查询词典 flip-flopped

The whole PWM circuit contains two subcircuit, the front-end is PWM module that make up of the counter that based on nine MOSFET True-Single-Phase-Clock D flip-flop; the back-end is demodulated module, which is consist of a three order Chebyshev low-pass filter used trans-conductor capacitor. All the subcircuits are simulated. At last, an approving simulated result of the whole circuit is given too.

在调制部分，利用九管单相时钟D触发器构成计数器，并由此组成了脉冲宽度调制电路，同时给出了在典型温度下的仿真结果；在解调部分，介绍了低通滤波器从无源到有源的设计方法，设计了三阶切比雪夫低通跨导电容滤波器，同样给出了相应的仿真结果；最后，作为将脉冲宽度调制电路和滤波器作为整体电路，以脉冲调频波为输入进行了仿真，取得了令人满意的结果。

Why Your Customers Don't Buy Your Second Product and How You Can Flip Swith the Marketing Power of Your Website?

为什么顾客不买你的产品，怎么能倒装第二开关电力营销贵网站？

They, along with the free documentation at http://www.djangoproject.com/, are probably what youll flip back to occasionally to recall syntax or find quick synopses of what certain parts of Django do.

要回忆语法或查阅 Django 某部分的功能概要时，你偶尔可能会回来翻翻这些资料以及 http：//www.djangoproject.com/上的免费文档。

If you flip through the watch's user guide or manual, you will not likely to find any explanation or definition on what is tachymeter or how to use the tachymeter functionality.

如果你翻开手表的用户指南或手册，您将不会有可能找到任何解释或定义，对什么是tachymeter或如何使用tachymeter功能。

Cent? NO!I'm Comptons most wanted when I'm ridin wit Timbo!Girl if you got a big back lemme bend thatShow me where ya friends at we can flip thatoh-oh-OH!!!

根据有关法律法规和政策，部分搜索结果可能未予显示，请点击这里查看

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

It has been found that flip chip without and with underfill encapsulation has different corrosion modes. Possible failure mechanism was presented.

实验发现，倒装芯片封装在使用和不使用下部填充料的情况下具有完全不同的铝腐蚀模式，并阐述了可能的腐蚀机理。

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

They have been demonstrated to be used in analysis of most failures in flip chip assembly as follows: 1 We firstly reported the IRM inspection of underfill delamination and crack.

主要结果为： 1首次利用红外显微镜测出了倒装芯片中的下部填充料裂缝和分层的位置，以及分层中空气间隙的大小。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

扫描电镜观察多杀性巴氏杆菌细菌幽灵和菌落形成单位评价遗传灭活率。