查询词典 manufacturing method

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

The present invention provides a manufacturing method for case, a case jogged method and apparatus, and a manufacturing system of the packing case.

本发明提供一种箱制造方法、箱嵌合方法与装置以及包装箱的制造系统。

At issue in the lawsuit was not the unique photolithographic method Affymetrix uses to make its arrays, but rather a fundamental claim to high-density arrays in general, regardless of the manufacturing method.

在诉讼中，不考虑生产方法的话，被告并不是使用了Affymetrix公司所独有的照相平版印刷技术而是一种基础的高密度数组技术。

This modeling method is discussed from three aspects as follows. Firstly, on enterprise model framework, enterprise model expressed by this modeling method is more particular than other, since there are the views of product process and relation in it. Secondly, in this modeling method, the modeling process that the process model of products is created first of all and other models are created according as it is presented. Using this method, enterprise model is clear and consistent. Thirdly, on the representation of views, the traditional method of IDEF is appreciably improved.

论文从三个方面对此建模方法进行了阐述：1，企业模型框架方面，基于产品过程模型的集成化企业建模方法中的模型框架包含了产品过程视图和联系视图，因而它表达的企业模型更为丰富、详细；2，企业建模过程方面，提出了首先建立企业产品过程模型、再以此为核心建立其它模型的建模过程，这样建立的企业模型主次分明，各视图之间有机统一、协调一致：3，模型视图的描述方法方面，对传统的IDEFIntegrated Computer—Aided Manufacturing(ICAM DEFinition模型表达方法提出了一些改进建议。

As a new manufacturing method developed at the end of the last century, Rapid Prototyping , compared with conventional manufacturing methods , has the advantages of timesaving ,precision and complex modeling .and has been applied in more and more manufacture fields wildly.

快速成型作为上世纪末发展起来的新型制造技术，与传统的机械技术相比，具有快速、准确地制造复杂模型的特点，在越来越多的制造领域得到了广泛的应用。

Provided is a wafer level CSP semiconductor device with the same size as a semiconductor substrate, in which the orientation of a semiconductor device cut into individual pieces and product information can be identified by a mark, indicating the orientation and the product information formable, irrespective of the size, shape and the number of terminals of the device without increasing the number of manufacturing processes, and its manufacturing method.

本发明提供一种在与半导体衬底尺寸相同的晶片级CSP半导体器件领域中，能够利用表示半导体器件的方向及产品信息的标记，来识别被切成单个的半导体器件的方向及产品信息的半导体器件及其制造方法，其中，该标记能够在与半导体器件尺寸、形状及端子数目无关，且在不增加制造工序数目的情况下形成。

The present invention provides a manufacturing method and manufacturing apparatus for an aluminum alloy base for a planographic printing plate for obtaining an alloy cast sheet of stable quality having a uniform and fine cast structure.

本发明是为获得具有均匀细微铸造组织质量稳定的合金铸造板，而提供平版印刷版用铝合金支撑体的制造方法和制造装置。

Since they are now beginning to consider the necessity of technical manpower dispatching, the selection of the right temporary help service firms has become a very important issue.In the past, supplier evaluation and selection studies mostly focused on the manufacturing and service industries. Hence, this paper studied the past domestic studies conducted on supplier selection to understand the appropriate selection guidelines that would serve as the fundamental guidelines for the selection of outsourcing manpower companies. The PROMETHEE (Preference Ranking Organization Method for Enrichment Evaluations) proposed by Brans and Vincke in 1985 was used as the supplier selection tool for the study. Finally, we employed a simulated case study where we consolidated the selection guidelines,method and tools to create a reference for future practical applications and academic researches.

在过去，有关于厂商评选的国内外文献中，其研究对象以制造业及服务业居多，针对人力派遣公司评选准则之文献则相当的缺乏，因此，本研究将讨论国内半导体设备供应商评选技术人力派遣公司之准则，藉由过去国内学者对供应商评选之相关研究，寻得适宜的评选准则，以做为评选人力派遣公司之基础，采用由Brans及Vincke在1985年所提出之PROMETHEE（Preference Ranking Organization Method for Enrichment Evaluations）法做为评选供应商之工具，并将此方法藉由Excel应用软体予以辅助计算，最后，使用模拟个案，将研究所提出的评选准则、方法及工具三者结合，提供实务运作及学术研究上作为参考。

The invention discloses a convenient, rapid manufacturing method of Chinese libanom sausage, which comprises the following steps: 1 preparing pickling agent with 2% salt, 0.3% calcium chloride, 0.45% composite phosphate, 15-18g/100kg beef sodium nitrite, 170-180g/100kg beef sodium nitrite, 2 allocating condiment material with 100kg mother beef, 450-550g salt, 3.5-4.5kg sugar, 450-550g mustard, 0.8-1.2kg ginger and garlic (1: 1), 32-38g meat, 350-450g white pepper powder, 180-220g chili powder and 650-680g cumin powder, 3 cutting beef into blocks, pickling for 5-6 days, fermenting at 43 deg.c for 1-2 days, controlling moisture at 80-90% to reduce at 50-70% within 3-4 days, stopping manufacturing when the weight loss is 20-30%.

内容包括：1以占牛肉重量2％比例的食盐、0.3％的氯化钙和0.45％的复合磷酸盐与15～18g/100千克牛肉的亚硝酸钠、170～180g/100千克牛肉的硝酸钠构成中式黎巴嫩香肠加工用腌制剂。2中式黎巴嫩香肠的香辛料配方为母牛肉：100kg、食盐450～550g、糖3.5～4.5kg、芥末450～550g、姜蒜(1∶1)0.8～1.2kg、肉蔻32～38g、白胡椒粉350～450g、辣椒粉180～220g、孜然粉650～680g.3中式黎巴嫩香肠加工工艺特点为，将发明的腌制剂涂抹于卫生安全牛肉修割切块表面，腌制时间为5～6天；发酵加工温度条件为：43℃，发酵加工1-2天内湿度控制在80％～90％，在3-4天下降为50～70％，当失重为20％～30％的时候结束加工。

To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method.

进而本发明还提供使用了晶圆加工用粘合片或带半导体晶圆的粘合片的半导体元件的制造方法、以及通过该制造方法得到的半导体元件。

For a big chunk of credit-card losses; the number of filings (and thus charge-off rates) would be rising again, whether

年美国个人破产法的一个改动使得破产登记急速下降，而后引起了信用卡大规模的亏损。

Eph. 4:23 And that you be renewed in the spirit of your mind

弗四23 而在你们心思的灵里得以更新