查询词典 flip chip

6"Ball cover, Features beauty,refinement; The precise step enters the electrical engineering to drive, go placidity,go to nicety;shift aptitude, Horizontal speed 0.5°/s---240°/s ,Vertical speed 0.5°/s---200°/s;Vertical running have function to "Auto-flip, 360°continous horizontal flip;Dome speed auto-shift--- The speed of housing become the zoom lens depth to increase its speed pro rata lower gradually, a little bit on guard function; Auto-focus,auto-iris,Tum to surge and lightning strike protector;Menu setup and control function,estate memory before break off electricity and auto-resume fuction in come to electricity; 64initialize spots,5 auto-patrol path;Contain multi-confer;485standard communcation interface;Function to give an alarm to linkage.

6英寸球罩，外型美观，精巧；精密步进电机驱动，运转平稳，定位准确；智能变速，0.5°/S-240°/S水平变速，0.5°/S-200°/S垂直变速；垂直转动有&自动翻转&功能， 360度持续水平转动；云台速度自动调整—云台的速度随变焦镜头深度的增加其速度按比例逐渐降低，守望点功能；自动聚焦，自动光圈，内置浪涌及雷击保护装置；菜单设置及控制功能，断电前状态记忆及来电自动恢复功能；64个预置点， 5条自动巡视路径；兼容多种协议；标准485通讯接口；报警联动功能。具有球机环境温度和摄像机角度数显功能。

Select the layer with water, paste lights and flip vertical (Edit menu - Transform - Flip vertical).

选择与水层，粘贴灯和垂直翻转（编辑菜单-变换-垂直翻转）。

The Back Flip Iron Cross is a combination of two aerial tricks - the Back Flip and the Iron Cross.

后空翻铁十字是两个空中动作的结合----后空翻和铁十字。

PART 1 UNIT 1 B Electrical and Electronic Engineering Basics A Electrical Networks ———————————— 3 Three-phase Circuits A The Operational Amplifier ——————————— 5 UNIT 2 B Transistors A Logical Variables and Flip-flop —————————— 8 UNIT 3 B Binary Number System A Power Semiconductor Devices —————————— 11 UNIT 4 B Power Electronic Converters A Types of DC Motors —————————————15 UNIT 5 B Closed-loop Control of DC Drivers A AC Machines ———————————————19 UNIT 6 B Induction Motor Drive A Electric Power System ————————————22 UNIT 7 B PART 2 UNIT 1 B Power System Automation Control Theory A The World of Control ————————————27 —————29 The Transfer Function and the Laplace Transformation UNIT 2 B A Stability and the Time Response ————————— 30 Steady State————————————————— 31 A The Root Locus ————————————— 32 ————— 33 UNIT 3 B The Frequency Response Methods: Nyquist Diagrams UNIT 4 A The Frequency Response Methods: Bode Piots ————— 34 B Nonlinear Control System 37 UNIT 5 A Introduction to Modern Control Theory B State Equations 40 38 UNIT 6 A Controllability, Observability, and Stability B Optimum Control Systems UNIT 7 A Conventional and Intelligent Control B Artificial Neural Network Computer Control Technology A Computer Structure and Function 42 B Fundamentals of Computer and Networks 43 44 PART 3 UNIT 1 UNIT 2 A Interfaces to External Signals and Devices B The Applications of Computers 46 UNIT 3 A PLC Overview B PACs for Industrial Control, the Future of Control UNIT 4 A Fundamentals of Single-chip Microcomputer 49 B Understanding DSP and Its Uses 1 UNIT 5 A A First Look at Embedded Systems B Embedded Systems Design Process Control A A Process Control System B 50 PART 4 UNIT 1 Fundamentals of Process Control 52 53 UNIT 2 A Sensors and Transmitters B Final Control Elements and Controllers UNIT 3 A P Controllers and PI Controllers B PID Controllers and Other Controllers UNIT 4 A Indicating Instruments B Control Panels Control Based on Network and Information A Automation Networking Application Areas B Evolution of Control System Architecture PART 5 UNIT 1 UNIT 2 A Fundamental Issues in Networked Control Systems B Stability of NCSs with Network-induced Delay UNIT 3 A Fundamentals of the Database System B Virtual Manufacturing—A Growing Trend in Automation UNIT 4 A Concepts of Computer Integrated Manufacturing B Enterprise Resources Planning and Beyond Synthetic Applications of Automatic Technology A Recent Advances and Future Trends in Electrical Machine Drivers B System Evolution in Intelligent Buildings PART 6 UNIT 1 UNIT 2 A Industrial Robot B A General Introduction to Pattern Recognition UNIT 3 A Renewable Energy B Electric Vehicles UNIT 1 A

