查询词典 flip-flop

Cent? NO!I'm Comptons most wanted when I'm ridin wit Timbo!Girl if you got a big back lemme bend thatShow me where ya friends at we can flip thatoh-oh-OH!!!

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It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

It has been found that flip chip without and with underfill encapsulation has different corrosion modes. Possible failure mechanism was presented.

实验发现，倒装芯片封装在使用和不使用下部填充料的情况下具有完全不同的铝腐蚀模式，并阐述了可能的腐蚀机理。

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

They have been demonstrated to be used in analysis of most failures in flip chip assembly as follows: 1 We firstly reported the IRM inspection of underfill delamination and crack.

主要结果为： 1首次利用红外显微镜测出了倒装芯片中的下部填充料裂缝和分层的位置，以及分层中空气间隙的大小。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

The thermal fatigue life of SnPb joints in Flip Chip lies on underfill mechanical properties and delamenation.

热应力重分配的决定性因素为底充胶杨氏模量，热膨胀系数的影响相对较小。

Capillary phenomena was studied and discussed by the scholars about 200 years ago, but the progress was slow due to the limited equipments and manufacture precision of the microchannel.In recent years, because of the rapid development of MEMS and micromachining, many applications of the capillary flow is widely developing in some modern processes, such as underfilling of flip chip, flow in microfluidic chip or biochip, and a variety of other fields.

摘要 毛细现象大约在200年前便断断续续被欧美学者所研究讨论，但由於当时微细加工受到仪器设备和制造精度的限制，因此发展极为缓慢；近年来由於微机电系统与微细加工之精进，许多具有微流道的应用设备，陆续被制作问世，加上光学显微镜与影像撷取设备的普遍，对於研究此课题的推展极有助益；且随著微生医、覆晶底胶充填与微流体系统等领域之受到重视，毛细现象导致的充填问题、驱动原理及液体流动的控制，都变得相当的重要；本研究基於如此的动机与目的，进行微流道内液体之毛细流动现象及时间的探讨。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

I saw it fly up and flip on its side killing a soldier and wounding the rest.

我看到它飞起来，翻到一边，一个士兵死了，其他的人受了伤。

As of Tuesday, Google's results were still censored in China.

截至周二，谷歌的搜索结果仍受中国审查。

In order to make the positive action increase and negative one decrease, the sub-forces of the social factors must be adjusted to form a centripetal force.

在这一过程中，人的主体性发挥是社会有机体健康发展的灵魂。