peaks of water-soluble flux, no-clean rosin flux, no-clean flux, thinners, cleaning agents, plate washer water , clean water machine, special purposes, such as water-soluble flux.

普通焊锡材料，无铅焊锡条、无铅焊锡线、焊锡膏，焊锡条、焊锡线、高温锡条、低温锡线、无铅含银锡条、无铅含银锡线、无铅低温锡线、焊铝锡条，焊铝锡线、焊不绣钢锡线、焊铝助焊剂、不绣钢助焊剂、环保助焊剂、焊不锈钢、镍、铝特种焊料、铝助焊剂、铝的软钎剂、脱漆剂、脱漆粉、铝铜焊接、铝与铝焊接、环保新型线材助焊剂(无烟无味、不挥发不易燃)水溶性波峰助焊剂、免清洗松香助焊剂、免清洗助焊剂、稀释剂、清洗剂、洗板水、抹机水、特殊用途水溶性助焊剂等。

The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.

摘 要：研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响，电子探针分析表明：化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应；而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu，Sn互扩散和相互反应，界面反应产物仍以Cu6Sn5为主。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。