查询词典 encapsulation

In this system, the business layer is a combo of single-example mode and IoC mode, so the compiled language for the common deputize and the encapsulation of the business logic interface have been realized.

在业务层则是采用单例模式设计与Spring的IoC模式相结合，实现了公共代理类的编写，各业务逻辑接口的封装。

With the electrical connections at the top and bottom side of the wafer-level IC packaging Lead-frame structure and composition of the surface-mount semiconductor package structure Multi-layer printed circuit board Antifuse and its formation method and with the anti-fuse non-volatile memory device unit cell Tandem electric signal processing circuit and electronic device Light-emitting diode packaging structure and encapsulation method Electronic Packaging Structure Flip-chip high-speed optoelectronic components and structure Pairs of piezoelectric friction side by side to promote the three-step device and scanning probe microscope Light-emitting diode and its manufacturing method, the production base of light-emitting diode method Three or four parallel advance of stepping piezoelectric device and scanning probe microscope lens body Silicon substrate and its manufacturing method Semiconductor device and voltage-divider A polysilicon layer and the microcrystalline silicon layer of the double-substrate active layer structure, methods and devices The edge of the thickness of silicon controlled Of a lateral semiconductor devices and high-voltage devices With a vertical-channel transistors semiconductor device Of a memory array and for the manufacture of a memory array method Read-only memory cell array structure Active-matrix substrate and display device High-voltage semiconductor integrated circuit devices, dielectric isolated type semiconductor device Image sensing devices Lens module and its manufacturing methods Solid-state imaging device and camera Injection angle for the trench isolation Organic Light-Emitting Display Device Organic light-emitting display device Bipolar transistor structure of the surface passivation Double-triggered silicon-controlled rectifier HFET Metal-oxide semiconductor transistors Self-aligned trench accumulation mode field effect transistor structure Thin-film transistors and Display Devices TFT Lead Diode Low-frequency, low noise, low-flashing diode Used for thin-film solar cells trap light structure Transparent sun solar cells Quaternary semiconductor heterojunction photovoltaic cells heat Si nano-pillar array heterojunction thin-film solar cells GaN-based micro-composite solar cells isotope Optical sensor Semiconductor by optical components Imaging Detector Transparent conductive oxide coating Silicon-based high-performance dual-junction solar cells Thin-film solar cells Alien LED Devices

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AZT-GalCer was prepared by double emulsion and its encapsulation ratio were up to 72.5%.

采用两次乳化法制备了AZT-GalCer，其包封率达72.5％。

Objective: To evaluate the in vitro release behavior of doxorubicin-loaded microspheres and the stability of Dox during encapsulation process and in vitro release.

目的：考察多柔比星微球的体外释放特性及药物在制备工艺和体外释放过程中的稳定性。

Variability of encapsulation efficiency of DOX and VER was small over 14 days, and particle sizes of DARSLs were slightly increased.

该制剂在血浆介质中的体外泄漏试验结果表明同时包载的维拉帕米可能会影响脂质体稳定性。

Results: The prepared AmB-PBCA nanoparticle had a regular spherical or elliptic surface, with a mean diameter of (69.01±28.56) nm. The curve of standard AmB was linear within the range of 1.12-5.60μg/ml: D405=0.1634c+0.0066 (r=0.9993). The average recovery of AmB-PBCA-NP was 99.93%, showing the solution of AmB-PBCA-NP was stable within 12 h. The nanoparticles showed a sustained drug release in vitro within 24 h. The optimized recipe was: DextranT-70 stabilizer without sodium deoxycholate, with a mean encapsulation rate of 56.10% and a drug loading rate of 82%.

结果：制备的AmB-PBCA-NP外观呈圆或类圆形，平均粒径(69.01±28.56)nm，分散均匀；AmB标准品在1.12~5.60μg/ml范围内的线性回归方程为：D405=0.1634c+0.0066，r=0.9993，AmB-PBCA-NP的平均回收率为99.93%，其溶液在12h内稳定性较好；体外释放实验表明24h体外释放具有一定的缓释性；实验发现最优化的处方为稳定剂采用DextranT-70，且不加助溶剂脱氧胆酸钠，其包封率及载药量均比较高，分别为56.10%、82%。

Encapsulation is very important to the sales of production.

包装对产品的销路有很大关系。

This is true information encapsulation, and ensures that the object can be used as a software component.

这是真正的信息封装，保证了对象能被当作软件组件来使用。

A thread is an encapsulation of the flow of control in a program.

线程是程序中的控制流程的封装。

This is done trough the process of encapsulation.

这是通过打包来完成的。

In the United States, chronic alcoholism and hepatitis C are the most common ones.

在美国，慢性酒精中毒，肝炎是最常见的。

If you have any questions, you can contact me anytime.

如果有任何问题，你可以随时联系我。