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The technique of composite plating of nickel／diamond in ultrasonic field was researched and ultrasound-assisted electroplating technique for diamond bit manufacture was established.

研究了超声波作用下的钞金刚石复合电镀工艺，确定了超声波电镀金刚石钻头的制造工艺流程，并根据确定的工艺试制了Φ75.5／49绳索取心钻头进行野外钻进试验。

Bo Ya WeiYe Ji Dian , is engaged in the research, design, manufacture of integrated professional manufacturers.

博雅伟业机电有限公司是从事焊接研究、设计、制造于一体的专业生产厂家。

Design, manufacture and distribution of dichroic filters for airfield lighting systems.

设计、生产制造、销售飞机场各种照明系统中的彩色滤光片。

At the same time, good Dickson has been committed to the steel structure and mechanical application of the theory of technology research and application of research results to keep the shelves of the design and manufacture.

同时，佳德信公司一直致力于钢结构应用技术及力学理论的研究，并不断将研究成果应用于货架的设计和制造。

The development and the application of electronic design automation technology not only cause revolutionary change to the design and manufacture of electronic system, but also bring forward new requirements on the Didactics reform of relative college courses.

电子设计自动化技术的发展与应用不仅使电子系统设计与制造发生了革命性的变化，也对高等院校相关课程的教学改革提出了新的要求。

I is a company specialized in the design and manufacture of die casting, casting the production, processing as one of the new enterprise.

我公司是一家专业从事压铸模具设计制造、压铸产品生产、加工为一体的新型企业。

The diene currently used in the manufacture of EPDM rubbers are DCPD, ENB and VNB.

在ISO/TR 7620中汇集了近400种具有腐蚀性的气态和液态化学品对各种橡胶性能作用的资料，并规定了1-4级表示其作用的程度，见表1。

Dinkey Electric Appliances owns several famous brands including DINKEY and DEBISIRE, enabling Dinkey to be one of world-class enterprises specialized in the design, manufacture and marketing of electric water heaters.

迪克电器公司始创于1985年，是一家世界级专业从事电热水器产品设计、制造和销售的企业。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

In the paper the deterrent content and the concentration of diphenylamine dibuty l phthalate and centralite Ⅱ in finished product manufactured by two different methods were analyzed by high performance liquid chromatography, which can provi dereference for adjusting the technology of the propellant manufacture.

文摘：利用高效液相色谱仪分别测定了发射药在两种制备工艺中的钝感剂邻苯二甲酸二丁酯和二号中定剂的含量及邻苯二甲酸二丁酸在其中的浓度梯度分布，为调整发射药制备工艺提供了参考。

However, as the name（read－only memory）implies, CD disks cannot be written onorchanged in any way.

然而，正如其名字所指出的那样，CD盘不能写，也不能用任何方式改变其内容。

Galvanizes steel pallet is mainly export which suits standard packing of European Union, the North America. galvanizes steel pallet is suitable to heavy rack. Pallet surface can design plate type, corrugated and the gap form, satisfies the different requirements.

镀锌钢托盘多用于出口，替代木托盘，免薰蒸，符合欧盟、北美各国对出口货物包装材料的法令要求；喷涂钢托盘适用于重载上货架之用，托盘表面根据需要制作成平板状、波纹状及间隔形式，满足不同的使用要求。