查询词典 flip-flap

They, along with the free documentation at http://www.djangoproject.com/, are probably what youll flip back to occasionally to recall syntax or find quick synopses of what certain parts of Django do.

要回忆语法或查阅 Django 某部分的功能概要时，你偶尔可能会回来翻翻这些资料以及 http：//www.djangoproject.com/上的免费文档。

If you flip through the watch's user guide or manual, you will not likely to find any explanation or definition on what is tachymeter or how to use the tachymeter functionality.

如果你翻开手表的用户指南或手册，您将不会有可能找到任何解释或定义，对什么是tachymeter或如何使用tachymeter功能。

Cent? NO!I'm Comptons most wanted when I'm ridin wit Timbo!Girl if you got a big back lemme bend thatShow me where ya friends at we can flip thatoh-oh-OH!!!

根据有关法律法规和政策，部分搜索结果可能未予显示，请点击这里查看

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

It has been found that flip chip without and with underfill encapsulation has different corrosion modes. Possible failure mechanism was presented.

实验发现，倒装芯片封装在使用和不使用下部填充料的情况下具有完全不同的铝腐蚀模式，并阐述了可能的腐蚀机理。

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion in flip chip technology.

底层填充技术应用于倒装芯片热膨胀系数配合的最小化，它也被扩展应用到增加CSP(Chip Scale Package 芯片级封装)的机械强度。

They have been demonstrated to be used in analysis of most failures in flip chip assembly as follows: 1 We firstly reported the IRM inspection of underfill delamination and crack.

主要结果为： 1首次利用红外显微镜测出了倒装芯片中的下部填充料裂缝和分层的位置，以及分层中空气间隙的大小。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

The thermal fatigue life of SnPb joints in Flip Chip lies on underfill mechanical properties and delamenation.

热应力重分配的决定性因素为底充胶杨氏模量，热膨胀系数的影响相对较小。

Capillary phenomena was studied and discussed by the scholars about 200 years ago, but the progress was slow due to the limited equipments and manufacture precision of the microchannel.In recent years, because of the rapid development of MEMS and micromachining, many applications of the capillary flow is widely developing in some modern processes, such as underfilling of flip chip, flow in microfluidic chip or biochip, and a variety of other fields.

摘要 毛细现象大约在200年前便断断续续被欧美学者所研究讨论，但由於当时微细加工受到仪器设备和制造精度的限制，因此发展极为缓慢；近年来由於微机电系统与微细加工之精进，许多具有微流道的应用设备，陆续被制作问世，加上光学显微镜与影像撷取设备的普遍，对於研究此课题的推展极有助益；且随著微生医、覆晶底胶充填与微流体系统等领域之受到重视，毛细现象导致的充填问题、驱动原理及液体流动的控制，都变得相当的重要；本研究基於如此的动机与目的，进行微流道内液体之毛细流动现象及时间的探讨。

But we don't care about Battlegrounds.

但我们并不在乎沙场中的显露。

Ah! don't mention it, the butcher's shop is a horror.

啊！不用提了。提到肉，真是糟透了。