查询词典 peacock copper

Trench is to recycled scrap copper, copper slag, and the circuit board for soldering copper components, direct remelt casting, in which the lead can not be separated, the content is very easy to exceed 3%.

地沟铜是把回收的废铜、铜渣，以及电路板上的锡焊铜元件，直接回炉铸造，其中的铅是无法分离出来的，含量很容易超过3%。

For this,experimental study was made on a new process of potential-controlled preferential flotation in a sequency of copper,lead and zinc,which used LP-01 as collector for copper mineral,DDTC as collector for lead mineral,copper sulfate and butyl...

为此，以LP-01为铜矿物的捕收剂、乙硫氮为铅矿物的捕收剂、硫酸铜和丁黄药为锌矿物的活化剂和捕收剂、石灰为矿浆电位调整剂，并在选铜、铅时配合使用铅矿物的组合抑制剂ZnSO4+YN，对该多金属复杂硫化矿进行了电位调控铜、铅、锌依次优先浮选新工艺试验研究，获得了含铜21.74%、铜回收率62.31%的铜精矿，含铅61.23%、铅回收率55.07%的铅精矿和含锌56.43%、锌回收率90.02%的锌精矿。

These revealed that high dose copper can destroy function of erythrocytic membrane and cause oxidative stress, which may be one of the mechanisms of goat erythrocytic haematolysis induced by high dose copper. 3 High copper caused the increase of osmotic fragility of erythrocyte and AGLT50 in acor glycerine solution.

高铜导致红细胞膜超氧化物歧化酶和谷胱甘肽过氧化物酶活性降低，氧化产物丙二醛含量增多，引起红细胞抗氧化功能降低，诱发氧化胁迫，使得红细胞处于氧化应激状态，这可能是高铜致羊红细胞溶破机制之一。

After the reckoning, the copper alclad power cable and under the copper conductor electric cable performance same condition compares: May save the copper material 78%, saves raw material cost above 20%, weight saving 40%.

经过测算，铜包铝电力电缆与铜导体电缆性能相同条件下相比：可节约铜材78%，节约原材料成本20%以上，重量减轻40%。

The making of cloisonne requires elaborate processes: pure copper base-hammering in various manners, copper or gold strip inlay, enamel-filling, enamel-firing, polshing and gilding, which displays delicateness in copper-strip inlay, bright and smooth glaze, fresh and lightening color.

钓鱼台景泰蓝以紫铜做坯，制成各种造型，再用金线或铜丝掐成各种花样，中充珐琅釉，经烧制、磨光、镀金等工序制成。其制作工艺讲究，掐丝细，釉面光亮，色彩鲜艳而明亮。

The precision lapping technology to machine the copper substrate using semi-fixed abrasive plate was studied. The surface roughness and material removal rate as the evaluation of indicators, the influences of the different lapping parameters on the surface roughness and material removal rate were discussed and analyzed. Experimental results indicated that the copper substrate could be efficiently machined by semi-fixed abrasive plate of 800(superscript #) SiC abrasive, and the initial roughness Ra of a machined surface could be improved from 0.553μm to 0.28μm in 10min, produced an ideal rarely scratch surface. Then processed copper polished by diamonded grinding paste, it could be satisfied for the Ni-Pd-P alloy thin film growth.

主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底，以铜片衬底的表面粗糙度和材料去除率为评价指标，探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响结果表明：用800 SiC半固着磨具对铜片衬底进行研磨加工，10min后铜片表面粗糙度Ra可由0553μm减小到0.28μm，同时表面无深划痕：加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面。

The specialty makes the Al2O3/Cu composite material by internal oxidation of deeply aluminized pure copper matrix is more fine to be the diathermanous copper material of metallurgical equipment in the high temperature service condition than the ageing and solution alloy of aluminized deeply pure copper.

这种特性使得纯铜深层渗铝内氧化Al2O3/Cu复合材料在高温服役条件下比纯铜深层渗铝固溶时效合金更适合用作冶金设备用传热铜材料。

To provide sciencetenability for bioremediation of copper contamination and its toxicity, copperaccumulation and the adaptation of Eichhornia crassipes to copper stress wereinvestigated in this study. Further study was carried out for copper-removal of acopper-resistant strain isolated from the root of E.

本研究通过分析凤眼莲对铜的累积作用及其生理响应，阐明铜胁迫下凤眼莲的生理适应机制，并探讨凤眼莲根系抗铜菌的去铜作用及其在缓解菹草铜胁迫毒害中应用潜力。

Welding earth wire: separate copper woven wire into three pieces, weave it again and enwind the phase respectively as well as weld it on the shielded copper band with electric iron and soldering tin; polish steel band welding area with sandcloth, and firmly weld with armored cable after wrapping up with copper wire.

2焊接地线：将铜编织线拆开分成三份，重新编织分别绕各相，用电烙铁、焊锡焊接在屏蔽铜带上；用砂布打光钢带焊接区，用铜丝绑扎后与钢铠焊牢。

High copper also can cause the decrease of ATPase activity and membrane fluidity. These revealed that high dose copper destroied function of erythrocytic membrane and cause haematolysis, which may be one of mechanisms of the toxic effect induced by high dose copper.

高铜使红细胞渗透脆性增加，在酸性甘油溶液中的溶血速度(AGLT50)升高，细胞膜ATPase活性降低和膜流动性降低，表明高铜能够破坏红细胞膜的功能，进而使得红细胞发生溶破，这可能是高铜对羊红细胞毒性作用的机制之一。

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