查询词典 resin

Plastic should lower 3 steps, because plastic is a step to add melt resin material to cyclinder , Higher stick of resin material ,higher screw back pressure. Screw speed differs depending on decomposing temperature of resin material ,Higher screw speed ,Higher trim force of resin, higher cyclinder temperature. Some resin material may decomposes so it set screw speed in mid-speed such as 45-75%, In plastic step setting screw back pressure is very important, Higher screw back pressure ,higher quality of product screw back pressure make resin structure order, Molding product is beautiful and volume stable.

再复杂的熔胶旋转过程最多不会超过三段，因为熔胶本身就是存在于把胶熔进料筒的过程，如果原料粘度大，熔胶压力则大，但速度则应取决于原料的分解温度，熔胶速度越快，原料中的剪切力则会越大，料管温度则越高，局部原料产生分解的可能性则会越大，故一般熔胶会采用中速为宜，如45%-75%，熔胶同时会碰到一个比较重要的环节，那就是背压的使用，产品精度要求越大，背压的使用则更大，背压可使原料分子间结构更紧密，成型出的产品则尺寸更稳定，外观越好。

Plastic should lower 3 steps, because plastic is a step to add melt resin material to cylinder , Higher stick of resin material ,higher screw back pressure. Screw speed differs depending on decomposing temperature of resin material ,Higher screw speed ,Higher trim force of resin, higher cyclinder temperature. Some resin material may decomposes so it set screw speed in mid-speed such as 45-75%, In plastic step setting screw back pressure is very important, Higher screw back pressure ,higher quality of product screw back pressure make resin structure order, Molding product is beautiful and volume stable.

再复杂的熔胶旋转过程最多不会超过三段，因为熔胶本身就是存在于把胶熔进料筒的过程，如果原料粘度大，熔胶压力则大，但速度则应取决于原料的分解温度，熔胶速度越快，原料中的剪切力则会越大，料管温度则越高，局部原料产生分解的可能性则会越大，故一般熔胶会采用中速为宜，如45%-75%，熔胶同时会碰到一个比较重要的环节，那就是背压的使用，产品精度要求越大，背压的使用则更大，背压可使原料分子间结构更紧密，成型出的产品则尺寸更稳定，外观越好。

Plastic should lower 3 steps, because plastic is a step to add melt resin material to cyclinder , Higher stick of resin material ,higher screw back pressure. Screw speed differs depending on decomposing temperature of resin material ,Higher screw speed ,Higher trim force of resin, higher cyclinder temperature.Some resin material may decomposes so it set screw speed in mid-speed such as 45-75%, In plastic step setting screw back pressure is very important, Higher screw back pressure ,higher quality of product screw back pressure make resin structure order, Molding product is beautiful and volume stable. But

再复杂的熔胶旋转过程最多不会超过三段，因为熔胶本身就是存在于把胶熔进料筒的过程，如果原料粘度大，熔胶压力则大，但速度则应取决于原料的分解温度，熔胶速度越快，原料中的剪切力则会越大，料管温度则越高，局部原料产生分解的可能性则会越大，故一般熔胶会采用中速为宜，如45%-75%，熔胶同时会碰到一个比较重要的环节，那就是背压的使用，产品精度要求越大，背压的使用则更大，背压可使原料分子间结构更紧密，成型出的产品则尺寸更稳定，外观越好。

Plastic should lower 3 steps, because plastic is a step to add melt resin material to cyclinder , Higher stick of resin material ,higher screw back pressure. Screw speed differs depending on decomposing temperature of resin material ,Higher screw speed ,Higher trim force of resin, higher cyclinder temperature. Some resin material may decomposes so it set screw speed in mid-speed such as 45-75%, In plastic step setting screw back pressure is very important, Higher screw back pressure ,higher quality of product screw back pressure make resin structure order, Molding product is beautiful and volume stable. But ,it maybe flow if screw back pressure too high .

