查询词典 copper-manganese

The company was founded in 1997, known as the "Zhoushan Putuo confluence of modern anti-theft door" in 2003 changed its name to "Zhoushan Putuo days gate industry", the main anti-theft door sales of the domestic industry the three major brands, a mid-range products have many new-rich new, Gary Coull, prominent families, low-priced products into the public have is Shengda, Yungho Jiatai and so on, non-standard door Main door stainless steel industry in Guangdong, excellent stainless steel door industry products, the province produced copper door, imitation copper door, rehabilitation plastic imitation copper door panels as well as the sun does not fadelicensing luxury villa gate, the main partners are large and medium-sized real estate development company, its building blocks to create real estate products.

本公司成立于1997年，名称为"舟山普陀现代防盗门总汇"2003年更名为"舟山普陀天大门业"，主要销售国内防盗门行业中三大名牌，中价位产品有新多，富新，顾家，望族，低价位产品有众成，正盛达，永和嘉泰等，非标门主营广东精钢门业、卓越门业的不锈钢产品，本省产的铜门、仿铜门、复塑板仿铜工艺门以及嘉德福牌防晒不褪色豪华别墅大门，主要合作伙伴是大中型房产开发公司，为其打造精品楼盘添砖加瓦。

That is less copper anion in the environment. PASP has the effect of corrosion inhibition in hydrochloric acid solution. In addition the potation of cathode summit current turned negative as increasing PASP concentration, and the potential of anode summit current turned positive, it can constrain the corrosion of copper. That is to say PASP is a mixed corrosion inhibitor and can constrain the corrosion of copper surface.

循环伏安测试结果表明： PASP的加入同时抑制了铜表面的阴阳极反应，使阴极峰和阳极峰电流都减弱，说明此环境中的铜离子的含量较少，PASP对铜在盐酸中有缓蚀作用；另外阴极峰电位随着PASP添加浓度的增大而依次变负，而阳极峰电位依次变正，抑制了铜的腐蚀，说明PASP是混合型缓蚀剂，有效地阻止了铜表面的腐蚀。

However, the copper alclad bus bar rabbet pushes aside presses technical the research is in the true sense by the aluminum festival copper, is saving the copper resources the aspect to have the very vital significance.

问题补充：这是我毕业论文的摘要，我也用过网上一些在线翻译的网站，可是感觉翻译得很差劲，希望大家能翻译得准确一点，我毕业就靠它了。非常感谢！谢谢大家的帮忙！

Meanwhile, it adopts special reductor with rare earth dual DC motor to complete chain transmission and updraft processs, Due to it, insure the product's quality and produce all kinds of specifications of oxygen-free copper rod, copper bar and copper pipe and etc.

本机组可分别采用单体、双体、三体工频熔铜炉，三相平衡，节电，节能，铸杆规格，节距、速度均可在设定范围内任意调节，机组按四立柱装配，采用特种减速器稀土双排直流电机一字形分别打链传动，上引，确保产品质量并能专业生产各种不同规格无氧铜杆、铜排、铜管等。

Trench is to recycled scrap copper, copper slag, and the circuit board for soldering copper components, direct remelt casting, in which the lead can not be separated, the content is very easy to exceed 3%.

地沟铜是把回收的废铜、铜渣，以及电路板上的锡焊铜元件，直接回炉铸造，其中的铅是无法分离出来的，含量很容易超过3%。

For this,experimental study was made on a new process of potential-controlled preferential flotation in a sequency of copper,lead and zinc,which used LP-01 as collector for copper mineral,DDTC as collector for lead mineral,copper sulfate and butyl...

为此，以LP-01为铜矿物的捕收剂、乙硫氮为铅矿物的捕收剂、硫酸铜和丁黄药为锌矿物的活化剂和捕收剂、石灰为矿浆电位调整剂，并在选铜、铅时配合使用铅矿物的组合抑制剂ZnSO4+YN，对该多金属复杂硫化矿进行了电位调控铜、铅、锌依次优先浮选新工艺试验研究，获得了含铜21.74%、铜回收率62.31%的铜精矿，含铅61.23%、铅回收率55.07%的铅精矿和含锌56.43%、锌回收率90.02%的锌精矿。

These revealed that high dose copper can destroy function of erythrocytic membrane and cause oxidative stress, which may be one of the mechanisms of goat erythrocytic haematolysis induced by high dose copper. 3 High copper caused the increase of osmotic fragility of erythrocyte and AGLT50 in acor glycerine solution.

高铜导致红细胞膜超氧化物歧化酶和谷胱甘肽过氧化物酶活性降低，氧化产物丙二醛含量增多，引起红细胞抗氧化功能降低，诱发氧化胁迫，使得红细胞处于氧化应激状态，这可能是高铜致羊红细胞溶破机制之一。

After the reckoning, the copper alclad power cable and under the copper conductor electric cable performance same condition compares: May save the copper material 78%, saves raw material cost above 20%, weight saving 40%.

经过测算，铜包铝电力电缆与铜导体电缆性能相同条件下相比：可节约铜材78%，节约原材料成本20%以上，重量减轻40%。

The making of cloisonne requires elaborate processes: pure copper base-hammering in various manners, copper or gold strip inlay, enamel-filling, enamel-firing, polshing and gilding, which displays delicateness in copper-strip inlay, bright and smooth glaze, fresh and lightening color.

钓鱼台景泰蓝以紫铜做坯，制成各种造型，再用金线或铜丝掐成各种花样，中充珐琅釉，经烧制、磨光、镀金等工序制成。其制作工艺讲究，掐丝细，釉面光亮，色彩鲜艳而明亮。

The precision lapping technology to machine the copper substrate using semi-fixed abrasive plate was studied. The surface roughness and material removal rate as the evaluation of indicators, the influences of the different lapping parameters on the surface roughness and material removal rate were discussed and analyzed. Experimental results indicated that the copper substrate could be efficiently machined by semi-fixed abrasive plate of 800(superscript #) SiC abrasive, and the initial roughness Ra of a machined surface could be improved from 0.553μm to 0.28μm in 10min, produced an ideal rarely scratch surface. Then processed copper polished by diamonded grinding paste, it could be satisfied for the Ni-Pd-P alloy thin film growth.

主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底，以铜片衬底的表面粗糙度和材料去除率为评价指标，探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响结果表明：用800 SiC半固着磨具对铜片衬底进行研磨加工，10min后铜片表面粗糙度Ra可由0553μm减小到0.28μm，同时表面无深划痕：加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面。

But we don't care about Battlegrounds.

但我们并不在乎沙场中的显露。

Ah! don't mention it, the butcher's shop is a horror.

啊！不用提了。提到肉，真是糟透了。