查询词典 silver plating

Our process capability: Plates: FR4, High TG FR4, high CTI FR4, high frequency materials, halogen-free materials, aluminum and other low-rise Materials :2-20 layer of finished copper thickness :0.5-5 OZ finished thickness: 0.2 -6.0mm Minimum line width: 3mil Minimum line spacing: 3mil smallest shape tolerances:+/-0.1mm minimum finished diameter: 0.1mm maximum thickness aperture ratio: 12:1 wide minimum solder bridge: 4mil characters minimum line width: 5mil Minimum height of characters: 30mil Solder Mask Color: Green, black, blue, white, yellow, purple characters such as color: white, yellow, black and other surface processes: spray tin, lead-free HASL, Electroless gold plating Shuijin, OSP, chemical Shen tin, silver and other chemicals Shen Process: Goldfinger, blue gum, Blind-via/Buried-via, characteristic impedance control, rigid-flexible combination of reliability testing such as: Open / Short testing, impedance testing, solderability testing, thermal shock testing, metallographic analysis of micro-slice curvature Isoptera: 0.7% flame retardant Level: 94V-0

我们公司的制程能力：板材：FR4、高TG FR4、高CTI FR4、高频材料、无卤素材料、铝基材料等层数：2-20层成品铜厚：0.5-5 OZ成品板厚：0.2-6.0mm最小线宽：3mil最小线间距：3mil最小外形公差：+/-0.1mm最小成品孔径：0.1mm最大板厚孔径比：12：1最小阻焊桥宽：4mil最小字符线宽：5mil最小字符高度：30mil阻焊颜色：绿色、黑色、蓝色、白色、黄色、紫色等字符颜色：白色、黄色、黑色等表面工艺：喷锡，无铅喷锡、化学沉金、电镀水金、OSP、化学沉锡、化学沉银等其它工艺：金手指、蓝胶、盲埋孔、特性阻抗控制、刚柔结合等可靠性测试：开/短路测试、阻抗测试、可焊性测试、热冲击测试、金相微切片分析等翅曲度：≤0.7%阻燃等级：94V-0

Basic principle and technology of the cyanide free silver brush plating on copper substrates are researched.

探讨了铜基无氰电刷镀银的基本原理和施镀工艺。

The process flow is: that the original steel plate, that is, the original mould, Yin, maintop pattern concave, pressed plastic version —— welding by stamp layout: skinpass page make up layouts guniting silver, copperizing-nickel-coated, cavity (for positive and maintop pattern convexes)—— a printing plate nickel plating shall be guilty of submodules, concave maintop pattern--a printing plate chromeplating treasure…every two pieces by mechanical bent of the semisircle package 5.1 core-students'computer proofing-business card printing and membership card.

其工艺功程是：邮票原钢版，即原模，晴图、版纹凹形，冲不抬塑料版——按邮票版式割切拆版——裂缝版面——喷银、镀铜——镀镍(为母模，阳图、版纹凸形)——镀镍为印版，即子模，版纹凹形——印版镀铬——把两块印版用板滞弯不败半圆形包在滚筒芯上——上机打样——制卡和会员卡制作。

The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.

探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。

Study on electroless silver and nickel plating on PET fabric ....

吸收和反射能力。研究表明袁反射效能不仅和材料表。。。

A lacy openwork bead of sterling silver with 14 karat gold plating.

阿蕾丝镂空珠的纯银，14 K金电镀。

The titanium surface is treated by sandblast, mechanical abrasion, chemical corrosion, etc, and activated before brush plating, so as to effectively improve the cohesion between titanium substrate and silver coating.

采用无氰电刷镀银溶液，通过对钛基体进行喷砂、机械打磨、化学刻蚀等表面处理，电镀前再经过表面活化，可有效地提高钛基体与镀银层之间的结合力。

In this paper, the silver coated aluminum powder which had good electric property and stable property was produced by twice electroless plating.

本文利用双重化学镀的方法成功的获得了导电性优良、性能稳定的镀银铝粉。

Factory production,"Lin Wei-Feng" brand plating silver plate stable and superior quality of imported products in South Korea.

本厂生产的"威凛峰"牌电镀银板质量稳定且优于南韩的进口产品。

The AgYb2 O3 composite powders were prepared by electroless plating of silver on ytterbia.

1引言银基金属氧化物触点材料是研究和应用最广的触点材料体系。

In the negative and interrogative forms, of course, this is identical to the non-emphatic forms.

。但是，在否定句或疑问句里，这种带有"do"的方法表达的效果却没有什么强调的意思。

Go down on one's knees;kneel down

屈膝跪下。。。下跪祈祷