查询词典 silicon wafer

High-energy laser pulses are utilized to ablate the unpolished surface of silicon wafer and slide glass and morphology and nanomechanical properties of the sample surface are characterized.

采用高能量飞秒激光脉冲对硅片和载玻片的未抛光表面进行了烧蚀，对烧蚀后样品的表面形貌和纳米力学性能进行了检测。

The effect of rapid thermal processing on oxygen precipitates profile and denude zone in Czochralski silicon wafer during simulating CMOS processing is investigated.

本文研究了快速热处理工艺在模拟的CMOS热处理工艺中对直拉硅单晶中氧沉淀和洁净区的影响。

Newer processes such as chemical mechanical polishing and silicon wafer dicing can be better understood as tribological processes.

更新的过程，例如化学机械擦亮和掷骰子赌博的矽片，可能被作为tribological 过程理解得好。

Silicon wafer and DLC substrates were used to study the effect of substrates on spreading.

用硅片和DLC膜研究了基体的影响。

Hossam Haick and colleagues at the Technion-Israel Institute of Technology in Haifa embedded the 5-nanometer-long gold nanoparticles in a silicon wafer and then collected exhaled air from 40 cancer patients and 56 people with healthy lungs.

以色列海法市以色列科技理工学院的霍萨姆·海克及同事，把直径为5纳米长的纳米级金粒子压入一张硅片上，然后从40个癌症病人和56个肺部健康的人那里收集呼出的气体。

Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.

芯片：单回路或元件的硅晶元，无引脚的电子元件。

A beam of light (typically ultraviolet light from a mercury arc lamp) shines through the chromium mask, then passes through a lens that focuses the image onto a photosensitive coating of organic polymer on the surface of a silicon wafer.

一束光（通常是汞弧灯发出的紫外光）先穿透铬光罩，然后通过透镜把影像聚焦在晶圆表面的有机高分子感光涂料。

In semiconductor technology the manufacture of transistors and integrated circuits,involving microcircuit patterns on a silicon wafer,is required.

半导体技术的晶体管和集成电路制造、晶圆的模式包括微电路，是必要的。

Photoluminescent porous silicon was prepared by electrochemical dissolution of silicon wafer in HF solution.

在本文的第一章中，对当前多孔硅研究领域的研究成果进行了综述。

The new generation of laser scribing machine is capable of scribing silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.

激光划片系统主要应用于硅片，硅太阳能电池片，陶瓷片和薄金属片的划片与切割。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。