查询词典 interposer

The invention is directed a patterned contact sheet and to a method of bonding a cover wafer to an interposer wafer using the patterned contact sheet having a waffle-like pattern of a plurality of ridges and plurality of wells to form a cover/interposer combination or unit that can be bonded to a substrate having a MEMs device thereon, the cover wafer, interposer wafer and substrate together forming a protective packaging for the MEMS.

本发明涉及在制造过程中保护临界表面的形成有图案的接触片材以及一种使用形成有图案的接触片材将盖子片粘合到插入物片上以形成盖子/插入物组合或单元的方法，所述接触片材具有华夫饼干状图案的许多脊和许多井，所述盖子/插入物组合或单元可粘合到具有MEM设备的基材上，所述盖子片、插入物片和基材一起形成MEM用的保护性封装。

The wafer/interposer assembly is reflowed, or cured, to form the electrical connection between the circuitry on the interposer layer (34) and the circuitry on the wafer.

将圆片/插入器组件反流或固化以在插入器件层上的电路(34)和圆片上的电路之间形成电连接。

Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.

与 micro-PGA 的不同之处在于，micro-FCPGA 没有插入物，但底部有电容器。

This invention relates to the manufacture of a substrate, such as a package substrate or an interposer substrate, of an integrated circuit package.

本发明涉及集成电路封装的衬底诸如封装衬底或插入衬底的制造。

The Intel Xeon Processor with a 400 MHz Front Side Bus is packaged in the 603-pin OLGA On Interposer package.

MHz 前端总线的英特尔至强处理器采用 603 针 OLGA On Interposer 封装类型。

Solder balls (50) are then placed on the metal pad openings on the interposer substrate and are reflowed to form a wafer-level BGA structure.

焊球(50)然后被置于插入器衬底上的金属焊盘开孔上并将之反流以形成一圆片面BGA衬底。

An interconnect routing for a card or interposer or the like, including splines of traces on a first layer and traces on a second layer, with vias connecting between the layers.

用于一种卡或插入物或类似物的互连路由，它包括在第一层上的迹线样条(66、69、70)以及在第二层上的迹线(58、60)，层之间用通道连接。

As of Tuesday, Google's results were still censored in China.

截至周二，谷歌的搜索结果仍受中国审查。

In order to make the positive action increase and negative one decrease, the sub-forces of the social factors must be adjusted to form a centripetal force.

在这一过程中，人的主体性发挥是社会有机体健康发展的灵魂。