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dielectric coefficient相关的网络例句

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The theory about dielectric bolometer mode of BST was introduced, and the equation about pyroelectric coefficient of BST under dielectric bolometer mode was deduced, according to which computer-aided system for measuring BST ceramics'pyroelectric coefficient was manufacture.

本文介绍了关于BST介电探测模式的相关理论,在此基础上得出介电热辐射模式下的热释电系数公式,并依此原理,研制了测量BST热释电系数的计算机测试系统。

Glass ceramics with α cordierite(2MgO·2Al 2O 3·5SiO 2) as main crystal phase, having excellent dielectric property, are perfect materials for microwave parts of a medium apparatus However, the thermal expansion coefficient of the material is not high enough for some special applications Now, a novel glass ceramics with suitable thermal expansion coefficient (47 7×10 -7 / C) and excellent dielectric property (ε=5 1,tgδ0 -3 ) was developed Crystallization process and the th...

本文以堇青石微晶玻璃为研究对象,首次研制得到了一种低介(ε= 51)、低损耗(tgδ<10- 3)、热膨胀系数(46 ~48 ×10- 7' C)能与其它器件相匹配的新型微晶玻璃介质材料通过 X射线衍射分析,扫描电镜观察等测试手段,研究了该材料的晶化过程和热膨胀系数的变化规律发现样品的热膨胀系数随温度的变化行为是与样品中析出的晶相种类及析出量随温度的变化规律相对应的

The second and third structure movements of polymer involving slowpolarization effect is proposed by summing up a wide variety of experiment results, from Gibbsfunction, the parabola type relation between the reciprocal of slow dielectric coefficient andtemperature are obtained, which properly explains the β transition of polymer.

5归纳大量的实验结果,提出了聚合物的慢极化效应联系着二级和三级结构的运动;参照晶体中的软模理论,认为聚合物的β转变源自恢复力系数的软化;采用唯象理论,得出慢介电常数的倒数与温度T的抛物型关系,聚合物的β转变实验结果证明了理论的预言。

Good thermal stability and self-extinguishing behavior was observed with the cured polybenzoxazine resins. Second, furan-containing benzoxazine monomers, P-FBz, BPA-FBz, and 4FP-FBz were prepared using furfurylamine as a raw material. Formation of furfurylamine Mannich bridge networks in the polymerizations of P-FBz and BPA-FBz increased the cross-linking densities and thermal stability of the resulting polybenzoxazines. P-FBz and BPA-FBz- based polymers also exhibited high glass transition temperatures above 300℃, high char yields, and low flammability with a limited oxygen index value of 31. The dielectric (Dk3.21–3.39) and mechanical properties (high storage modulus of 3.0–3.9 GPa and low coefficient of thermal expansion of 37.7– 45.4 ppm) of the P-FBz and BPA-FBz-based polymers were superior or comparable to other polybenzoxazines. 4FP-FBz used for polybenzo- xazine modification by means of formation of benzoxazine hybridation with P-FBz.

第二部份以2-呋喃甲胺为起始物,制备了P-FBz、4FP-FBz与BPA-FBz 三个含呋喃官能基之氧代氮代苯并环己烷的单体;BPA-FBz与P-FBz於开环聚合中形成之Mannich bridge网状结构有效地提升聚氧代氮代苯并环己烷聚合物之交联密度与热安定性;Poly与Poly具有大於300℃之玻璃转移温度、高的焦炭生成率与具有31之极限氧指数(Limited oxygen index, LOI)的难燃性特质,Poly与Poly之介电常数(Dk=3.21~3.39)与机械性质[3.0~3.9 GPa的储存模数与37.7~45.4ppm之低热膨胀系数( Low coefficient of thermal expansion, Low CTE)]均较其他聚氧代氮代苯并环己烷为优;4FP-FBz具有低之介电常数(Dk=2.7),以其作为降低介电常数之反应型改质剂,与P-FBz混成,证实可有效地降低Poly的介电常数。

In the frequency domain, the transmission ratios of electromagnetic Gaussian pulses are computed and we analyzed the effect on defect mode properties of unmagnetized photonic crystals produced by its periodic constant, parameters of plasma and parameters of the defect layer, such as its dielectric coefficient, length and position.

