查询词典 hardware interface

The text inside describes the system hardware work principle in brief first, and attach with the system hardware design frame diagram, combine development history that introduced the single a machine microprocessor, discuss this graduate design a function for applied each hardware connecting a people the technique connects with each one a mold piece and work processes, combine to describe in a specific way 8052,8279 and the SED1520 circumscribes the electric circuit connects oscular and soft, the hardware adjusts to try.

正文中首先简单描述系统硬件工作原理，且附以系统硬件设计框图，并介绍了单片机微处理器的发展史，论述了本次毕业设计所应用的各硬件接口技术和各个接口模块的功能及工作过程，并具体描述了8052、8279及SED1520外接电路接口的软、硬件调试。

The text insidedescribes the system hardware work principle in brief first, andattach with the system hardware design frame diagram, combinedevelopment history that introduced the single a machinemicroprocessor, discuss this graduate design a function for appliedeach hardware connecting a people the technique connects with eachone a mold piece and work processes, combine to describe in aspecific way 8052,8279 and the SED1520 circumscribes the electriccircuit connects oscular and soft, the hardware adjusts to try.

正文中首先简单描述系统硬件工作原理，且附以系统硬件设计框图，并介绍了单片机微处理器的发展史，论述了本次毕业设计所应用的各硬件接口技术和各个接口模块的功能及工作过程，并描述了8052、8279及SED1520外接电路接口的软、硬件调试。

The text inside describes the system hardware work principle in brief first, and attach with the system hardware design frame diagram, combine development history that introduced the single a machine microprocessor, discuss this graduate design a function for applied each hardware connecting a people the technique connects with each one a mold piece and work processes, combine to describe in a specific way 8052,8279 and the SED1520 circumscribes the electric circuit connects oscular and soft, the hardware adjusts to try.

正文中首先简单描述系统硬件工作原理，且附以系统硬件设计框图，并介绍了单片机微处理器的发展史，论述了本次毕业设计所应用的各硬件接口技术和各个接口模块的功能及工作过程，并描述了8052、8279及SED1520外接电路接口的软、硬件调试。

China Hardware Products Association has formally agreed in 2006 to the General Assembly at its forty-ninth World Hardware, China and the Cologne exhibition company exhibition jointly organized by the China International Hardware, also become the world's most influential hardware industry exposition.

中国五金制品协会已经正式获得2006年第四十九届世界五金大会的承办权，而中国与德国科隆展览公司联手举办的中国国际五金展也成为世界五金行业最具有影响力的展会。

In view of the above steps a second phenomenon, clone the operating system is to store the default camera driver in C: \ Windows \ Driver \ Camera \ 301P the following folder, when you click on the new CD-ROM drive to install the camera, the system will not prompt already exists there and the camera drivers to uninstall this driver, please find this folder and removed; step II, first to install a new camera driver, and then plug in the camera loaded with hardware, the installation is complete restart the computer after normal use; step three, repeat the above two steps do not directly click on the new CD-ROM installation the latest drivers, plug in the camera after the system detects new hardware and auto-complete loading hardware drivers; step four, entered the Device Manager, can see the image processing equipment has been successfully installed, but when you open the "AMCAP" Preview images can not be preview, black and white, black phenomenon; five steps to the right mouse button on the image processing equipment "Vimicro USB PC Camera (ZC0301PL)" update driver, a dialog box appears choose "from the list or designated as the location of the installation steps to choose the next six to choose "Do not Search" and enter "to install from the floppy disk interface.

针对以上第二种现象步骤一、克隆操作系统是将摄像头驱动默认存放在C：\Windows\Driver\Camera\301P文件夹下面，当你点击新的摄像头驱动光盘安装时，系统不会提示已经存在有摄像头驱动并把此驱动卸载，请把这个文件夹找到并删除掉；步骤二、先安装新的摄像头驱动，再插上摄像头装载硬件，安装完成后重新启动电脑后可以正常使用；步骤三、不需重复以上两个步骤，直接点击新的光盘安装最新的驱动，插上摄像头后系统检测到新硬件，并自动完成硬件驱动装载；步骤四、进入到设备管理器中，，可以看到图像处理设备已经成功安装，但当你打开"AMCAP"预览图像时会出现无法预览、白屏、黑屏现象；步骤五、把鼠标右键放在图像处理设备的"Vimicro USB PC Camera（ZC0301PL）"更新驱动程序，出现对话框后选择"从列表或指定为位置安装步骤六选择下一步后选择"不要搜索"，进入"从软盘安装界面。

By thorough analysis and synthetize this paper made a frame of the System of Intelligent Instrument and its hardware structure. As followed, this paper depicted design details of Intelligent Instrument "s hardware, it included the design of interface circuit, data commutations and digital logic of DSP, MCU, Internet"s chip and ISPs apparatus etc., and have designed schematic map and circuit. So it accomplished the full design of hardware/software of the New Type Intelligent Instrument.

