查询词典 peelable

And claims, such as the availability of effective peelable grades, are difficult to substantiate.

和索赔，如提供有效的可剥职系，是难以证实。

Peelable lid for the European single-serve food market.

可剥盖子的欧洲单一服务的食品市场。

Reseal film, an advanced peelable technology that exposes a pressure sensitive layer when the consumer opens the package.

重新封装薄膜，先进的剥离技术，暴露了压力感应层当消费者打开包。

The rigid tray and peelable lid package exposes a pressure sensitive layer when the consumer opens the package.

僵化的托盘和剥离盖包暴露了压力感应层当消费者打开包。

A healthy snack marketed in Western Europe is packaged in metal cans with peelable lids from the European subsidiary of Crown Holdings.

一个健康的零食销售在西欧是封装在金属罐与剥盖子欧洲皇冠控股的子公司。

We produce Peelable Lidding for Sauce Portions in Restaurants , Sachets for Dry Condiments Sachets for Wet Condiments .

我们生产剥离封盖的部分酱油中餐馆，袋干调味品

Carrier layer for peelable lidding film, for example, on microwaveable food containers: high stiffness, good processing, high heat resistance

可剥离膜的载体层，用于微波食品容器：高刚性、良好的加工性能，高耐热

Peelable solder mask may indeed be used to provide temporary tenting of such designated vias, but this can often prove quite costly.

可撕阻焊剂可能会临时用来覆盖指派的过孔，但是价钱会非常昂贵。

NOTE 5—If confirmation of channels or incomplete seal areas in peelable packages is necessary, hand peel such suspected package completely separating the two material components and inspect the seal area of the transferred adhesive for the same incomplete seal attributes as the unopened package.

如果渠道或在peelable包裹的残缺不全的密封区的确认是必要的，递果皮完全地分离二个物质组分的这样被怀疑的包裹并且检查转移的胶粘剂的密封区残缺不全的封印属性和未打开的包裹一样。

The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

该方法包括以下步骤：在硅衬底上形成可剥离树脂层；在所述可剥离树脂层上形成布线衬底；将半导体芯片安装在所述布线衬底上；通过用密封树脂密封所述多个半导体芯片来形成半导体器件；通过从密封树脂侧将这些半导体器件切分但是保留硅衬底来使这些半导体器件个体化；将每个个体化半导体器件在所述硅衬底和可剥离树脂层之间从硅衬底上剥离；并且通过形成穿过可剥离树脂层的孔或者通过除去可剥离树脂层来使布线衬底上的端子暴露。

In the United States, chronic alcoholism and hepatitis C are the most common ones.

在美国，慢性酒精中毒，肝炎是最常见的。

If you have any questions, you can contact me anytime.

如果有任何问题，你可以随时联系我。