电路 2 电路或电网络由以某种方式连接的电阻器，电感器和电容器等元件组成。如果网络不包含能源，如电池或发电机，那么就被称作无源网络。换句话说，如果存在一个或多个能源，那么组合的结果为有源网络。在研究电网络的特性时，我们感兴趣的是确定电路中的电压和电流。因为网络由无源电路元件组成，所以必须首先定义这些元件的电特性。就电阻来说，电压-电流的关系由欧姆定律给出，欧姆定律指出：电阻两端的电压等于电阻上流过的电流乘以电阻值。在数学上表达为： u=iR (1-1A-1)式中 u=电压，伏特；i =电流，安培；R =电阻，欧姆。纯电感电压由法拉第定律定义，法拉第定律指出：电感两端的电压正比于流过电感的电流随时间的变化率。因此可得到：U=Ldi/dt 式中 di/dt =电流变化率，安培/秒； L =感应系数，享利。电容两端建立的电压正比于电容两极板上积累的电荷 q 。因为电荷的积累可表示为电荷增量 dq 的和或积分，因此得到的等式为 u=，式中电容量 C 是与电压和电荷相关的比例常数。由定义可知，电流等于电荷随时间的变化率，可表示为 i = dq/dt。因此电荷增量 dq 等于电流乘以相应的时间增量，或 dq = i dt，那么等式(1-1A-3)可写为式中 C =电容量，法拉。

PART 1 Electrical and Electronic Engineering Basics UNIT 1 A Electrical Networks B Three-phase Circuits UNIT 2 A The Operational Amplifier ——————————— 5 B Transistors UNIT 3 A Logical Variables and Flip-flop —————————— 8 ———————————— 3 B Binary Number System UNIT 4 A Power Semiconductor Devices —————————— 11 B Power Electronic Converters UNIT 5 A Types of DC Motors —————————————15 B Closed-loop Control of DC Drivers UNIT 6 A AC Machines ———————————————19 B Induction Motor Drive UNIT 7 A Electric Power System ————————————22 B Power System Automation PART 2 Control Theory UNIT 1 A The World of Control ————————————27 B The Transfer Function and the Laplace Transformation UNIT 2 A B —————29 Stability and the Time Response ————————— 30 ————————————— 32 Steady State————————————————— 31 UNIT 3 A The Root Locus B The Frequency Response Methods: Nyquist Diagrams ————— 33 UNIT 4 A The Frequency Response Methods: Bode Piots ————— 34 B Nonlinear Control System 37 UNIT 5 A Introduction to Modern Control Theory B UNIT 6 State Equations 40 38 A Controllability, Observability, and Stability B Optimum Control Systems UNIT 7 A Conventional and Intelligent Control B Artificial Neural Network PART 3 UNIT 1 Computer Control Technology A Computer Structure and Function B 42 43 44 Fundamentals of Computer and Networks UNIT 2 A Interfaces to External Signals and Devices B The Applications of Computers 46 UNIT 3 A PLC Overview B PACs for Industrial Control, the Future of Control 1 UNIT 4 A Fundamentals of Single-chip Microcomputer B Understanding DSP and Its Uses 49 UNIT 5 A A First Look at Embedded Systems B Embedded Systems Design PART 4 UNIT 1 Process Control A A Process Control System 50 B Fundamentals of Process Control 53 52 UNIT 2 A Sensors and Transmitters B Final Control Elements and Controllers UNIT 3 A P Controllers and PI Controllers B PID Controllers and Other Controllers UNIT 4 A Indicating Instruments B Control Panels PART 5 UNIT 1 Control Based on Network and Information A Automation Networking Application Areas B Evolution of Control System Architecture UNIT 2 A Fundamental Issues in Networked Control Systems B Stability of NCSs with Network-induced Delay UNIT 3 A Fundamentals of the Database System B Virtual Manufacturing—A Growing Trend in Automation UNIT 4 A Concepts of Computer Integrated Manufacturing B Enterprise Resources Planning and Beyond PART 6 UNIT 1 Synthetic Applications of Automatic Technology A Recent Advances and Future Trends in Electrical Machine Drivers B System Evolution in Intelligent Buildings UNIT 2 A Industrial Robot B A General Introduction to Pattern Recognition UNIT 3 A Renewable Energy B Electric Vehicles 2 UNIT 1 A

