查询词典 flip-flopped

A conditional precharged double edge-triggered flip-flop is presented and simulated in TSMC 100nm technology.

另外，一种条件性充电双时脉边缘触发正反器被提出且使用TSMC 100nm技术实验。

The low swing conditional capture edge-triggered flip-flop suitable for the low switching activity applications is proposed and simulated in TSMC 100nm technology.

一个适合应用在低资料转换率应用的低震荡电压条件性撷取时脉边缘触发正反器被提出且使用TSMC 100nm技术设计。

The low clock swing edge-triggered flip-flop suitable for the low switching activity applications is proposed and simulated in UMC 90nm technology, and layout in UMC 90nm standard cell.

一个适合应用在低震荡电压时脉的边缘触发正反器被提出，且使用UMC 90nm标准元件的技术来设计以及布局。

In this paper ,the unusual phenomena of TTL JK edge-triggered flip-flops are brought forth by experiment when the Cp edge's time is excessive long , and the cause of it is proved up , the formulae for the maxima of CP edge's time are set up as well , which is consistent with the practical measurement.

文献[1]在TTLJK触发器的评价与选用概要中，把对CP边沿时间要求作为衡量触发器品质优劣的主要指标之一，文献[2]研究表明，若CP边沿时间过长，在CP下降沿会出现集成TTL主从JK触发器输出状态的错误变化。

The register is an edge-triggered D-type flip-flop.

登记册是一个边沿触发的D型触发器。

The single edge-triggered flip-flop uses low swing voltage delay chain generating the operation transparency window for reduces the power consumption.

此单缘触发正反器使用了低电压的时脉震荡延迟电路，来产生操作的触发波形和电晶体叠加技术，来达到减低漏电流的低功耗设计。

As the objects on which multi-valued modular algebra operation is imposed usually are multivalued signals, so are the operation results. Application of ternary edge-triggered flip-flops makes us be able omit extracoding circuits in timing circuits.

由'J'多值模代数中的两个基本运算的作用对象和运算结果均为多值信号，所以它的应用避免了以往在采用基｝POOI代数的三值触发器时，由于输入、输出信号不匹配而必须增加附加编码电路的问题。

The flip side of the coin is The White Queen, an ethereal creature who is loved by all.

而与她相反的白皇后则是个飘逸的美人，深受大家的爱戴。

Many months have now passed and so far I have tried to flip that switch not only when I've thought it might come in handy, but every morning, every evening, like a prayer.

现在，已经过去几个月了，到目前为止，我尽可能的去触摸我脑海里的那个开关，不管是我觉得我马上就要发火的时候，还是每个早晨，每个晚上，就像一个祈祷者一样。

In this paper, the duplex solder joints geometry of flip chip is simulated by Surface Evolver program.

摘 要：本文采用 Surface Evolver 软件对倒装焊复合焊点的几何形态进行了模拟。

Do you know, i need you to come back

你知道吗，我需要你回来

Yang yinshu、Wang xiangsheng、Li decang,The first discovery of haemaphysalis conicinna.

1〕 杨银书，王祥生，李德昌。安徽省首次发现嗜群血蜱。