查询词典 flip chip

We used ChIP-seq to map STAT1 targets in interferon-gamma-stimulated and unstimulated human HeLa S3 cells, and compared the method's performance to ChIP-PCR and to ChIP-chip for four chromosomes.

我们用 ChIP-seq来map STAT1目标，-处理和未处理的人类HeLa S3细胞，并对4条染色体进行了ChIP-PCR和ChIP-chip方法的表现的比较。

The embedded information safety platform features the CPU micro controller as one network processing chip with ARM940T kernel containing real-time embedded operation system; enciphering and deciphering hardware chip comprising IPSec algorithm chip and symmetric algorithm chip; I/O interface including two 10/100 M adaptive Ethernet interfaces, one USB main control interface and one serial interface.

本发明涉及一种嵌入式信息安全平台，特点是，CPU微控制器为一个网络处理芯片，片内处理器为ARM940T核，嵌入式实时操作系统置于该核内；加解密硬件芯片由IPSec算法芯片、对称算法芯片组成；输入输出接口包括2个10/100M自适应以太网接口、USB主控接口，串口接口。

These provide feasible forecasting method for the formation and breaking of C type chip in side-curling form and provide a theoretical basis for"The Process of Chip-breaking and Expert System of Groove CAD" For the first time, the mathematical model of judging whether the side-curling short spiral chip break is set up and the criterion for the chip-breaking is posed by means of dynamics principle and elasticity theory.

所建立的横向卷曲C形屑与短螺卷屑数学模型、折断判据和断屑界限判据，根据大量试验及在开发的&切屑折断过程与槽型CAD专家系统&上应用证明：是可靠的、符合实际的。

A telephone remote control and alarm device, which belongs to field of intelligent appliance and family security system, which is characterized in that data is accessed to a management chip to realize ring detection and automatic pick-up hang-up, the telephone line is connected with a dual-tone receiving-transmitting chip, a sound chip and a single-chip.

一种电话远程控制和报警装置，属于智能家电和家庭安防系统领域，其特征在于，数据接入管理芯片实现振铃检测，自动摘挂机，并将电话线路与双音频收发芯片、语音芯片以及单片机连通。

Bumps growth on alumina substrate side and gallium arsenide chip side were processed and discussed as well as the flip-chip bonding process.

本实验尝试以不同尺寸大小的共平面波导传输线，配合凸块位置的分布，研究其在高频下的S参数表现。

A coplanar transmission line structure on GaAs chip were mounted on a RO3210 substrate using flip chip Au-to-Au thermal compression method.

设计在 GaAs 晶片上的CPW 传输线成功地以热压法与 RO3210 基板做覆晶结合。

The joining material may be a solder paste, the substrate may be a semiconductor chip substrate, a computer chip. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

连接材料可以是焊剂糊料，基片可以是半导体芯片基片，计算机芯片，本方法可用于制造倒装式芯片、球粒格网阵列式模块、柱形件格网阵列式模块、电路板、以及包括信息管理系统的上述元件的附着结构。

And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性。

Capillary phenomena was studied and discussed by the scholars about 200 years ago, but the progress was slow due to the limited equipments and manufacture precision of the microchannel.In recent years, because of the rapid development of MEMS and micromachining, many applications of the capillary flow is widely developing in some modern processes, such as underfilling of flip chip, flow in microfluidic chip or biochip, and a variety of other fields.

摘要 毛细现象大约在200年前便断断续续被欧美学者所研究讨论，但由於当时微细加工受到仪器设备和制造精度的限制，因此发展极为缓慢；近年来由於微机电系统与微细加工之精进，许多具有微流道的应用设备，陆续被制作问世，加上光学显微镜与影像撷取设备的普遍，对於研究此课题的推展极有助益；且随著微生医、覆晶底胶充填与微流体系统等领域之受到重视，毛细现象导致的充填问题、驱动原理及液体流动的控制，都变得相当的重要；本研究基於如此的动机与目的，进行微流道内液体之毛细流动现象及时间的探讨。

On the basis of the summarization of MCM-Cs main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging, hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.

论文在综述MCM-C的主要特点及其组装封装技术的基础上，重点对金丝球引线键合、IC芯片金球凸点制作、IC芯片倒装焊与下填充等实用先进MCM-C组装工艺技术和LTCC基板与外壳及PGA引线的一体化封装、气密性金属封装等高可靠MCM-C封装工艺技术以及MCM-C组装封装基本工艺流程展开了较深入的研究，有效完成了高密度单片机系统MCM-C和高速数据采集控制系统MCM-C等两种高水平实际产品的工程化研制工作，扼要介绍了工程实践中MCM-C组装封装工艺常用的质量检验方法和可靠性试验方法。

Article 144 The Government of the Hong Kong Special Administrative Region shall maintain the policy previously practised in Hong Kong in respect of subventions for non-governmental organizations in fields such as education, medicine and health, culture, art, recreation, sports, social welfare and social

第一百四十四条香港特别行政区政府保持原在香港实行的对教育、医疗卫生、文化、艺术、康乐、体育、社会福利、社会工作等方面的民间团体机构的资助政策。原在香港各资助机构任职的人员均可根据原有制度继续受聘。

Small wonder, then, that the Chinese spend more in the shop than any other group of foreign visitors do .

这样的小惊喜，使中国顾客比任何国家的人消费得更多。