查询词典 flip-flap

Perhaps this is the flip side of being an abstainer, but I've found that if I'm trying to make myself do something, I do better if I do that thing every day.

也许这是"戒断"的相反面，可是我发现如果我要强迫自己去做某件事情，那么如果每天都去做就会表现更好。

Algebraic logic 2 logic function based on the express ways and simplification of the 3 in the scale of integrated circuits analysis and design of 4 flip-flops and a simple application circuit 5 synchronous sequential circuit analysis and design of 6 common synchronous sequential circuit 7 integrates asynchronous sequential circuits analysis and design of digital logic 8 the latest developments in technology is our university teachers digital logic courseware, very good

逻辑代数基础 2逻辑函数的表示方式和化简 3中规模集成电路的分析和设计 4触发器及其简单应用电路 5同步时序电路的分析和设计 6常见的同步集成时序电路 7异步时序电路的分析和设计 8数字逻辑技术的最新发展是我们大学老师数字逻辑的课件，非常不错

A flip of the wrist.He sent a special governor to Altorf, a man named Gessler, who would rule with a firm hand .

他往阿尔托夫城派了一个特别总督－－－一个名叫盖斯靳的人，这个人要用铁的手腕来统治。

That flip transfers angular momentum to the domain wall, pushing it along in the direction of the current.

这一方向的转变会将角动力传递到域壁上，推动域沿着电流的方向移动。

On each page, the artist changes the figure slightly so that when you flip rapidly between sheets, the drawing appears animated.

在每一页上，艺术家的数字略有变化，当你迅速翻转板之间，绘图显示动画。

Bumps growth on alumina substrate side and gallium arsenide chip side were processed and discussed as well as the flip-chip bonding process.

本实验尝试以不同尺寸大小的共平面波导传输线，配合凸块位置的分布，研究其在高频下的S参数表现。

They go out in the morning at sunrise, and they all call the flip of a coin.

让我们假定，全美国2.25亿的人口在明天早晨起床时都掷出一枚一美元的铜板。

Select the layer with water, paste lights and flip vertical (Edit menu - Transform - Flip vertical).

选择与水层，粘贴灯和垂直翻转（编辑菜单-变换-垂直翻转）。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种，具有高I/O数、电子讯号路径短以及尺寸小等优点，而采用覆晶接合之电子元件大部分均以底部充填技术进行封装；底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术，可以确保晶片不受到外力的影响而损及封装体，但此技术具有充填时间长、容易产生短射与包风等缺点，使得覆晶封装制程良率不高，间接影响覆晶封装产品的普及率，因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响，以供业界参考。

The Back Flip Iron Cross is a combination of two aerial tricks - the Back Flip and the Iron Cross.

后空翻铁十字是两个空中动作的结合----后空翻和铁十字。

Neither the killing of Mr Zarqawi nor any breakthrough on the political front will stop the insurgency and the fratricidal murders in their tracks.

在对危险的南部地区访问时，他斥责什叶派民兵领导人对中央集权的挑衅行为。

In fact,I've got him on the satellite mobile right now.

实际上 我们已接通卫星可视电话了