查询词典 encapsulation

The material for the encapsulation of the chip is anodic bonding of silicon and glass.

芯片的封装采用硅和玻璃的阳极键合而成。

Product characteristics : 1, excellent heat resistance : can adapt to the use of power lines due process overload and short circuit of the high temperature; 2, excellent electrical properties : material for the performance of their higher intensity and volume resistivity of insulation, security is good; 3. excellent corrosion resistance and anti-aging properties : apply to the soil and working environment, long life; 4. excellent flame retardance : difficult combustion; 5, smooth wall formation, the friction coefficient, good wear resistance : in the installation process can greatly reduce the damage to power lines, improve work efficiency; with the traditional asbestos cement pipes, the The product is light weight, good flexibility, earthquake-resistant and differential settlement, and not at the construction site encapsulation pouring concrete; Transport construction is simple, low cost, can greatly shorten the construction period.

产品特点： 1、优良的耐热性能：能适应电力电缆使用过程因过载短路而产生的高温； 2、优良的电气性能：材料自身表现为较高绝缘强度和体积电阻率，安全性好； 3、优异的耐腐蚀性能和抗老化性能：适用于各种土壤和工作环境，使用寿命长； 4、优良的阻燃性能：不易燃烧； 5、内壁光滑平整、摩擦系数小，耐磨性能好：在敷设过程中可大大降低对电缆的损害，提高工作效率；与传统的石棉水泥管相比，产品的重量轻、柔性好、抗震性及抗不均匀沉降好，无须在施工现场包封浇混凝土；运输施工简便，费用低，可大大缩短工期。

This paper presents a method of NAT port switch. For fast mode, negotiation of packets encapsulation methods is used by increasing field in SA payload. In the process of negotiation of encapsulation method, this paper solve the problem of updating the upper check sum through the use of NAT-OA data packets.

对于快速模式的修改，通过在SA载荷中增加字段的方法来进行数据包封装方式的协商；在封装方式协商的过程中，通过使用NAT-OA数据包，使得通信双方即使经过了NAT转换，依然可以进行正确的校验，解决了NAT无法更新上层校验和的问题。

Encapsulation and de-encapsulation are two example of this.

打包和拆包是两个例子。

Organic light-emiting devices are extremely sensitive to vapor and oxygen. The influence of inleakage of oxygen and vapor on OLED's lifetime was serious. Thus, encapsulation is very important to an OLED device. Research status of encapsulation technology of OLED on different substrate and cover.

有机电致发光二极管对水汽和氧气非常敏感，渗入发光二极管器件内部的水汽和氧气会对器件寿命产生严重的影响，因此OLED的封装是制造OLED的关键技术之一。

The second experiment is to fabricate white light LED from red and green phosphors pumped by blue light LED. The blue light LED we used in our experiment has the wavelength range between 450 and 452.5 nm, and the chip size is 17 mil *14 mil. There are two kinds white light LED we fabricated in the experiment. There are three blue light LED chips bonded in single package of both kinds package. The different of the both packages is mixed phosphor of encapsulation. One of the experimental devices was encapsulated YAG phosphor mixed silicone to fabricate white light. The other is red and green phosphor mixed encapsulation. The compared and focused parameter was luminous efficiency. YAG phosphor pumped white light has the luminous efficiency 72 lm/W, CRI 70, CIE(0.32, 0.33), CCT 5622°K at the operating current 60mA. On another hand, red and green phosphor pumped white light LED has the luminous efficiency 55 lm/W, CRI 90, CIE(0.31, 0.32), CCT 6479°K at the operating current 60mA. We fabricated the red and green phosphor pumped white light LED, and proved that it could has much higher CRI under similar compared conditions, CIE xy and CCT.

第二个实验是使用蓝光LED晶粒来制作白光元件，蓝光LED晶粒波段范围在450 ~ 452.5 nm，晶粒大小为17*14 mil，以三颗蓝光LED晶粒搭配YAG萤光粉(黄绿光 540 nm)制成白光元件，再以另外三颗蓝光LED晶粒搭配红色萤光粉(613 nm)混合绿色萤光粉(519 nm)制成的白光元件进行发光效率比较；搭配YAG萤光粉的白光元件在注入60 mA的电流时所量测到最大的发光效率是在72 lm/W，演色性数值大约为70，CIE色度座标为(0.32， 0.33)，色温是在5622 °K；而搭配红色萤光粉混合绿色萤光粉的白光元件在注入60 mA的电流时，最大的发光效率在55 lm/W，演色性数值大约为90，CIE色度座标为(0.31， 0.32)，色温在6479 °K；证明了蓝光LED晶粒搭配红色萤光粉混合绿色萤光的白光元件演色性指数可以高达90 以上的结果。

Resemble such an encapsulation of can, the now available tubbing technology and equipment can only apply to small can package , do not apply to the encapsulation strengthening an alkali waiting for the large-scale product metal barrel.

象罐头这样的封装，现有制桶技术和设备只能适用小罐头包装，不适用于固碱等产品的大型金属桶的封装。

The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation., and formed the integrated circuit that pending programmed.

该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。

Our company is a Taiwan-funded enterprise engaged in encapsulation and test of semiconductor,whose main encapsulation forms include PSOP TSOP MSOP SOT SOD TO DIP DAK,etc.

帖主对此回复很满意，所以奖励 3 积分给溟生我们公司是一家从事半导体封装与测试的台资企业，其主要的封装形式有PSOP TSOP MSOP SOT SOD TO DIP DAK 等。

Our company is a Taiwan-funded enterprise engaged in encapsulation and test of semiconductor,whose main encapsulation forms include PSOP TSOP MSOP SOT SOD TO DIP DAK,etc.

帖主对此回复很满意，所以奖励 1 积分给冷~~~我们公司是一家从事半导体封装与测试的台资企业，其主要的封装形式有PSOP TSOP MSOP SOT SOD TO DIP DAK 等。

In the United States, chronic alcoholism and hepatitis C are the most common ones.

在美国，慢性酒精中毒，肝炎是最常见的。

If you have any questions, you can contact me anytime.

如果有任何问题，你可以随时联系我。