查询词典 formaldehyde

Common Vicia faba stomata was more sensitive to formaldehyde than that of Songzi green Vicia faba.

结论］普通蚕豆叶片气孔对甲醛污染的反应比松滋青皮蚕豆叶片气孔的反应更敏感。

Objective To study the influence of formaldehyde sulphoxylate on the expression of glial fibrillar acidic protein in mice hippocampus.

目的研究次硫酸氢钠甲醛对小鼠海马神经胶质酸性蛋白表达的影响。

Objective To study the influence of formaldehyde sulphoxylate on the expression of glial fibrillar acidic protein in mice hippocampus.

目的 研究次硫酸氢钠甲醛对小鼠海马神经胶质酸性蛋白表达的影响。

In addition, the methanol contained in aspartame breaks down into formic acid and formaldehyde.

此外，甲醇所载阿斯巴甜破裂成甲酸和甲醛。

The preparation of glycoluril and the optimum process conditions are studied lthe effects of different etherates on the content of free formaldehyde in the resulting finishing agents are also compared.

对甘脲树脂的制备及最佳工艺条件进行了研究，比较了各种不同醚化剂对整理剂产品中游离甲醛含量的影响。

Alkyl substituted imidazoles were synthesized by reaction of alkyl amines with glyoxal, formaldehyde and ammonia in methanol.

在对环境保护和资源的可持续利用倍受关注的今天，绿色化学是化学发展的必然趋势。

The guaiacol methods of synthesizing vanillin mainly includes: nitroso group method, Glyoxalic acid method, formaldehyde method, Reimer-Tiemann method, Trichloroacetaldehyde acetochloralb method, electrolytic oxidation method.

愈创木酚法合成香兰素的方法主要有亚硝基法、乙醛酸法、甲醛法、Reimer-Tiemann法、三氯乙醛法、电解氧化法，本文综述了愈创木酚法合成香兰素的研究进展，并对愈创木酚法合成香兰素提出了展望。

Using glyoxylic acid to replace the harmful chemical substance formaldehyde as a reducing agent, an copper layer was deposited on rosin substrate by this electroless copper plating technology.

用乙醛酸代替有害的化学药品甲醛作为还原剂，在树脂基材上进行化学镀铜。

The optimal pH and temperature were 12.5℃ and 40℃,respectively. The process is environmentally benign with no formaldehyde.Key words: glyoxylic acid;deposition rate;electroless copper plating

优化条件下，可获得结合力良好、表面均匀光亮的镀层，工艺中不使用甲醛，无污染，具有良好的环境效应及社会效应，应用前景广阔。

Using glyoxylic acid to replace the harmful chemical substance such as formaldehyde as a reducing agent, an electroless copper plating on difficulty deposited substrates was fulfilled, which including Al,Ti and wafers having TiN and TiSiN as the barrier layers.The surface morphologies and grain structures of copper deposits prepared were analyzed.

摘 要：采用乙醛酸代替有害的化学药品作为还原剂的化学镀技术，在工业纯铝片、工业纯钛片、以TiN作为扩散防护层的硅片和以TiSiN作为扩散防护层的硅片等难镀材料实现了化学镀铜。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。