查询词典 lead-out

And few want to work wearing awkward lead aprons and vests( costing between$85 and$600), which are typically constructed of weighty, cumbrous sheets of powdered lead in a polymeric matrix.

外，也很少人愿意穿著笨重的铅制背心与围裙工作，这类装备的售价介于85~00美元，由填装著铅粉的厚重聚合物材质所制成。

About 4 percent of children across the country have lead poisoning, defined as having at least 10 micrograms of lead per deciliter of blood.

全美约有4％的儿童有铅中毒(即每公升血中至少含有10微克铅。1至70岁的人平均含量为2.3微克)。

However, excessive and extreme defection will lead to a kind of unbalance of state power structure, and may lead to serious and dangerous effects.

某一时期符合客观需要的和适度的偏向，不仅是必须的而且是有益的。

And then the effects of compositions on the mechanical performance, characteristic temperatures, thermal expansion and chemical stability of the glass were discussed. Researches on lead borate sealing glasses show that PbO/B2O3 ratio exerts the most important effect on glass network. ZnO is beneficial to stabilize the glass against devitrification . Bi2O3 has little effects on the sealing temperature, while it helps to adjust the thermal expansion coefficient of lead borate glasses in a definitive range. When 0.5～4 mol% GeO2 is introduced, the glass possesses the highest stability and lowest sealing temperature (400 ?C), which is desirable for low-temperature sealing.

通过对含铅的硼酸盐封接玻璃研究得出，PbO/B2O3比是影响玻璃网络最主要的因素；添加ZnO有助于增强玻璃的稳定性，抑制析晶；Bi2O3对高铅系列配方玻璃的封接温度影响不大，但可使铅硼系列玻璃体系的热膨胀系数在一定范围内可调；在高铅系列配方中，引入0.5～4mol%的GeO2可有效地抑制玻璃析晶，降低封接温度；最终获得了两种性能较好的低熔点铅硼酸盐封接玻璃配方，G3封接温度低达400℃，其PbO含量为54mol%左右，BL10玻璃的封接温度为440℃，但其铅含量大大降低，仅为36mol%。

Carry on lead transfer through the diagonal line method , not only solved basically impersonal condition limit of the traditional triangle connection survey the method request, but also enhanced the engineering lead accuracy and measure the work efficiency.

通过斜线法进行导线传递，不仅从根本解决了传统三角联系测量方法所要求之客观条件的局限性，同时大大提高工程指导精度和测量工作效率。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

Here's a list of Lex Luthor's known lairs straight from the Superman Encyclopedia: a complex of buildings held aloft by a giant dirigible high above the stratosphere, a glass-enclosed city of ancient, weird design, an abandoned factory, a gigantic man-made meteor floating in outer space, an abandoned barn, a secret underground lab, a giant spaceship, a secret mountaintop laboratory, an electronics firm, a hidden laboratory on the outskirts of Metropolis, a laboratory hideout that has been lined with lead to conceal it from Superman's X-ray vision, a massive fortress-like citadel on a lonely mountaintop north of Metropolis, a lonely farmhouse in the mountains north of Metropolis, a secret lead-lined subterranean hideout built into the side of a grassy hill, and the elaborately equipped Luthor's Lair, Luthor's Lair II, and Luthor's Lair No.

关于莱克斯·卢瑟已知的据点，超人的百科全书上是这样记载的："他的藏身处包括由巨大飞船托浮在半空的复杂建筑群；古代样式的玻璃城，设计诡异；废弃的工厂；悬浮在外太空的巨大人造陨石；废弃的谷仓；秘密的地下实验室；巨大的太空船；建于山顶的秘密实验室；电子公司；藏匿于城郊的实验室，这个实验室通体灌铅，能够躲过超人的X光眼；巨大的堡垒--它就像孤零零伫立在城市北面山顶上的一个据点；坐落在城市北面山上的孤零零的农舍；还有建在绿岭山脊上的秘密铅制地下室；以及装备精良的卢瑟堡一号，二号和5号。"

"Lead 铅",24,Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

EC 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅

Hard work in time to avoid the shock of it, because the distance between head and disk very close to, if clustering was head of the shock will lead to knock disk may be scratched disk heads, but also may lead to the total head count of the bad, the entire hard disk can not be used.

在硬盘工作的时候要尽量避免它的震荡，因为，磁头与磁片的距离非常近，如果遭到聚类的震荡会导致磁头敲打磁片，有可能磁头会划伤磁片，也可能会导致磁头的彻底算坏，使整个硬盘无法使用。

This blind and disorderly competition will inevitably lead to waste of social resources and lead to a certain degree of social problems.

这种盲目和无序竞争将不可避免地导致浪费社会资源，并导致了一定程度的社会问题。

In the negative and interrogative forms, of course, this is identical to the non-emphatic forms.

。但是，在否定句或疑问句里，这种带有"do"的方法表达的效果却没有什么强调的意思。

Go down on one's knees;kneel down

屈膝跪下。。。下跪祈祷