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flip chip相关的网络例句

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与 flip chip 相关的网络例句 [注:此内容来源于网络,仅供参考]

The future development trend is except high-end DTVs with more than 37 inches in size, the other sizes of TV will all adopt highly integrated single chip design, which integrates signal demodulator chip, video-control chip, MPEG-2 decode chip, video processing chip, HDMI interface chip and audio frequency processing chip into a single chip, namely SoC.

而未来的发展趋势是除高级的超过37英寸的数字电视外,其余尺寸的电视都会采用高度集成的单芯片设计,信号解调芯片、视频控制芯片、MPEG-2解码芯片、视频处理芯片、HDMI接口芯片和音频处理都会集成在一片芯片上。

Currently, digital TV mainly has about seven chips, like Signal demodulator chip, video-control chip, MPEG-2 decode chip, video processing chip, HDMI interface chip, audio frequency treatment chip and audio frequency amplification chip.

目前数字电视里主要芯片有信号解调芯片、视频控制芯片、MPEG-2解码芯片、视频处理芯片、HDMI接口芯片、音频处理与音频放大芯片,也就是大约7片IC。

The technical advantage of NOY company is in civil yarn chip; that of Aquafil is in bulk carpet filament chip; that of Zimmer is in tyre cord yarn chip; while that of PE is in the capability of producing middle and high viscosity of PA-6 chips simultaneously, and in the world advanced chip for membrane; and that of Invent-Fischer is in the capability of producing both high quality PA-6 civil chip, and high viscosity of PA-6 chip through the solid condensation polymerization process in series.

NOY、Aquafil、Zimmer公司的技术优势分别在民用丝用PA-6切片、膨体地毯丝用PA-6切片以及轮胎帘子线用PA-6切片上;PE公司的技术优势主要是可同时生产中、高黏度PA-6切片,且在生产膜用PA-6切片上世界领先;Invent-Fischer公司技术优势在于既可生产高质量的民用丝级PA-6切片,又可通过串联固相后缩聚工序生产高黏度PA-6切片。

Encapsulant was driven by capillary force into the space between the chip and substrate. Underfill technique can protect the electrical device and prevent the device from destroying because of external force. Underfill has many defects including the fill time is too long, the situation of short shot and air trap are caused easily, the yield of product of Flip-Chip is not highest and the products are universal. Therefore, there are many factors being studied in this paper to sum up the influence of underfill of Flip-Chip process cause by model parameters.

覆晶接合技术为先进电子讯号连接技术中的一种,具有高I/O数、电子讯号路径短以及尺寸小等优点,而采用覆晶接合之电子元件大部分均以底部充填技术进行封装;底部充填是一种以毛细作用为驱动力在晶片与基板之间的间隙充填底胶的封装技术,可以确保晶片不受到外力的影响而损及封装体,但此技术具有充填时间长、容易产生短射与包风等缺点,使得覆晶封装制程良率不高,间接影响覆晶封装产品的普及率,因此本文将依各种可能之参数模型对覆晶封装底部充填制程的影响,以供业界参考。

In this paper, the bump patterns for flip-chip packages are discussed first, then an experiment is setup to study the dispensing phenomena for different bump patterns, and the CAE software is used to analyze and identify with experiment mutually. From these thorough comparisons and analytical analysis, the existence of channel could slow down the flow, the high density of bump could speed up the flow, and it could avoid the air trap by modified the bump and channel's arrangement on flip-chip package. Then flows in rectangular microchannels driven by capillary force and gravity are discussed; furthermore, the theoretical model of flow in microchannel driven by capillary force and gravity is formulated from the Navier-Stokes equations.

