查询词典 integrated semiconductor

Provided is a wafer level CSP semiconductor device with the same size as a semiconductor substrate, in which the orientation of a semiconductor device cut into individual pieces and product information can be identified by a mark, indicating the orientation and the product information formable, irrespective of the size, shape and the number of terminals of the device without increasing the number of manufacturing processes, and its manufacturing method.

本发明提供一种在与半导体衬底尺寸相同的晶片级CSP半导体器件领域中，能够利用表示半导体器件的方向及产品信息的标记，来识别被切成单个的半导体器件的方向及产品信息的半导体器件及其制造方法，其中，该标记能够在与半导体器件尺寸、形状及端子数目无关，且在不增加制造工序数目的情况下形成。

A semiconductor device including a high voltage element and a low voltage element, including: a semiconductor substrate having high voltage element region where the high voltage element is formed, and a low voltage element region where the low voltage element is formed; a first LOCOS isolation structure disposed in the high voltage element region; and a second LOCOS isolation structure disposed in the low voltage element region, wherein the first LOCOS isolation structure includes a LOCOS oxide film formed on a surface of the semiconductor substrate and a CVD oxide film formed on the LOCOS oxide film, and the second LOCOS isolation structure includes a LOCOS oxide film.

提供一种在确保高耐压元件的高耐压特性的同时使高耐压元件和低耐压元件具有良好特性的半导体装置。具有高耐压元件和低耐压元件的半导体装置包含：规定了形成高耐压元件的高耐压元件区和形成低耐压元件的低耐压元件区的半导体衬底；在该高耐压元件区设置的第一LOCOS隔离结构；以及在该低耐压元件区设置的第二LOCOS隔离结构。第一LOCOS隔离结构由在该半导体衬底的表面上形成的LOCOS氧化膜和其上形成的CVD氧化膜构成，第二LOCOS隔离结构由LOCOS氧化膜构成。

The invention discloses an optical-fiber all-optical code converter, comprising a temperature control circuit as well as optical-fiber Mach-Zed interferometer, heat sink, semiconductor refrigerator, thermosensitive resistor and radiator, where the interferometer is composed of two cascaded 3dB couplers on the heat sink, the relation between length difference delta L of two arms of the interferometer and generated delay time difference delta T is that delta L=c.delta T/n, where c is light velocity in vacuum and n is refractive index of optical fiber; the thermosensitive resistor is used to detect temperature of interferometer, the temperature control circuit is used to compare feedback voltage of the thermosenstive resistor with a given voltage to regulate working current of the semiconductor refrigerator, and the semiconductor refrigerator refrigerates or heat two arms of the interferometer by the heat sink.

本发明公开了一种光纤型全光码型转换器，它包括温控电路和位于密封盒内的光纤型马赫-泽德干涉仪、导热热沉、半导体制冷器、热敏电阻以及散热片；干涉仪由位于导热热沉上的二个3dB耦合器级联而成，两臂的长度差ΔL与产生的延时差ΔT之间的关系为ΔL＝c。ΔT/n，c为真空中光速，n为光纤折射率；热敏电阻用于对干涉仪的温度进行探测，温控电路用于比较热敏电阻反馈的探测电压和设定电压，对半导体制冷器的工作电流进行调节，半导体制冷器通过导热热沉对干涉仪两臂同时进行制冷或加热。

An external-cavity semiconductor laser was built by using a semiconductor laser, collimating cylindrical column lens for fast axis beam and a volume Bragg grating as a feedback element to get semiconductor lasers wavelength locked to the Bragg wavelength of the VBG.

用体布拉格光栅作为反馈元件与瓦级半导体激光器以及快轴准直柱透镜构成一个可以将半导体激光器的工作波长稳定在体布拉格光栅布拉格波长处的外腔激光器。

Semiconductor Product category Ultrasonic welding has: Ultrasonic Wire Welder Series, ultrasonic gold wire bonder series, enameled wire electric spot welder series; semiconductor back-up processes Product categories: LED computer tester, dot-matrix plate detector, the expansion of machine, paste membrane and dispensing, such as semiconductor production equipment.

超声波半导体焊接产品类有：超声波铝丝焊机系列、超声波金丝球焊机系列、漆包线电点焊机系列；半导体后备工序产品类：LED电脑检测仪、点阵板检测仪、扩张机、贴膜机和点胶机等半导体生产设备。

To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method.

