查询词典 flip chip

in the paper, solder joint shape is predicted through inputting data files to surface evolver software. then the flip-chip solder joints shape can be formed by the software.

本文通过用于焊点形态预测软件surface evolver的输入数据文件，得到倒装焊焊点形态。

When electromigration is combined with thermomigration in flip chip solder joints, fast failure due to large void formation at the cathode and the hot end occurs.

所以我们不可以忽略热迁移的效用。

In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip -solderng.

文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。

For the co-axial flip chip package, we cover a metal lid in the crystal and add a heat sink with basis of 2500 x2500 x1500 . Analysis shows that the package has the optimal heat transfer at the fin's altitude, thickness and spacing of 500, 100 and 166 , respectively, associated with 5 m/s force convection in the test entrance.

在同轴式覆晶外部设计封装上，在金属盖上加上一基底为2500 x2500 x1500 ，鳍片高度、厚度及间距分别为500、100 及166 的热沈；并於测试入口处加入一 5 m/s 的强制对流时，此时封装体拥有最佳的散热效果。

The novel flip chip bonding is developed and proved effectiveness. Thedrain saturation current is increased 10% after bonding.

提出了改进的倒装焊方法来降低热阻，并设计制作了倒装焊器件。

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

It has been found that flip chip without and with underfill encapsulation has different corrosion modes. Possible failure mechanism was presented.

实验发现，倒装芯片封装在使用和不使用下部填充料的情况下具有完全不同的铝腐蚀模式，并阐述了可能的腐蚀机理。

They have been demonstrated to be used in analysis of most failures in flip chip assembly as follows: 1 We firstly reported the IRM inspection of underfill delamination and crack.

主要结果为： 1首次利用红外显微镜测出了倒装芯片中的下部填充料裂缝和分层的位置，以及分层中空气间隙的大小。

The thermal fatigue life of SnPb joints in Flip Chip lies on underfill mechanical properties and delamenation.

热应力重分配的决定性因素为底充胶杨氏模量，热膨胀系数的影响相对较小。

The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.

该系统可以处理直径多达200毫米的晶片，包括模具的倒装。

On the other hand, the more important thing is because the urban housing is a kind of heterogeneity products.

另一方面，更重要的是由于城市住房是一种异质性产品。

Climate histogram is the fall that collects place measure calm value, cent serves as cross axle for a few equal interval, the area that the frequency that the value appears according to place is accumulated and becomes will be determined inside each interval, discharge the graph that rise with post, also be called histogram.

气候直方图是将所收集的降水量测定值，分为几个相等的区间作为横轴，并将各区间内所测定值依所出现的次数累积而成的面积，用柱子排起来的图形，也叫做柱状图。