本文首先针对覆晶底部充填进行相关理论推导、实验与模拟,探讨不同凸块配置模型所造成的波前不平滑现象对底部充填流动的影响;即依据相关参数建立模型进行底部充填实验,同时以CAE(Computer-Aided Engineering)模流分析软体进行模拟,在完成理论探讨、实验与模拟分析之后,交叉比较理论、实验与模拟分析结果,归纳出影响底胶充填流动之因素,由结果显示在凸块密集度较高的区域,凸块可以帮助流动,但是在凸块区后方的沟槽区域则因为凸块区所提供之流量不足,所以会造成波前落后的现象,另外藉由修改凸块与沟槽配置的关系,可以有效的控制波前形状的变化情形,避免产生包风现象。

Host controller and multiple-site controller using asynchronous serial communication, or "soft-serial" in accordance with the "communication protocols" to achieve branch communications, computer controlled multi-component of "Distributed Control" system, according to three Flop flip side of the control sub-drive motor, to achieve large-scale three sides of the sign face will be over the screen, time, optional flip way, the sign face of an error "automatic error correction flip" and drive the requirements.

主控制器和多个现场控制器之间采用异步串口通信或"软串口"按照"通信协议"实现分支通信,组成多微机联控的"集散式控制"系统。这种多微机联控系统极大地简化了控制电路的连线,简化了电气控制安装工艺与施工,在降低工程费用和后期维修费用的同时,可大幅提高控制系统工程的可靠性、稳定性、性价比。

On the leading edge of the next clock pulse, the contents of the first flip-flop is stored in the second flip-flop, and the signal which is present at the DATA input is stored in the first flip-flop, etc.

在下一个时钟脉冲的前沿,第一个触发器的内容被存放到第二个触发器中,而在数据输入端的信号则存放在第一个触发器中,依此类推。

We designed four chips for different functions, fundamental separation fixed quantity chip, parallel separation fixed quantity chip, series separation fixed quantity chip, and combinative separation fixed quantity chip.

由此理论公式吾人设计了四种具不同功能功能性定量流体碟片,包括流体分流定量碟片、平行定量碟片、依序定量碟片、二次样品纯化定量碟片,经实验后其定量功能符合吾人所需功能。

Three different populations of diploid potato were employed to study chip color in this experiment. Seven different processing traits among the three populations were analyzed. According to a certain program of chip processing, all genotypes in three populations were evaluated strictly on their chip colors. The molecular markers of chip color genes were studied with the method of Bulked Segregant Analysis.

本研究选用了3个不同组合的二倍体马铃薯炸片群体材料,在群体间对7个不同的加工性状进行了比较分析,按照一定的炸片加工程序对3个群体所有单株进行了炸片颜色鉴定,并采用混合分组分析方法进行了马铃薯炸片颜色基因的RAPD标记。

The experimental group corneas were preserved by organ culture for 4 weeks, the corneal thickness was measured with ultrasonic corneal pachymeter. Then every corneas were divided into half -chip, there are 48 half-chip total. It was divided into 4 groups, there are 12 half-chip in every groups. The corneal endothelial cell density of 12 half-chip were counted through Alizarin Red-Trypan blue staining; 12 half-clip corneas were fixed with 4% neutral formalin solution, HE staining was performed, the expression of AQP-1 in corneal stroma and corneal endothelial cell were detected through immunohistochemical staining; Na~+-K~+-ATPase activities in 12 half-clip corneas were examined with Na~+-K~+-ATPase kit; the expression of AQP-1 mRNA were detected through real-time fluorescent quantitation PCR.

实验组经器官培养保存4周后以角膜测厚仪测量角膜厚度,然后每个角膜被分成两半,共48个半片角膜,再分成4组,每组12个半片。12个半片用茜素红-台盼蓝染色染色行角膜内皮细胞计数;12个半片角膜用4%中性福尔马林溶液固定行HE染色、应用免疫组化染色检测AQP-1在角膜基质和内皮细胞表达的改变;12个半片角膜用Na~+-K~+-ATP酶试剂盒测量角膜内皮细胞Na~+-K~+-ATP酶活性;12个半片角膜用实时荧光定量PCR检测AQP-1mRNA表达改变。

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