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high speed相关的网络例句

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The brushless permanent magnet automobile a. c. generator has the advantages of high reliability, long service life, high efficiency, good performance at both low and high speed, low radio interference, simplifying its associated voltage regulator, cutting down materials, technology simplified, as well as high power/weight ratio, etc.,and will be a new product with broad prospects and large market.

无刷永磁汽车交流发电机由于取消了碳刷、滑环及励磁绕组,可大大提高可靠性,延长使用寿命,具有效率高,低、高速性能好、无线电干扰小,与之匹配的电压调节器结构简单、节约原材料、工艺性能好、比功大等优点。

Many horses Products: Bits; reamer; countersink drilling / reaming drill; tap; carbide thread milling cutter; cutter; die; white steel universal and dedicated to a workpiece material twist drill; Drilling holes or drilling and tapping Shen composite tool; Center drill and drill centering; high-performance ADX and CDX high-speed steel drill bits carbide drill bits (both outside the convex cutting edge, high efficiency, easy to chip-breaker); Deep-hole Drill the parabolic trough PFX; have "self-thinning thick heart," the characteristics of taper shank twist drill the first A030 (drilled shafts designed to take into account the characteristics of the cardiac thick thinning, re-mill grinding, when no longer horizontal edge); VANGARD Series and SHARK Series high-performance machine tap; particularly suitable for machining aluminum, aluminum alloy, stainless steel and ductile extrusion tap; a variety of rough-cut and fine cut Endmill; Solid Carbide Thread milling cutter and the tap; with TiAIN coating cutting tool used to do: and so on.

钻头;铰刀;锪钻/扩孔钻;丝锥;硬质合金螺纹铣刀;铣刀;板牙;白钢刀通用性的和专用于某种工件材料的麻花钻;钻削和沉孔或钻孔攻丝复合刀具;中心钻和定心钻;高性能的ADX高速钢钻头和CDX硬质合金钻头(均有外凸形切削刃,效率高、易断屑);PFX抛物线槽形深孔钻头;有"自我心厚减薄"特点的锥柄麻花钻头A030(钻槽设计中考虑了心厚减薄特点,重磨时不需再修磨横刃);VANGARD系列和SHARK系列高性能机用丝锥;特别适合于加工铝件、铝合金、韧性钢和不锈钢的挤压丝锥;各种粗切和精切立铣刀;整体硬质合金螺纹铣刀和丝锥;带TiAIN涂层的用于干切削的刀具:等等。

The project will develop a bandpass sigma-delta analog-to-digital converter for digital audio broadcasting system in three years. In the first year, we had finished the system simulation for IF receiver using conventional high speed ADC and bandpass sigma-delta ADC, respectively. We also had done the analysis and design of high-order bandpass sigma-delta modulator structure. In this year, we have developed a coefficient synthesis method for high order bandpass sigma-delta modulator using high order filter transfer functions (inverse Chebyshev bandreject filter function).

本计划将在三年内发展一个能应用在数位音讯广播系统的带通sigma-delta类比/数位转换器(analog-to-digital converter,ADC),在第一年度中我们分别以传统高速类比/数位转换器及带通SD类比/数位转换器的接收系统为例,并结合编码正交多工器(Coded Orthogonal Frequency Division Multiplex,COFDM)的技术,建立一套DAB系统模拟的方法,同时并研究有关高阶带通SD类比/数位调变器的架构及电路,并已成功开发出一个由高阶滤波器合成的高阶带通调变器。

The FPGA integration rate is very high, its component density from tens of thousands of system gates to the number surely system gate different, may complete the extremely complex succession and the combinatory logic electric circuit function, is suitable high speed in, the high density high end numeral logic circuit design domain.

FPGA的集成度很高,其器件密度从数万系统门到数千万系统门不等,可以完成极其复杂的时序与组合逻辑电路功能,适用于高速、高密度的高端数字逻辑电路设计领域。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业,不在行,求高手帮忙。谢谢!具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

The system is a high speed powder Hame spraying system,equipped with high precision powder feeder and oxygen acetylene name heat source,with compr- essed air to improve the Hame heat utilization The system consists of three pads:high energy torch,high precision powder feeder and gas supply Unit.

该系统是以氧乙快火焰作热源、用压缩空气提高火焰热能利用率、配备高精度送粉器送粉的高速火焰粉末喷涂装置。由高能喷涂枪、高精度送粉器和供气装置三部分构成。

Through comparing the intelligent instrument with the traditional instrument , the characteristics of the intelligent instrument are showed, which are high speed, high precision, high reliability and high anti-jamming properties. Accordingly, the structure of the data collecting system, which is based upon the Microcontroller Unit and the peripheral circuit, is established.

首先通过智能仪器系统与传统仪器仪表的比较,说明了智能仪器高速度、高精度、高可靠性和抗干扰性强的特点,由此确定了数据采集系统的构建方案,就是以单片机为核心,辅以外围电路,组成智能仪器系统。

High Speed Machining is one of the High Technologies,which is the second revolutional change after numerical control in manufacturing.It hsa not only the high productivity, but also has the high machining accuracy and high surface quality.

高速加工是继数控技术之后使制造技术产生第二次革命性飞跃的一项高新技术,它不但具有极高的生产效率,而且可显著提高零件的加工精度和表面质量。

The servo controller regards TI Company DSP chip TMS320LF2407A as the main chip,has adopted standard ISA bus structure,has high -integration and high-agility,has accomplished in real-time complex boolean calculation and control algo- rithms during motion control,and can be used to realize high-speed and high-accuracy servo control for mul- tiple axis.

O前言以DSP为核心的多轴伺服控制器越来越广泛地应用在运动控制系统中,上位机只需对被控对象实施总体的控制和管理,而位置反馈信号的采集,闭环控制计算及控制量的输出均由伺服控制器完成,具有运算速度快,支持复杂的运动算法的特点,能实现高速度、高精度的位置伺服或轨迹

In the last new years , as the demands of wireless communication system grows rapidly , the bands of microwave frequency had been saturated with various communication applications . To achieve wider spectrum for high-speed and high-capacity transmission , bands of millimeter-wave frequency are the solution of this problem . The advantage of MMW wireless communication systems is wider bandwidth comparing with microwave communication systems . To utilize the spectrum efficiently , many methods of complexly digital modulation is proposed . The more complex modulation , the higher linearity is required , and more various phase of signals are required to accomplish process of modulation . Therefore high-linearity and quadrature-phase modulator and demodulator are the emphasis of this thesis . For high level of integration , high performance and low cost , this chip is fabricated by the complementary oxide semi-conductor 0.13um process . A compact size of direct down-conversion and direct up conversion circuits will be presented in this thesis .

近年来随著无线通讯产业的蓬勃发展,微波频带已经趋近於饱和,为了追求更宽的频谱来达到更快传输速率及高资料容量的传输,宽频的毫米波频段提供了解决此问题的途径,毫米波无线通讯系统提供了相对於微波通讯系统宽频的优点,且为了更有效的使用频谱,各种不同且复杂的数位调变方式及方法被发表出来,越复杂的调变方式其所需的线性度越高,且需要更多不同的相位讯号来完成调变的过程,因此高线性度及四相位的调变及解调器将是此篇论文的研究重点,为了达到高整合性,高效能,及低成本的电路设计,我门利用互补式金氧半导体制程来完成此电路设计,因此一小面积的直接降频(Direct down-conversion)及直接升频(direct up-conversion)电路将在文中介绍。

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