查询词典 plating

Meanwhile, the relationship between several processing parameters, such as formula of silver-plating solution, its PH value and plating temperature, and silver-plating speed is to be studied.

同时研究了化学镀银液的配方组分、镀液的PH值及施镀温度等工艺参数和化学镀银速率之间的关系。

In addition, there are bond areas between the new and the primary coverage because of the growing up of the plating coat, which may lead to the emergence of micro crack on the coating owing to such causes as too big or uneven impact during plating process, little distortion of global granular zinc dust inside the plating coat, less tight coalescence of the zinc dust flecks.

由于形成镀层的过程处在酸性环境，在镀层增厚过程中不可避免把酸性溶液包裹在镀层里面，酸性溶液会与金属基体和镀层反应，产生氢气，必然会寻找通道选出，形成微气孔；镀层是逐渐形成的，新生镀层与原有镀层之间存在结合面；镀覆过程由于撞击力过大或者不均匀，镀层内部球形颗粒状锌粉变形较小，球形颗粒与球形颗粒的结合不严密等，这些原因会导致镀层产生微裂纹。

Major produce High Efficient Environment Protection bright nickel、semi-bright nickel、black nickel、copper、pearl chromium、bright chromium、hard chromium、bright tin、brushed tin、Zinc-plating (blue、white、colour、black)、silver plating、oxide coatings of aluminium and its alloys、oxidation of magnesium alloy、electroless nickel plating、pickling passivation、archaistic colouring、phosphate coated.

主要生产承揽高效环保光亮镍、半光亮镍、黑镍、镀铜、珍珠铬、亮铬、硬铬、光亮锡、亚光锡、镀锌、镀银、铝及铝合金的氧化、镁合金的氧化、化学镀镍、酸洗钝化、仿古着色和磷化处理。

In this paper, the electroplating of bright Zn-Ni alloy process was studied, the effect of (1-hydroxy ethylidene diphosphonate acid coordinating agent, chloride content, [Zn2+]/[Ni2+] mole ratio, cathode current density, temperature, a class of aldehyde compound (abbreviated as ZNP additive agent) and supplementary coordinating agent on Ni content, and brightness of plating layer was discussed, the physical phase of alloy plating layer and stability of plating solution were determined.

研究了用有机多膦酸盐作络合剂，ZNP作添加剂电镀光亮锌镍合金，探讨了络合剂、氯化物含量、[Zn2+]/[Ni2+]比、阳极电流密度、温度、辅助络合剂对合金中镍含量的影响，测定了合金镀层中物相组成及镀液稳定性，通过筛选得出最佳最镀光亮锌镍合金的镀液组成及工艺条件，并讨论了锌镍合金的异常共沉积机理。

A neutral non-cyanide copper plating (rack plating and barrel plating) process was developed.

开发出钢铁基体上中性无氰镀铜工艺，其配方中的配位剂是需要经过多道工序合成的具有x结构的化合物，还含有醋酸铜和磷酸二氢钠。

Surface Treatment and Finishing Technology, Raw materials and Equipment: Cleaning, Lapping, Deburring, Polishing and Burnishing, Sand blasting, Shot blasting, Ball blast, Conversion coatings, Electroplating, Thermal spray, Anti-Rust, Anti-Corrosion, Brush-plating, Vapor deposition, Hot dipping, Surface strengthening, Surface modification, Pre-treatment, Electrophoretic coatings, Anode oxidation, Plastic plating, Vacuum plating, Special coating, Depainting and Degreasing equipmentand Raw materials.

产品表面处理和精饰技术、原材料和设备：清洗、研磨、去毛刺、磨光和抛光、喷砂、喷丸、抛丸、转化膜、电镀、热喷涂、防锈、防腐蚀、刷镀、气象沉积、热浸镀、表面强化、表面改性、预处理、电泳涂装、阳极氧化、塑胶电镀、真空电镀、特种涂层、脱漆脱脂设备和原材料

Mainly engaged in plastic plating technology research, development, production and processing, the company's main products are copper, bronze plating, nickel, nickel-plated black, and the plating of trivalent chromium 6 Trivalent chromium, and so on.

永翔五金塑胶有限公司主要从事塑胶电镀技术的研究、开发、生产及加工，目前公司主要产品有镀铜、镀古铜、镀镍、镀黑镍、镀三价铬及六价铬等。

Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, microelectro-mechanical system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleclroless nickel, recycling of alkaline etching solution and reclaiming system of copper.

介绍了电子电镀中的若干新工艺新技术，如芯片电镀、电化学机械研磨、微机电系统电镀、不溶性阳极电镀铜、镀铂铌电极以及无铅无镉中磷光亮化学镀镍、碱性蚀刻液再生和铜回收系统等。

Some new processes and technologies in electronics finishing such as wafer plating, eCMP,MEMS plating, lead and cadmium free electroless nickel,copper plating using insoluble anode and recycling of etching solution for PCB industry and platinized niobiumelectrode are briefly introduced.

文对电子电镀中若干新工艺新技术如芯片电镀、化学机械抛光、MEMS 电镀、PCB 工业中采用不溶性阳极电镀铜工艺以及铜蚀刻液回收再生、无铅无镉化学镀镍、镀铂铌电极等进行了简要介绍。

Some new processes and technologies in electronics finishing such as wafer plating, e CMP ,MEMS plating,lead and cadmium free electroless nickel,copper plating using insoluble anode and recycling of etching solution for PCB industry and platinized niobiumelectrode are briefly introduced.

文对电子电镀中若干新工艺新技术如芯片电镀、化学机械抛光、 MEMS 电镀、PCB 工业中采用不溶性阳极电镀铜工艺以及铜蚀刻液回收再生、无铅无镉化学镀镍、镀铂铌电极等进行了简要介绍。

With Death guitarist Schuldiner adopting vocal duties, the band made a major impact on the scene.

随着死亡的吉他手Schuldiner接受主唱的职务，乐队在现实中树立了重要的影响。

But he could still end up breakfasting on Swiss-government issue muesli because all six are accused of nicking around 45 million pounds they should have paid to FIFA.

不过他最后仍有可能沦为瑞士政府&议事餐桌&上的一道早餐，因为这所有六个人都被指控把本应支付给国际足联的大约4500万英镑骗了个精光。