从频域角度分析得到微分高斯脉冲的透射率,并讨论该光子晶体的缺陷层介电常数、厚度、位置、光子晶体的周期常数和等离子体参数对其缺陷模的影响。

Due to the charge process of dusty particles, the electric conductivity, dielectric coefficient and modulus decay of dusty plasma are larger than that of plasma.

结果表明:由于尘埃充电过程,尘埃等离子体电导率、介电常数以及衰减系数都比一般等离子体的大。

Also, we derive the formulation of electric conductivity, dielectric coefficient and modulus decay of dusty plasma by considering the collision process between charged particles and charge process of dusty particles.

利用玻尔兹曼动力学方程和尘埃等离子体的充电方程,考虑等离子体中带电粒子之间的碰撞和充电过程,推导出适合火箭喷焰环境的尘埃等离子体电导率、介电常数以及衰减系数。

The film possesses the features of high thermodynamic stability, higher dielectric coefficient and low leakage current.

该薄膜具有高的热力学稳定性,并有较高介电系数和低漏电流。

The results show that glass ceramics with thermal expansion coefficient of 5.11×10^(-6)℃, major phase of α-cordierite and ε=5.5, tan σ=2.1×10^(-4) can be prepared by the addition of 3.6% alkalis (Li2O+Na2O), and Li2O occupies 1.8%. With Li2O substitution for Na2O, spontaneous crystallization is obviously enhanced, and temperature of the first crystallization peak decreases from 950℃ to nearly 900℃, but the crystallization temperature of the second peak was not varied. With the increase of Li2O content, mixed alkali effect can be observed from the thermal expansion coefficient and dielectric loss curve which decreases first and then increases. Dielectric constant decreases monotonously with the increase of Li2O content.

研究结果表明:Li2O和Na2O总含量为3.6%,其中Li2O含量为1.8%时,微晶玻璃以α-堇青石为主晶相,热膨胀系数为5.11×10^(-6)℃,微波频率下介电常数ε为5.5,介电损耗tanσ为2.1×10^(-4);随着Li对Na的取代,玻璃的析晶能力增强,初始析晶峰温度从950℃降至900℃左右,但没有降低第二析晶峰温度;随着Li2O含量增加,热膨胀系数及介电损耗都出现明显的混合碱效应,曲线呈现先降低后升高的变化趋势;样品的介电常数随Li2O含量增加单调降低。

The results show that glass ceramics with thermal expansion coefficient of 5.11×106 ℃, major phase of α-cordierite and εr=5.5, tan σ=2.1×104 can be prepared by the addition of 3.6% alkalis(Li2O+Na2O), and Li2O occupies 1.8%. With Li2O substitution for Na2O, spontaneous crystallization is obviously enhanced, and temperature of the first crystallization peak decreases from 950 ℃ to nearly 900 ℃, but the crystallization temperature of the second peak was not varied. With the increase of Li2O content, mixed alkali effect can be observed from the thermal expansion coefficient and dielectric loss curve which decreases first and then increases. Dielectric constant decreases monotonously with the increase of Li2O content.

研究结果表明:Li2O和Na2O总含量为3.6%,其中Li2O含量为1.8%时,微晶玻璃以α-堇青石为主晶相,热膨胀系数为5.11×106 ℃,微波频率下介电常数ε r为5.5,介电损耗tan σ为2.1×104;随着Li+对Na+的取代,玻璃的析晶能力增强,初始析晶峰温度从950 ℃降至900 ℃左右,但没有降低第二析晶峰温度;随着Li2O含量增加,热膨胀系数及介电损耗都出现明显的混合碱效应,曲线呈现先降低后升高的变化趋势;样品的介电常数随Li2O含量增加单调降低。

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This one mode pays close attention to network credence foundation of the businessman very much.

这一模式非常关注商人的网络信用基础。

Cell morphology of bacterial ghost of Pasteurella multocida was observed by scanning electron microscopy and inactivation ratio was estimated by CFU analysi.

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