进而本发明还提供使用了晶圆加工用粘合片或带半导体晶圆的粘合片的半导体元件的制造方法、以及通过该制造方法得到的半导体元件。

Semiconductor industry has been a central figure to the economic growth in Taiwan, especially for the fabrication sector of integrated circuit that has evolved into world-leading status. The fabrication technology advances so far that the feature size (or critical line-width) of IC devices has now broken the 0.1 ?慆 barrier and into the nano-scale age. This progress discloses that the traditional definition of a "cleanroom" environment may become increasingly inadequate because prevention of particulate contamination may no longer be a critical issue. As the condensable organic airborne molecular contaminants depositing on wafer surfaces, it results in deterioration on device performance and reduces semiconductor device yield.

半导体产业已成为我国最重要的经济发展产业，其中积体电路制造技术的快速发展，使我国早已跃升成为世界晶圆代工重镇之一，然而当制程的关键线宽尺寸突破0.1微米而正式进入奈米等级之际，传统针对微粒污染控制所设计之洁净室将无法符合气态分子污染物之洁净需求，其中凝结性有机分子污染物质(organic airborne molecular contaminants)一旦沈积吸附於晶圆表面，将导致元件缺陷与制程良率下降。

First, the S-CDMA-HFC system with integrated traffic is introduced and the method of traffic integration is given. Second, the upstream channel capacity of the S-CDMA-HFC system with integrated traffic that has the same rate is analyzed. The chronoff limit and Gaussian approximate equation of the upstream channel cutoff probability are derived. Third, the impact of the selection of the line transmission rate on the upstream channel capacity of the S-CDMA-HFC system with integrated traffic is discussed in detail. The cutoff probability and throughout equations of the upstream channel with different integrated traffic are derived. Fourth, the impact of the power control error on the capacity is discussed. Results show that the power control error will degrade the upstream channel capacity and have different influence on the different traffic. Finally, the capacity requirement of the initialization process is raised. Analytical results show that the initialization process will impact on the capacity slightly.

首先，简单介绍了综合业务S-CDMA-HFC系统，给出了业务综合的方法；然后，分析了具有相同码率的综合业务条件下的S-CDMA-HFC系统上行信道容量，导出上行信道中断概率的切尔诺夫上限和高斯近似公式；然后，详细讨论了基本传输速率的选择对综合业务S-CDMA-HFC系统上行信道容量的影响，导出了不同业务综合条件下上行信道的中断概率和吞吐量公式；然后，讨论了功率控制误差对综合业务S-CDMA-HFC系统上行信道容量的影响，结果表明功率控制误差会使上行信道容量下降，且对不同业务的影响程度是不同的；最后给出了初始接入的容量要求，分析结果表明初始接入将对综合业务S-CDMA-HFC系统上行容量带来影响，但不明显。

What integrated circuit designs job is flourishing bring many design verification to test requirement, check the one link in catenary of industry of since integrated circuit, also be the crucial point that test and verify of integrated circuit product leaves factory, bougie gets stuck even if upright between automatic test system and IC chip, the accurate interface that parameter of IC product function checks before be being used at enclosing gets stuck, the design of it and integrated circuit and test are enclosed inseparable.

集成电路设计业的畅旺带来大量的设计验证测试需求，测试既是集成电路工业链中的一环，也是集成电路产物验证出厂的要害，探针卡就是介于主动测试系统与IC芯片之间，用于封装前测试IC产物性能参数的慎密界面卡，它与集成电路的设计和测试封装密不成分。

The 1H-NMR spectrum collected on a 200 MHz instrument had a multiplet at a chemical shift of 5.3 parts per million which integrated to one proton, a triplet at 2.5 ppm which integrated to four protons, two doublets at 1.66 ppm and 1.59 ppm which integrated to three protons each, and a multiplet from 1.4-1.2 ppm which integrated to six protons.

该核磁共振谱收集在一个200 MHz的仪器有一个multiplet在化学位移5.3每100万的综合，以一质子，三重在2.5 ppm的综合，以4个质子， 2 doublets在1.66 ppm和1.59 ppm的综合，以3个质子，每个和multiplet从1月4日至1月2日ppm的综合，以6个质子。

A carrier gas such as nitrogen is directed through line 20 and valve 22 to connect with line 26 and mix with the gas sample.

如氮气之类的载体通过管线20和阀22引入，与管线26相通，与气体样品混合。

But for the most part, knaves and parasites had the command of his fortune

然而支配他的家产的大多是恶棍和寄生虫。