查询词典 electroformed

In traditional, the working probe naturally sustaining repeated bending actions and wear, absolutely needs a mechanism to prevent it from being damaged, caused by the change of the probe's geometry and the increase of the contact resistance. Therefore, in this study, we develop a CMOS-based chip in connection with the electroformed probes to detect each of their counterforce, contact resistance to evaluate if their contact force and coplanarity are controlled within safe range.

传统上，探针常因为弯曲作动和磨耗，使几何形状产生改变，进而电阻值提升，使过大的电流通过探针而烧毁，或因共面度不佳部分探针未能确实接触IC焊垫误判成断路，故晶片的制作重点在於监测探针卡上个别探针的回馈力量，当探针量测IC时，可进行即时探针反作用力、接触电阻的检测，进而了解探针卡工作时受力是否均匀、平坦度是否符合要求等性质。

The effects of electroforming process parameters on manganese contents in the electroformed layers were studied.

结果表明，电铸层中的锰含量随电流密度的增大而增加，随脉间的增大而减小。

Though electroformed molds are very precise, electroforming time is long.

电铸模具有极高的复制精度，但电铸模具周期长，影响电铸层质量的因素多。

Electroformed apertures reproduce the mandrel photo resist finish faithfully and do not require any further processing.

电铸复制卷筒照片孔型图，不需要进一步的加工。

The thermal decomposition of electroformed PbO2 showed two types of hydration water: the first type was physical adsorption water adsorbed on the surface of PbO2 particles and could be removed at low temperature, the second was chemical structural water localized within the PbO2 crystal structure and could only be ...

电化学形成的PbO2的热分解表明PbO2中存在两种类型的结构水：一种是吸附在PbO2颗粒表面的物理吸附水，可在较低温度下消失；另一种是位于PbO2晶格内部的化学结构水，只能在较高温度下失去。

Because the size distributions are so narrow, only 3 electroformed sieves can be used for analysis.

因为粒度分布很窄，只有3个电铸筛可用于分析。

No research of the bonding between electroformed copings and ceramic has been reported at present.

目前尚未见到金沉积与瓷之间结合强度的研究报道。

The features in an electroformed stencil are formed in one process so aperture count does not affect costs so dramatically.

电铸钢网的特性是一次形成的，因孔数对成本的影响不是那么大。

The purpose of this study was to evaluate the shear bond strength between porcelain and electroformed copings after different surface treatments, with comparison of Ni-Cr alloys, to explore the bonding mechanism through observing the electroformed coping surface and interface of metal-ceramic by SEM and EDS analysis. It will provide the basis for clinical application. PartⅠEffects of different surface treatments on bond strength of porcelain fused to eleetroformed copings Materials and Methods: Forty-five cylindrical Ni-Cr alloys were made, and gold copings were deposited on them and divided into 5 groups randomly.

本实验拟测量金沉积基底几种不同表面处理后的金瓷剪切强度，并与Ni-Cr合金进行比较；通过对不同表面处理后的金沉积基底、金瓷界面进行扫描电镜观察和能谱分析，探讨不同表面处理对金沉积金瓷结合的影响，为金沉积烤瓷修复体的临床应用提供参考依据。

PartⅡEffects of different surface treatments on microstructure of porcelain fused to electroformed copings and metal-ceramic interface Materials and Methods: Five electroformed copings were made in the size of 5 mm×5 mm, different surface treatments were taken respectively, including no treatment, 50μm Al_2O_3 sand blasting, 110μm Al_2O_3 sand blasting, preoxidation after 110μm Al_2O_3 sand blasting, gold bonder applying after 50μm Al_2O_3 sand blasting. Another two metal-ceramic specimens by electroforming were made in the size of 20 mm×5 mm.

第二部分不同表面处理对金沉积基底及金瓷界面显微结构的影响材料和方法：制作5mm×5mm大小的金沉积片5个，分别经以下处理：表面未处理，表面50μm、110μm Al_2O_3喷砂，110μm Al_2O_3喷砂+预氧化，110μm Al_2O_3喷砂+金黏结剂；另外制作金沉积烤瓷试件2个，扫描电镜下观察金沉积基底层和金瓷界面形貌，能谱仪进行元素扫描分析。

The split between the two groups can hardly be papered over.

这两个团体间的分歧难以掩饰。

This approach not only encourages a greater number of responses, but minimizes the likelihood of stale groupthink.

这种做法不仅鼓励了更多的反应，而且减少跟风的可能性。