再复杂的熔胶旋转过程最多不会超过三段，因为熔胶本身就是存在于把胶熔进料筒的过程，半夜盗汗897就去播播Z如果原料粘度大，熔胶压力则大，但速度则应取决于原料的分解温度，熔胶速度越快，原料中的剪切力则会越大，料管温度则越高，局部原料产生分解的可能性则会越大，故一般熔胶会采用中速为宜，如45%-75%，熔胶同时会碰到一个比较重要的环节，那就是背压的使用，产品精度要求越大，背压的使用则更大，背压可使原料分子间结构更紧密，成型出的产品则尺寸更稳定，外观越好。

Resins: gum dammar; PU dispersion; silicone resin, epoxy resin, alkyd, acrylic Resin, polyester resin, urethane resin, polyamide resin, amino hardener; two pack hydroxy acrylic, two pack isocyanate-free acrylic; vinyl chloride co-polymers, polyvinyl butyrals, thixotropic resin.

树脂类：达玛树脂；水性PU分散体；有机硅、环氧、醇酸、丙烯酸、聚酯、聚氨酯、聚酰胺、氨基固化剂；双组份羟基丙烯酸、双组份不含异氰酸脂丙烯酸；聚氯乙烯共聚物、聚乙烯醇缩丁醛、触变性树脂。

Gum gum arabic gum resin gum tree gumball gumbo gumboil gumboot ...

gum resin树胶脂欢迎免费下载Dr。

A Moke with the U.S. company's resin resin, Wei Naer resin similar to the AMS.

它与美国阿莫柯公司的resin树脂、维纳尔公司的AMS树脂相似。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤：在硅衬底上形成可剥离树脂层；在所述可剥离树脂层上形成布线衬底；将半导体芯片安装在所述布线衬底上；通过用密封树脂密封所述多个半导体芯片来形成半导体器件；通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化；将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离；并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

One of the important tasks in Resin Transfer Molding is the selection of appropriate processing parameters, so that the mold cavity will be filled completely and the composite quality can be guaranteed. Successful completion of these tasks requires knowledge of the resin flow, especially the resin flow front profiles, the pressure distribution, temperature distribution and the resin conversion distribution et al. In this paper, the governing equations of resin flow are presented on the base of the seepage mechanics, the thermodynamics and the chemical kinetics. The unlumped temperature system i.

中文题名树脂传递模塑工艺过程数值模拟与固化过程监测研究副题名外文题名 Investigation on numerical simulation and curing process monitoring of resin transfer molding 论文作者李海晨导师王彪教授学科专业工程力学研究领域\研究方向学位级别博士学位授予单位哈尔滨工业大学学位授予日期2002 论文页码总数10，121页关键词树脂固化光栅树脂传递模塑复合材料馆藏号BSLW /2003 /TQ320 /7 树脂传递模塑(Resin Transfer Molding，RTM)工艺过程研究的主要任务之一是选择合适的工艺参数，以使树脂充分润湿增强纤维，保证固化后产品质量。

Shanghai exchange resin resin plant special enterprises in China are domestic professional research and development, application, management services, OEM resin enterprise as a whole.major enterprises in China have Styrene, acrylic acid series, strong acid, strong base, weak acid, weak base, chelating , inert ion exchange resins, special enterprises in China for many years with several well-known enterprises to explore the application of ion exchange resins, the key products used in softened water, desalination water treatment-exchange resins; condensate treatment resin; food, fermentation industry Decoloration, dedicated Absorption resin, petroleum, chemical, medical, chelate resin and catalyst series dedicated resin as well as ancillary treatment, such as a series of packing products, such as a variety of grades.

上海汇脂树脂厂特华企业是国内专业研究开发、应用、管理服务、OEM为一体树脂企业。特华企业主要有苯乙烯系、丙烯酸系列，强酸、强碱、弱酸、弱碱、螯合、惰性离子交换树脂，特华企业多年来与多家著名企业探讨离子交换树脂应用，目前主要产品应用于软化水、除盐水处理交换树脂；凝结水精处理树脂；食品、发酵行业脱色、吸附专用树脂、石油、化工、医学、鳌合系列树脂和催化剂专用树脂以及配套水处理的系列填料等多种牌号等系列产品。

I am accused of being overreligious," she said in her quiet, frank manner,"but that does not prevent me thinking the children very cruel who obstinately commit such suicide.""

客人们在卡罗利娜·埃凯家里，举止就文雅一些，因为卡罗利娜的母亲治家很严厉。

Designed by French fashion house Herm è s, this elegant uniform was manufactured in our home, Hong Kong, and was the first without a hat.

由著名品牌 Herm è s 设计，这件高贵的制服是香港本土制造，是我们第一套不配帽子的制服。