电路 电路或电网络由以某种方式连接的电阻器，电感器和电容器等元件组成。如果网络不包含能源，如电池或发电机，那么就被称作无源网络。换句话说，如果存在一个或多个能源，那么组合的结果为有源网络。在研究电网络的特性时，我们感兴趣的是确定电路中的电压和电流。因为网络由无源电路元件组成，所以必须首先定义这些元件的电特性。就电阻来说，电压-电流的关系由欧姆定律给出，欧姆定律指出：电阻两端的电压等于电阻上流过的电流乘以电阻值。在数学上表达为： u=iR (1-1A-1)式中 u=电压，伏特；i =电流，安培；R =电阻，欧姆。纯电感电压由法拉第定律定义，法拉第定律指出：电感两端的电压正比于流过电感的电流随时间的变化率。因此可得到：U=Ldi/dt 式中 di/dt =电流变化率，安培/秒； L =感应系数，享利。电容两端建立的电压正比于电容两极板上积累的电荷 q 。因为电荷的积累可表示为电荷增量 dq 的和或积分，因此得到的等式为 u=，式中电容量 C 是与电压和电荷相关的比例常数。由定义可知，电流等于电荷随时间的变化率，可表示为 i = dq/dt。因此电荷增量 dq 等于电流乘以相应的时间增量，或 dq = i dt，那么等式(1-1A-3)可写为式中 C =电容量，法拉。

PART 1 Electrical and Electronic Engineering Basics UNIT 1 A UNIT 2 A UNIT 3 A UNIT 4 A UNIT 5 A UNIT 6 A UNIT 7 A Electrical Networks ———————————— 3 B Three-phase Circuits The Operational Amplifier ——————————— 5 Logical Variables and Flip-flop —————————— 8 Power Semiconductor Devices —————————— 11 Types of DC Motors —————————————15 AC Machines ———————————————19 Electric Power System ————————————22 B Transistors B Binary Number System B Power Electronic Converters B Closed-loop Control of DC Drivers B Induction Motor Drive B Power System Automation PART 2 Control Theory UNIT 1 A B UNIT 2 A UNIT 3 A UNIT 4 A The World of Control ————————————27 Stability and the Time Response ————————— 30 The Root Locus ————————————— 32 The Transfer Function and the Laplace Transformation —————29 B Steady State————————————————— 31 B The Frequency Response Methods: Nyquist Diagrams ————— 33 The Frequency Response Methods: Bode Piots ————— 34 B Nonlinear Control System 37 UNIT 5 A Introduction to Modern Control Theory B B B PART 3 B B B State Equations Optimum Control Systems Artificial Neural Network Computer Control Technology 42 43 44 Fundamentals of Computer and Networks The Applications of Computers 46 40 38 UNIT 6 A Controllability, Observability, and Stability UNIT 7 A Conventional and Intelligent Control UNIT 1 A Computer Structure and Function UNIT 2 A Interfaces to External Signals and Devices UNIT 3 A PLC Overview PACs for Industrial Control, the Future of Control 1 UNIT 4 A Fundamentals of Single-chip Microcomputer 49 B B PART 4 B B B B PART 5 B B B B PART 6 Understanding DSP and Its Uses Embedded Systems Design Process Control 50 52 53 Fundamentals of Process Control UNIT 5 A A First Look at Embedded Systems UNIT 1 A A Process Control System UNIT 2 A Sensors and Transmitters Final Control Elements and Controllers PID Controllers and Other Controllers Control Panels Control Based on Network and Information Evolution of Control System Architecture Stability of NCSs with Network-induced Delay Virtual Manufacturing—A Growing Trend in Automation Enterprise Resources Planning and Beyond Synthetic Applications of Automatic Technology UNIT 3 A P Controllers and PI Controllers UNIT 4 A Indicating Instruments UNIT 1 A Automation Networking Application Areas UNIT 2 A Fundamental Issues in Networked Control Systems UNIT 3 A Fundamentals of the Database System UNIT 4 A Concepts of Computer Integrated Manufacturing UNIT 1 A Recent Advances and Future Trends in Electrical Machine Drivers B B B System Evolution in Intelligent Buildings A General Introduction to Pattern Recognition Electric Vehicles UNIT 2 A Industrial Robot UNIT 3 A Renewable Energy 2 UNIT 1 A

