查询词典 scanning

On the base of the single-diameter laser-scanned measuring technology, a double direction laser-scanned measuring system is presented. Which combinate the laser-scanned measuring technology with special optical system. In the system, the collimation semiconductor laser-scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made. The beams with the dimension information of two perpendiculars direct are processed by the scanning receive system, the high-speed photoelectric transition and electronic data process. Two measured results of the diametric directs and ellipse tolerance,etc, parameter, of the turning workpiece on the same plane are obtained by non-contact automatic measurement. The problem of non-contact measurement of two perpendiculars direct of one plane of turning workpiece is settled. It processes many peculiarities, such as high speed, high accuracy and non-contact automatic measurement, etc.

在单向激光扫描检测技术的基础之上，提出了一种双向激光扫描检测系统，其采用激光扫描检测技术与特殊光学系统相结合，用准直半导体激光扫描光束对被测工件径向某一截面的两个相互垂直方向同时扫描，经扫描接收光学系统、高速光电变换、电子学系统和微机数据处理系统，对将携带有垂直方向被测量信息的光束进行处理，实现了回转体工件同一截面两个垂直方向的径向尺寸和椭圆度等参数的非接触自动测量，解决了同时非接触测量回转体零件同一截面两个径向尺寸的难题，它具有高速，高精度和非接触自动测量等特点。

In the system , the collimation semiconductor laser - scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made . the beams with the dimension information of two perpendiculars direct are processed by the scanning receive system , the high - speed photoelectric transition and electronic data process . two measured results of the diametric directs and ellipse tolerance , etc , parameter , of the turning workpiece on the same plane are obtained by non - contact automatic measurement

在单向激光扫描检测技术的基础之上，提出了一种双向激光扫描检测系统，其采用激光扫描检测技术与特殊光学系统相结合，用准直半导体激光扫描光束对被测工件径向某一截面的两个相互垂直方向同时扫描，经扫描接收光学系统、高速光电变换、电子学系统和微机数据处理系统，对将携带有垂直方向被测量信息的光束进行处理，实现了回转体工件同一截面两个垂直方向的径向尺寸和椭圆度等参数的非接触自动测量，解决了同时非接触测量回转体零件同一截面两个径向尺寸的难题，它具有高速，高精度和非接触自动测量等特点。

The fabrication of fibers was attempted. The copolymers, the copolymers containing MOCT and the copolymer films containing MOCT were characterized by using Fourier Transform Infrared Spectroscopy, Scanning Electron Microscopy, Differential Scanning Calorimetry, Thermogravimetric Analyzer and X-ray Diffraction etc. The conclusions were summarized as following,1. The AN/MMA copolymers were testified that copolymerization of most AN and MMA occurred and the ratio of AN and MMA in copolymer was less than the ratio of monomers. With the increase of the contents of MMA, the viscosity of copolymer solution, molecular weight and decomposition temperature of copolymers increase.

通过傅立叶变换红外光谱、扫描电子显微镜、差示扫描量热分析、热重分析、X-射线衍射分析等测试方法对得到的AN／MMA共聚物、含有正十八烷微胶囊的共聚物以及共聚物膜等进行了测试和分析，得到如下的研究结论： 1、丙烯腈—甲基丙烯酸甲酯之间发生了聚合反应，共聚物的组成比略小于投料比；共聚物的粘度和分子量随着第二单体MMA加入量的增加有增大的趋势；第二单体加入量的增大使得共聚物的分解温度升高，通过热重分析证实当AN／MMA摩尔比为85／15时，共聚物的耐热稳定性较高。

The development of phase separation were followed by optical microscopy, scanning electron microscopy, transmission electronic microscopy, Synchrotron Radiation soft X-ray contact microscopy, time resolved light scattering, differential scanning calorimeters and rheometer.

本论文系统研究热塑性树脂改性环氧体系相分离过程中的流变行为，通过光学显微镜，扫描电子显微镜，透射电子显微镜，软X射线显微术，时间分辨激光光散射和DSC等仪器跟踪研究相分离过程，与体系的流变行为相对照，探究反应诱导粘弹相分离过程中流变行为。

In this work the rheological behaviors during phase separation in thermoplastic modified epoxy resin were systemically investigated. The development of phase separation were followed by optical microscopy, scanning electron microscopy, transmission electronic microscopy, Synchrotron Radiation soft X-ray contact microscopy, time resolved light scattering, differential scanning calorimeters and rheometer.

本论文系统研究热塑性树脂改性环氧体系相分离过程中的流变行为，通过光学显微镜，扫描电子显微镜，透射电子显微镜，软X射线显微术，时间分辨激光光散射和DSC等仪器跟踪研究相分离过程，与体系的流变行为相对照，探究反应诱导粘弹相分离过程中流变行为。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Methods Total 474 patients were performed with plain CT scanning. 167 patients underwent ducal and delayed dynamic contrast enhanced CT scanning. According to different diseases, multiple planar reconstruction and three dimensional volume reconstruction were used on 72 patients.

运用16层螺旋CT扫描速度快，重建功能强大的有利条件，对474例患者行泌尿系平扫，167例行双期、延迟期扫描，根据病变情况对72例进行了MPR、3D、CPR等重建。

In this paper the effects of scanning truncation error, scanning position error, random amplitude and phase error, and multiple-reflection error in near-field antenna measurement are analyzed; error equations and the uncertainty of measurement are obtained through computer simulation; compensated techniques for reducing the effects of measurement errors in near-field antenna measurement are presented and the formula and arithmetic of phaseless near-field techniques are derived.

本文从解析法和数值仿真两个角度深入分析口面天线近场测量中扫描面截断误差、扫描面位置误差、随机幅相误差、多次反射误差等误差源对天线远场特性测量精度的影响，一方面从理论上给出相应的误差方程，另一方面建立误差分析模型，通过计算机模拟，得到不同误差条件下测量结果的不确定度，并介绍了减小这些误差的修正方法，推导无相位近场测量的公式和算法。

Scanning Tunneling Microscope/Scanning Force Microscope with atomic resolution were used to observe and measure the feature and the size of the damage in conductor and insulator, and also the relationship with the energy deposition of incident ions in solids.

分别利用具有原子分辨能力的扫描隧道显微镜/扫描力显微镜观测了离子轰击导电和绝缘材料产生孤立损伤的形态、大小。

Scanning Gantry The objective of the scanning system is to obtain enough information to reconstruct an image of the cross section of interest.

龙门扫描该扫描系统的目的是为了获得足够的信息来重建一个感兴趣的截面图像。

Breath, muscle contraction of the buttocks; arch body, as far as possible to hold his head, right leg straight towards the ceiling (peg-leg knee in order to avoid muscle tension).

呼气，收缩臀部肌肉；拱起身体，尽量抬起头来，右腿伸直朝向天花板（膝微屈，以避免肌肉紧张）。

The cost of moving grain food products was unchanged from May, but year over year are up 8%.

粮食产品的运输费用与5月份相比没有变化，但却比去年同期高8％。