查询词典 flip-flopped

Perhaps this is the flip side of being an abstainer, but I've found that if I'm trying to make myself do something, I do better if I do that thing every day.

也许这是"戒断"的相反面，可是我发现如果我要强迫自己去做某件事情，那么如果每天都去做就会表现更好。

Algebraic logic 2 logic function based on the express ways and simplification of the 3 in the scale of integrated circuits analysis and design of 4 flip-flops and a simple application circuit 5 synchronous sequential circuit analysis and design of 6 common synchronous sequential circuit 7 integrates asynchronous sequential circuits analysis and design of digital logic 8 the latest developments in technology is our university teachers digital logic courseware, very good

逻辑代数基础 2逻辑函数的表示方式和化简 3中规模集成电路的分析和设计 4触发器及其简单应用电路 5同步时序电路的分析和设计 6常见的同步集成时序电路 7异步时序电路的分析和设计 8数字逻辑技术的最新发展是我们大学老师数字逻辑的课件，非常不错

A flip of the wrist.He sent a special governor to Altorf, a man named Gessler, who would rule with a firm hand .

他往阿尔托夫城派了一个特别总督－－－一个名叫盖斯靳的人，这个人要用铁的手腕来统治。

That flip transfers angular momentum to the domain wall, pushing it along in the direction of the current.

这一方向的转变会将角动力传递到域壁上，推动域沿着电流的方向移动。

On each page, the artist changes the figure slightly so that when you flip rapidly between sheets, the drawing appears animated.

在每一页上，艺术家的数字略有变化，当你迅速翻转板之间，绘图显示动画。

Bumps growth on alumina substrate side and gallium arsenide chip side were processed and discussed as well as the flip-chip bonding process.

本实验尝试以不同尺寸大小的共平面波导传输线，配合凸块位置的分布，研究其在高频下的S参数表现。

6"Ball cover, Features beauty,refinement; The precise step enters the electrical engineering to drive, go placidity,go to nicety;shift aptitude, Horizontal speed 0.5°/s---240°/s ,Vertical speed 0.5°/s---200°/s;Vertical running have function to "Auto-flip, 360°continous horizontal flip;Dome speed auto-shift--- The speed of housing become the zoom lens depth to increase its speed pro rata lower gradually, a little bit on guard function; Auto-focus,auto-iris,Tum to surge and lightning strike protector;Menu setup and control function,estate memory before break off electricity and auto-resume fuction in come to electricity; 64initialize spots,5 auto-patrol path;Contain multi-confer;485standard communcation interface;Function to give an alarm to linkage.

6英寸球罩，外型美观，精巧；精密步进电机驱动，运转平稳，定位准确；智能变速，0.5°/S-240°/S水平变速，0.5°/S-200°/S垂直变速；垂直转动有&自动翻转&功能， 360度持续水平转动；云台速度自动调整—云台的速度随变焦镜头深度的增加其速度按比例逐渐降低，守望点功能；自动聚焦，自动光圈，内置浪涌及雷击保护装置；菜单设置及控制功能，断电前状态记忆及来电自动恢复功能；64个预置点， 5条自动巡视路径；兼容多种协议；标准485通讯接口；报警联动功能。具有球机环境温度和摄像机角度数显功能。

Select the layer with water, paste lights and flip vertical (Edit menu - Transform - Flip vertical).

选择与水层，粘贴灯和垂直翻转（编辑菜单-变换-垂直翻转）。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

The Back Flip Iron Cross is a combination of two aerial tricks - the Back Flip and the Iron Cross.

后空翻铁十字是两个空中动作的结合----后空翻和铁十字。

The absorption and distribution of chromium were studied in ryeusing nutrient culture technique and pot experiment.

采用不同浓度K2CrO4(0，0.4，0.8和1.2 mmol/L)的Hoagland营养液处理黑麦幼苗，测定铬在黑麦体内的亚细胞分布、铬化学形态及不同部位的积累。

By analyzing theory foundation of mathematical morphology in the digital image processing, researching morphology arithmetic of the binary Image, discussing two basic forms for the least structure element: dilation and erosion.

通过分析数学形态学在图像中的理论基础，研究二值图像的形态分析算法，探讨最小结构元素的两种基本形态：膨胀和腐蚀；分析了数学形态学复杂算法的基本原理，把数学形态学的部分并行处理理念引入到家实际应用中。