电路 电路或电网络由以某种方式连接的电阻器，电感器和电容器等元件组成。如果网络不包含能源，如电池或发电机，那么就被称作无源网络。换句话说，如果存在一个或多个能源，那么组合的结果为有源网络。在研究电网络的特性时，我们感兴趣的是确定电路中的电压和电流。因为网络由无源电路元件组成，所以必须首先定义这些元件的电特性。就电阻来说，电压-电流的关系由欧姆定律给出，欧姆定律指出：电阻两端的电压等于电阻上流过的电流乘以电阻值。在数学上表达为： u=iR (1-1A-1)式中 u=电压，伏特；i =电流，安培；R =电阻，欧姆。纯电感电压由法拉第定律定义，法拉第定律指出：电感两端的电压正比于流过电感的电流随时间的变化率。因此可得到：U=Ldi/dt 式中 di/dt =电流变化率，安培/秒； L =感应系数，享利。电容两端建立的电压正比于电容两极板上积累的电荷 q 。因为电荷的积累可表示为电荷增量 dq 的和或积分，因此得到的等式为 u=，式中电容量 C 是与电压和电荷相关的比例常数。由定义可知，电流等于电荷随时间的变化率，可表示为 i = dq/dt。因此电荷增量 dq 等于电流乘以相应的时间增量，或 dq = i dt，那么等式(1-1A-3)可写为式中 C =电容量，法拉。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

非专业，不在行，求高手帮忙。谢谢！具有顶部及底部侧电连接的晶片级集成电路封装导线架结构及其构成的表面黏着型半导体封装结构多层印刷电路板反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元串联用电式信号处理电路及电子装置发光二极管的封装结构及其封装方法电子封装结构高速光电组件及其芯片倒装结构双压电体并排推动的三摩擦力步进器与扫描探针显微镜发光二极管及其制作方法、发光二极管的底座的制作方法三或四压电体并行推进的步进器及其扫描探针显微镜镜体硅衬底及其制造方法半导体装置与分压电路具多晶硅层及微晶硅层的双底材主动层结构、方法及装置硅晶片的受控边缘厚度一种半导体横向器件和高压器件具有垂直沟道晶体管的半导体器件一种记忆体阵列及其用于制造一记忆体阵列的方法只读内存单元阵列结构有源矩阵基板和显示装置高耐压半导体集成电路装置、电介质分离型半导体装置图像感测装置透镜模块及其制造方法固态成像装置和照相机用于沟道隔离的斜角注入有机电致发光显示装置有机发光显示装置双极晶体管的表面钝化结构双触发型可控硅整流器异质结场效应晶体管金属氧化物半导体晶体管自对准沟槽累加模式场效应晶体管结构薄膜晶体管及显示器件薄膜晶体管无铅二极管低频、低噪音、低闪烁的二极管用于薄膜太阳电池的陷光结构透明遮阳太阳能电池片四元半导体的异质结热光伏电池硅基纳米柱阵列异质结薄膜太阳能电池氮化镓太阳能同位素复合型微电池光学传感器半导体受光元件成像探测器透明导电氧化物涂层硅基高效双结太阳能电池薄膜太阳能电池异形LED器件

In this paper, the duplex solder joints geometry of flip chip is simulated by Surface Evolver program.

摘 要：本文采用 Surface Evolver 软件对倒装焊复合焊点的几何形态进行了模拟。

in the paper, solder joint shape is predicted through inputting data files to surface evolver software. then the flip-chip solder joints shape can be formed by the software.

本文通过用于焊点形态预测软件surface evolver的输入数据文件，得到倒装焊焊点形态。

When electromigration is combined with thermomigration in flip chip solder joints, fast failure due to large void formation at the cathode and the hot end occurs.

所以我们不可以忽略热迁移的效用。

In the days of sailing vessels the crew were afraid they would be becalmed on the ocean.

在使用帆船的时代，船员们担心他们会因为无风而无法在海洋上航行。

As long as foreign donors pay the PA's salary bill, few expect a new intifada.

只要外国继续为巴权力机构的薪水买单，希望发动新暴动的人便寥寥无几。