本文具体给出了新型智能仪器硬件结构及实现，描述了智能仪器硬件设计细节，包括数字信号处理器、单片机、Internet接入芯片、可编程数字/模拟器件等在新型智能仪器中的接口电路设计、数据通信设计和数字逻辑设计等，详细地给出了设计原理图和电路图；给出了新型智能仪器的软件设计细节，从而完成了新型智能仪器完整的软硬件设计。

Hardware design such as channel switch board, testing frequency board and frequency counter board and friend interface reduce the cost on hardware and software. In addition, the smart hardware design reduce the time of sampling cycle and increase the measure precision. The system completely satisfy the industrial field demand.

自主开发了通道开关板、频率测量板、频率计数器选通板等硬件，并提供了良好的人机界面，使整个系统的软、硬件成本大大降低，而且通过巧妙的硬件设计缩短了采样周期并提供了测量精度，可完全满足工业现场测量要求。

The experimental goal is to use SOPC-NIOSII EDA / SOPC system platform for real-time moving object detection system in this paper. After the inputs of image penetrated the CMOS Sensor to receive the data of the image makes the RGB form the transformation. The CPU processes operation of image detects. After the processed of image deliveres to VGA displayed output of real-time image. We use example programs of DE2 platfrom to achieve entire hardware on experiment board of SOPC-NIOSII EDA / SOPC System platform. On system of dectect image we divided into two parts : hardware and software. We use Verrilog of HDL to modify code in hardware. To use Custom IP of SOPC Builder produced IP of our need. We need a interface to connect in the COMS Sensor to FPGA and FPGA to VGA among. The code synthesize to create a programming file of *.S by Quartus II. Then, to use USB BLASTER of SOPC-NIOSII EDA/SOPC System platform programmed on FPGA. We use NIOS II IDE to assign DMA address in sofaware. We use SOPC-NIOSII EDA / SOPC System platform of Hum-Heng Technology co.

中文摘要本论文实验目标是在於利用SOPC-NIOSII EDA/SOPC系统平台来实现即时移动物体侦测的系统，影像输入透过CMOS Sensor接收影像的资料经过RGB格式的转换，再经过处理器处理影像侦测的运算，最后再将处里后的影像资料传送给VGA做即时的影像输出，我们使用DE2平台的测试范例程式转换在SOPC-NIOSII EDA/SOPC系统平台实验板来实现整个的硬体，我们将影像侦测系统分为硬体和软体二部份，硬体部分我们使用Verilog硬体描述语言修改撰写，利用SOPC Builder的自订IP产生我们所需的IP ，在COMS Sensor到FPGA跟FPGA到VGA中间我们需要一个interface来进行连接，经由Quartus II来合成产生*。sof的烧入档，然后利用SOPC-NIOSII EDA/SOPC系统平台专用的USB BLASTER来烧入到FPGA上，软体部分我们使用NIOSII IDE来定址我们DMA位址，主板我们采用华亨科技公司的SOPC-NIOSII EDA/SOPC系统平台。

This paper introduces one design method of the CAN bus interface and the RS232 bus interface interconversion, emphasizes two kind of bus level transformation relations, realizes the CAN bus and various modules connection design, formulates the design proposal of corresponding software and hardware, and gives the flow chart of software design as well as the partial schematic diagram of hardware design.

介绍将CAN总线接口与RS232总线接口相互转换的设计方法和2种总线电平转换关系，实现CAN总线与各模块的接口设计，制定了相应的软硬件设计方案，并给出软件设计流程图以及部分硬件设计原理图。

First of all, this paper discusses the designing of minimal system about TMS320C5402 DSP device in detail. Secondly, this paper describes the communication method between TMS320C5402 and TLC320AD50C when the multichannel buffered serial port of C5402 is set up in serial port mode. Hardware configuration and software diagram are described. Thirdly, this paper introduces a designing of human-machine interface device, including hardware interface and accompanying software routine.

首先，详细介绍了基于TMS320C5402芯片的DSP实验系统的最小系统设计；其次，介绍了TMS320C5402的多通道缓冲串口与音频接口芯片(TLC320AD50C)在串口工作模式下实现串行通讯的设计，并给(来源：5cAB9fC论文网www.abclunwen.com)出相应的硬件配置、软件流程；再次，阐述了TMS320C5402的人机接口软硬件设计；最后，本文设计出了一些基本实验和有针对性的实验。

Its initial name is "the New York daily Times"(The New-York Daily Times), the founder is Henry J· Raymond and George Jones.

它最初的名字是"纽约每日时报"（The New-York Daily Times），创始人是亨利·J·雷蒙德和乔治·琼斯。

The reactions and transformation have resulted in a great volume increase and thus destroyed the structure,weakened the strength and corrosion resistance of the materials.

这一系列反应使试样产生很大的体积膨胀，从而破坏了制品结构。因此，与镁炭砖不同，Al和Si不但不能增强镁锆炭砖，而且使其结构破坏和耐侵蚀性降低。